PIC32MX120F064HT-I/MR - 32-bit MCU, 64KB Flash, 40MHz, QFN-64 | Microchip
部品番号: PIC32MX120F064HT-I/MR ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $3.85 | $3.85 |
| 10 | $3.51 | $35.10 |
| 100 | $3.12 | $312.00 |
| 500 | $2.78 | $1,390.00 |
| 1,000 | $2.45 | $2,450.00 |
PIC32MX120F064HT-I/MR 概要
A PIC32MX microcontroller is a 32-bit flash MCU based on the MIPS32 M4K core. It belongs to the broader category of microcontrollers -> 32-bit MCUs -> embedded controllers -> semiconductors. PIC32MX parts combine the simplicity of the PIC ecosystem (MPLAB X IDE, Harmony framework, Peripheral Pin Select) with deterministic real-time performance, distinguishing them from Cortex-M parts which use a different ISA but overlap in target applications.
Key features include up to 50 MHz/83 DMIPS core speed, 64 KB Flash program memory, 8 KB SRAM, integrated USB 2.0 full-speed OTG/device/host, two I2S and four SPI modules for codec and serial communications, Peripheral Pin Select (PPS) for flexible pin mapping, and a Parallel Master Port (PMP) with dual buffers for graphics interfaces. The device operates from 2.3V to 3.6V and includes a 10-bit ADC and a CTMU for capacitive touch.
The PIC32MX1xx/2xx architecture integrates a hardware multiply/divide unit, single-cycle bit manipulation, and a 5-stage pipeline. The CTMU (Charge Time Measurement Unit) enables low-cost capacitive touch sensing, while PPS allows most digital peripherals to be remapped to nearly any I/O pin, simplifying PCB layout. The 64-QFN exposed pad provides low thermal resistance and a compact footprint for space-constrained designs.
Typical applications include USB peripherals (HID, CDC, mass storage), audio playback and recording using I2S codecs, low-cost graphics with PMP-driven TFTs, consumer electronics such as wearables and small appliances, and IoT edge nodes. Industrial uses include HMI panels, sensor hubs, and battery-powered instrumentation.
When designing with this device, place the exposed thermal pad on a copper pour of at least 1 square inch to meet thermal and electrical grounding requirements. Ensure proper decoupling (100 nF + 10 µF) within 5 mm of each power pin. The 'T' suffix indicates Tape & Reel packaging; the 'I' indicates the -40 °C to +85 °C industrial temperature grade. For code development, use MPLAB X IDE with the XC32 compiler and MPLAB Harmony for peripheral drivers and middleware.
This page synthesizes distributor pricing, same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.
ドロップイン代替品: PIC32MX120F064HT-I/MR — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: PIC32MX120F064HT-I/MR （同一形状・フットプリント） — 相違点: Package, ADC, Maximum CPU Speed, Operating Temperature, USB.
