PIC32MM0016GPL028-E/ML - 25MHz 32-bit MCU 16KB Flash QFN-28 | Microchip
部品番号: PIC32MM0016GPL028-E/ML ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $2.95 | $2.95 |
| 10 | $2.66 | $26.60 |
| 100 | $2.36 | $236.00 |
| 500 | $2.12 | $1,060.00 |
| 1,000 | $1.89 | $1,890.00 |
| 3,000 | $1.65 | $4,950.00 |
PIC32MM0016GPL028-E/ML 概要
An MCU (microcontroller) is a single-chip computer integrating a CPU core, program memory (Flash), working memory (RAM), and a rich set of peripherals (ADC, timers, communication interfaces). The PIC32MM sits in the hierarchy: 32-bit MCU -> Cortex-M/MIPS-class MCU -> microcontroller -> embedded IC -> semiconductor. The microAptiv UC core implements the MIPS32 release-2 instruction set with microMIPS code compression, achieving 79 CoreMark at 25 MHz while keeping active current in the low microamp-per-MHz range.
Key features include 16 KB Flash, 4 KB RAM, 22 GPIO, two UART, two SPI/I2S, two I2C, eight PWM outputs, two comparators with a 5-bit DAC, a 12-bit ADC with up to 12 channels (10-bit option), and a 3.3V supply domain operating from 2.0V to 3.6V. The eXtreme Low Power (XLP) modes support sleep, deep sleep, and retention states, making the device ideal for battery-powered IoT endpoints. The 28-pin QFN (6x6) package offers an exposed thermal pad for improved dissipation in continuous-active use.
The architecture combines a Harvard-style bus with peripheral DMA and a 32-bit core, allowing deterministic interrupt response and high code density via microMIPS. Integrated peripherals are mapped through the Microchip Harmony and MPLAB X ecosystems, with hardware touch, mTouch capacitive sensing, and peripheral trigger generators reducing external component count.
Typical applications include wearable health and fitness sensors, low-power wireless sensor nodes (sub-GHz or BLE co-processor hosts), battery-powered industrial sensors, remote controls, and consumer HMI panels. The XLP modes and small QFN footprint also suit always-on IoT edge devices. Designers should note that -E/ML is the extended-temperature (-40C to +125C) 28-QFN variant; identical-pin -I/SS and -E/SS variants come in 28-SSOP, and the smaller -20 QFN/SSOP variants in the same family reduce board area when 22 GPIO are not required.
ドロップイン代替品: PIC32MM0016GPL028-E/ML — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: PIC32MM0016GPL028-E/ML （同一形状・フットプリント） — 相違点: ADC, Operating Temperature, Package, Program Memory (Flash), Core.
クイック比較ツール — 並列比較する代替部品を選択:
PIC32MM0016GPL028-I/ML
✅ ドロップイン📋 参考代替品（カタログ未掲載）
PIC32MM0032GPL028-I/ML
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PIC32MM0064GPL028-I/ML
✅ ドロップイン✓ 在庫あり
$2.25 / 個
データシートを見る →PIC32MM0016GPL028-E/SO
✅ ドロップイン📋 参考代替品（カタログ未掲載）
PIC32MM0016GPL028-E/ML 最大定格＆電気的特性
| Core | MIPS32 microAptiv UC |
| Core Architecture | 32-bit RISC |
| Maximum CPU Clock | 25 MHz |
| CoreMark Score | 79 (at 25 MHz) |
| Program Memory (Flash) | 16 KB (16K x 8) |
| Data RAM | 4 KB |
| Supply Voltage (VDD) | 2.0 V to 3.6 V |
| I/O Pins | 22 |
| ADC | 12-bit, up to 12 channels (10-bit option) |
| Comparators | 2 with 5-bit DAC |
| PWM Channels | 8 |
| UART | 2 |
| SPI / I2S | 2 |
| I2C | 2 |
| Sleep Current (XLP) | 500 nA typical |
| 動作温度 | -40 C to +125 C (extended, -E suffix) |
| パッケージ | 28-pin QFN (6x6 mm) with exposed pad (ML) |
| 実装タイプ | Surface Mount |
| RoHS ステータス | Compliant |
PIC32MM0016GPL028-E/ML ピン構成
| ピン 1 | RPB0/AN0/C1IND/PGEC1 — Remappable I/O; analog input 0; comparator 1 input D; ICSP clock 1 |
| ピン 2 | RPB1/AN1/C1INC/RPGED1 — Remappable I/O; analog input 1; comparator 1 input C; ICSP data 1 |