クイック比較ツール — 並列比較する代替部品を選択:
PIC32MX120F064H-I/MR
✅ ドロップイン✓ 在庫あり
$2.85 / 個
データシートを見る →PIC32MX120F064HT-50I/MR
✅ ドロップイン✓ 在庫あり
$3.21 / 個
データシートを見る →PIC32MX120F064HT-V/MR
✅ ドロップイン✓ 在庫あり
$2.18 / 個
データシートを見る →PIC32MX120F064H-V/MR
✅ ドロップイン✓ 在庫あり
$2.18 / 個
データシートを見る →PIC32MK1024GPK064-I/MR
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$6.2 / 個
データシートを見る →PIC32MM0256GPM064-E/MR
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$2.62 / 個
データシートを見る →PIC32MX120F064HT-I/MR 最大定格＆電気的特性
| Core | MIPS32 M4K |
| Core Size | 32-Bit |
| Maximum CPU Speed | 40 MHz (50 MHz on -50I/MR variant) |
| DMIPS | Up to 83 DMIPS |
| Program Memory (Flash) | 64 KB (64K x 8) |
| RAM | 8 KB |
| パッケージ | 64-QFN (9x9 mm) with exposed thermal pad |
| 実装タイプ | Surface Mount |
| Operating Voltage (VDD) | 2.3 V to 3.6 V |
| 動作温度 | -40 °C to +85 °C (Industrial, 'I') |
| ADC | 10-bit, 1 MSPS, up to 16 channels |
| USB | USB 2.0 Full-Speed OTG/Device/Host |
| I2S Modules | 2 |
| SPI Modules | 4 |
| Peripheral Pin Select (PPS) | Yes |
| Parallel Master Port (PMP) | Yes |
| CTMU | Yes (Capacitive Touch) |
| RoHS ステータス | Compliant |
| Lead-Free | Yes |
| AEC-Q100 Qualification | Not qualified (industrial grade) |
PIC32MX120F064HT-I/MR ピン構成
| ピン 1 | RPB0 — Remappable peripheral I/O |
| ピン 2 | RPB1 — Remappable peripheral I/O |
| ピン 3 | RPB2 — Remappable peripheral I/O |
| ピン 4 | RPB3 — Remappable peripheral I/O |
| ピン 5 | VDD — Core and I/O supply voltage |
| ピン 6 | VSS — Ground reference |
| ピン 7 | RPB4 — Remappable peripheral I/O |
| ピン 8 | RPB5 — Remappable peripheral I/O |
| ピン 9 | RPC0 — Remappable peripheral I/O |
| ピン 10 | RPC1 — Remappable peripheral I/O |
| ピン 11 | RPC2 — Remappable peripheral I/O |
| ピン 12 | RPC3 — Remappable peripheral I/O |
| ピン 13 | RPC4 — Remappable peripheral I/O |
| ピン 14 | RPC5 — Remappable peripheral I/O |
| ピン 15 | RPC6 — Remappable peripheral I/O |
| ピン 16 | RPC7 — Remappable peripheral I/O |
| ピン 17 | RPC8 — Remappable peripheral I/O |
| ピン 18 | RPC9 — Remappable peripheral I/O |
| ピン 19 | VDD — Core and I/O supply voltage |
| ピン 20 | VSS — Ground reference |
| ピン 21 | OSC1/CLKI/RC13 — Crystal oscillator input or external clock |
| ピン 22 | OSC2/CLKO/RC14 — Crystal oscillator output |
| ピン 23 | RC15 — General I/O pin |
| ピン 24 | AVDD — Analog supply voltage |
| ピン 25 | AVSS — Analog ground reference |
| ピン 26 | AN0/CVREF+/VREF+/PMA0/RPB13 — Analog input 0 / comparator Vref+ / PMP data |
| ピン 27 | AN1/CVREF-/VREF-/PMA1/RPB14 — Analog input 1 / comparator Vref- / PMP data |
| ピン 28 | AN2/PMA2/RPB15 — Analog input 2 / PMP data |
| ピン 29 | AN3/PMA3/RPD0 — Analog input 3 / PMP data |
| ピン 30 | AN4/PMA4/RPD1 — Analog input 4 / PMP data |
| ピン 31 | AN5/PMA5/RPD2 — Analog input 5 / PMP data |
| ピン 32 | AN6/PMA6/RPD3 — Analog input 6 / PMP data |
| ピン 33 | AN7/PMA7/RPD4 — Analog input 7 / PMP data |
| ピン 34 | AN8/PMA8/RPD5 — Analog input 8 / PMP data |
| ピン 35 | AN9/PMA9/RPD6 — Analog input 9 / PMP data |
| ピン 36 | AN10/PMA10/RPD7 — Analog input 10 / PMP data |
| ピン 37 | AN11/RPD8 — Analog input 11 |
| ピン 38 | AN12/RPD9 — Analog input 12 |
| ピン 39 | AN13/RPD10 — Analog input 13 |
| ピン 40 | AN14/RPD11 — Analog input 14 |
| ピン 41 | AN15/RPD12 — Analog input 15 |
| ピン 42 | VSS — Ground reference |
| ピン 43 | VDD — Core and I/O supply voltage |