| ピン 3 | RPB2/AN2/C1INB/C2INB — Remappable I/O; analog input 2; comparator inputs |
| ピン 4 | RPB3/AN3/C1INA/C2INA — Remappable I/O; analog input 3; comparator inputs |
| ピン 5 | VSS — Ground reference |
| ピン 6 | RPB4/AN4/C1INB/C2INB — Remappable I/O; analog input 4; comparator inputs |
| ピン 7 | RPB5/AN5/C1INA/C2INA/PGEC2 — Remappable I/O; analog input 5; comparator inputs; ICSP clock 2 |
| ピン 8 | RPB6/AN6/C1OUT/RPGED2 — Remappable I/O; analog input 6; comparator 1 output; ICSP data 2 |
| ピン 9 | RPB7/AN7/C2OUT — Remappable I/O; analog input 7; comparator 2 output |
| ピン 10 | VDD — Positive supply voltage (2.0V to 3.6V) |
| ピン 11 | VSS — Ground reference |
| ピン 12 | RPC0/VBUS — Remappable I/O; USB VBUS detect |
| ピン 13 | RPC1/VUSB3V3 — Remappable I/O; USB internal regulator output |
| ピン 14 | RPC2/RPGED3 — Remappable I/O; ICSP data 3 |
| ピン 15 | RPC3/PGEC3 — Remappable I/O; ICSP clock 3 |
| ピン 16 | RPC4/SOSCO — Remappable I/O; secondary oscillator output (32.768 kHz) |
| ピン 17 | RPC5/SOSCI — Remappable I/O; secondary oscillator input |
| ピン 18 | OSC1/CLKI/RC12 — Primary oscillator input; external clock input |
| ピン 19 | OSC2/CLKO/RC15 — Primary oscillator output; clock output |
| ピン 20 | VBAT — RTCC battery supply domain |
| ピン 21 | MCLR — Master clear / reset (active-low) |
| ピン 22 | RPA0/TMS — Remappable I/O; JTAG test mode select |
| ピン 23 | RPA1/TCK — Remappable I/O; JTAG test clock |
| ピン 24 | RPA2/SDA1/TDO — Remappable I/O; I2C1 SDA; JTAG test data out |
| ピン 25 | RPA3/SCL1/TDI — Remappable I/O; I2C1 SCL; JTAG test data in |
| ピン 26 | RPA4/RTCC — Remappable I/O; RTCC output |
| ピン 27 | RPA5/SDA2 — Remappable I/O; I2C2 SDA |
| ピン 28 | RPA6/SCL2 — Remappable I/O; I2C2 SCL |
主な用途
PIC32MM0016GPL028-E/ML の用途: 6 件s: Wearable Health and Fitness Sensors, Battery-Powered IoT Sensor Nodes, Industrial Sensor Transmitters, Consumer Remote Controls and HMI, Smart Home Edge Devices, Automotive Body and Interior Modules.
Wearable Health and Fitness Sensors
The PIC32MM0016GPL028-E/ML fits wearable health and fitness designs because its 500 nA sleep current with RTCC and 4 mA active current at 25 MHz enable years of coin-cell operation when duty-cycled. The 16 KB Flash stores BLE pairing tables and sensor-fusion code; 4 KB RAM holds short sample buffers before radio transmission. The 12-bit ADC with up to 12 channels reads heart-rate, SpO2, and temperature sensors directly, and the small 28-QFN (6x6 mm) footprint fits wristband and patch form factors with strict area budgets.
おすすめ
Battery-Powered IoT Sensor Nodes
The PIC32MM0016GPL028-E/ML is ideal for IoT sensor endpoints that wake, sample, transmit, and sleep, because its XLP modes drop current to 500 nA between transmissions while the 25 MHz microAptiv core handles protocol stacks in microMIPS. The two UART, two SPI, and two I2C interfaces host sub-GHz radios, BLE co-processors, or LoRa transceivers, and the eight PWM channels drive indicators or haptic feedback. The 2.0-3.6V supply range accepts 2xAA alkalines, single-cell Li-ion, or energy-harvested rails without level translation.
おすすめ
Industrial Sensor Transmitters
The PIC32MM0016GPL028-E/ML suits 4-20 mA loop-powered and battery-backed industrial sensors because its -40C to +125C extended temperature grade handles plant-floor thermal stress and its 12-bit ADC delivers 0.1% accuracy for pressure, flow, and level transmitters. Two comparators with a 5-bit DAC enable window-comparator fault detection, and the eight PWM channels drive H-bridges for proportional valve control. MicroMIPS code compression lets 16 KB Flash hold Modbus RTU or HART state-machine firmware with calibration tables.
おすすめ
Consumer Remote Controls and HMI
The PIC32MM0016GPL028-E/ML fits remote-control and consumer HMI designs because its 22 GPIO drive key matrices, IR LEDs, RGB indicators, and small TFT displays while the 25 MHz core runs USB HID or BLE host stacks. The eight PWM channels support motor or haptic feedback, and the two comparators detect key-press without ADC conversion, reducing wake latency. Active power below 30 mW and 500 nA sleep extend battery life past two years on two AA cells in typical remote duty cycles.
おすすめ
Smart Home Edge Devices
The PIC32MM0016GPL028-E/ML targets smart-home edge controllers such as multi-button wall switches, occupancy-aware lighting nodes, and BLE-mesh light endpoints because the small 28-QFN footprint and XLP current profile enable battery-less or energy-harvested operation. The two I2C buses handle sensor and EEPROM simultaneously, while two SPI ports drive WS2812-style LED strips via DMA or external shift registers. Microchip's Harmony framework provides TCP/IP, mTouch capacitive sensing, and FreeRTOS port templates that drop directly onto this part.
おすすめ
Automotive Body and Interior Modules
The PIC32MM0016GPL028-E/ML supports automotive body and interior modules such as seat controllers, ambient lighting, and HVAC blend-door actuators because its -40C to +125C operating range meets cabin thermal stress and its 22 GPIO read multiple switches while PWM channels drive LED strings or small motors. The extended -E temperature grade plus robust ESD and latch-up performance suit non-safety body modules. For functional-safety or powertrain applications, Microchip recommends the PIC32MK or dsPIC33 families which carry AEC-Q100 qualification.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: PIC32MM0016GPL028-E/ML — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | PIC32MM0016GPL028-I/ML | PIC32MM0032GPL028-I/ML | PIC32MM0064GPL028-I/ML |
|---|---|---|---|---|
| Package | 28-QFN (6x6 mm, ML) | 28-QFN (6x6 mm, ML) - same | 28-QFN (6x6 mm, ML) - same | 28-QFN (6x6 mm, ML) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash | 16 KB | 16 KB | 32 KB | 64 KB |
| RAM | 4 KB | 4 KB | 4 KB | 8 KB |
| Max CPU Clock | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| CoreMark Score | 79 | 79 | 79 | 79 |
| GPIO | 22 | 22 | 22 | 22 |
| Operating Temperature | -40C to +125C (extended) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) |
| Supply Voltage | 2.0V to 3.6V | 2.0V to 3.6V | 2.0V to 3.6V | 2.0V to 3.6V |
| Sleep Current | 500 nA | 500 nA | 500 nA | 500 nA |
主な差別化要因
- Best-in-class sleep current for battery-powered designs （vs PIC32MM0016GPL028-I/ML)
- Drop-in 32 KB Flash upgrade without PCB rework （vs PIC32MM0032GPL028-I/ML)
- Highest memory density in the 28-QFN family （vs PIC32MM0064GPL028-I/ML)
設計ノート
Place a 10 uF ceramic bulk capacitor directly on the VDD pin, paired with a 0.1 uF decoupling cap within 2 mm of the pin. The VDDCORE pin requires its own 10 uF + 0.1 uF pair. Source impedance below 50 milliohms at the VDD pin prevents regulator instability during sleep-to-active transitions.
The 28-QFN (6x6 mm) exposed thermal pad must be soldered to a continuous ground copper pour with at least 8 thermal vias to the inner/ground plane. Without this, theta_JA exceeds 60 C/W and the part will derate in extended-temperature applications. Estimated: at 4 mA active current and 3.3V VDD, dissipation is ~13 mW, well within 125 C operation when the pad is soldered.
Route the 25 MHz primary oscillator traces as a short differential pair within 5 mm of OSC1/OSC2, with a grounded guard ring to suppress EMI. Keep the SOSC 32.768 kHz traces short and shielded by ground pour. Place the MCLR pull-up (typically 10 kohm) close to the pin and add a 1 nF cap on MCLR if the line is exposed externally for noise immunity.
Do not enable JTAG (JTAGEN fuse) unless JTAG debugging is required, because JTAG pins override the GPIO configuration on POR. When migrating from PIC24/dsPIC33 pin-compatible devices, re-verify peripheral mapping because interrupt vector tables differ; do not assume identical PPS register maps. The ICSP programming pins (PGECx/PGEDx) must be selected as a pair - mixing PGEC2 with PGED1 fails programming silently.
コンプライアンス情報
RoHS compliant per Microchip product page; -E suffix denotes extended temperature grade (-40C to +125C). Not AEC-Q100 qualified; for AEC-Q100 automotive applications, see PIC32MK or dsPIC33 families.