| ピン 44 | D+/RGPU — USB D+ data line |
| ピン 45 | D-/RGND — USB D- data line |
| ピン 46 | VBUS — USB VBUS detect |
| ピン 47 | RPF0 — Remappable peripheral I/O |
| ピン 48 | RPF1 — Remappable peripheral I/O |
| ピン 49 | RPF2 — Remappable peripheral I/O |
| ピン 50 | RPF3 — Remappable peripheral I/O |
| ピン 51 | RPF4 — Remappable peripheral I/O |
| ピン 52 | RPF5 — Remappable peripheral I/O |
| ピン 53 | RPF6 — Remappable peripheral I/O |
| ピン 54 | RPF7 — Remappable peripheral I/O |
| ピン 55 | RPF8 — Remappable peripheral I/O |
| ピン 56 | RPG0 — Remappable peripheral I/O |
| ピン 57 | RPG1 — Remappable peripheral I/O |
| ピン 58 | RPG2 — Remappable peripheral I/O |
| ピン 59 | RPG3 — Remappable peripheral I/O |
| ピン 60 | MCLR — Master Clear reset (active low) |
| ピン 61 | VDD — Core and I/O supply voltage |
| ピン 62 | VSS — Ground reference |
| ピン 63 | RPA0 — Remappable peripheral I/O |
| ピン 64 | RPA1 — Remappable peripheral I/O |
主な用途
PIC32MX120F064HT-I/MR の用途: 6 件s: USB HID / CDC / Mass Storage Device, I2S Audio Playback / Recording, Low-Cost Graphics with PMP, Capacitive Touch User Interface, IoT Edge Sensor Node, Industrial HMI / Control Panel.
USB HID / CDC / Mass Storage Device
The PIC32MX120F064HT-I/MR integrates a USB 2.0 full-speed OTG controller, eliminating the need for an external PHY in USB peripherals. Its 40 MHz MIPS32 M4K core provides sufficient bandwidth for HID class devices such as keyboards, mice, and game controllers, while 8 KB SRAM comfortably buffers USB CDC virtual COM port streams. The 64 KB Flash can store the USB stack, class drivers, and application firmware. Designers typically allocate the D+/D- pins to USB, configure a 48 MHz clock source for the USB module, and use the MPLAB Harmony USB stack. This combination delivers ready-to-use USB functionality with no external components beyond the standard USB connector and ESD protection.
おすすめ
I2S Audio Playback / Recording
The PIC32MX120F064HT-I/MR's dual I2S modules make it well-suited for audio playback and recording applications such as MP3 players, voice memo recorders, and Bluetooth audio bridges. Each I2S module supports 16/24/32-bit audio data at common sample rates (8 kHz to 96 kHz), and DMA channels keep CPU utilization low during streaming. With 64 KB Flash, designers can fit lightweight audio codecs like ADPCM or HELIX MP3 decoding without external memory. The CTMU can also be used for microphone pre-amplifier biasing. For higher-quality audio, pair with an external DAC such as the PCM5101A or use the PWM outputs as a Class-D modulator.
おすすめ
Low-Cost Graphics with PMP
The PIC32MX120F064HT-I/MR's Parallel Master Port (PMP) with dual read/write buffers enables direct connection to small TFT displays, OLED panels, and graphic LCDs without an external graphics controller. The PMP supports 8-bit and 16-bit data buses and handles chip-select timing automatically, simplifying driver code. With 64 KB Flash and 8 KB SRAM, the MCU can host a lightweight framebuffer or directly stream pixel data to the display. Typical applications include appliance control panels, e-paper signs, and small industrial HMIs up to 320x240 resolution. For larger displays, consider the PIC32MX230/250 family with more RAM.
おすすめ
Capacitive Touch User Interface
The PIC32MX120F064HT-I/MR integrates the CTMU (Charge Time Measurement Unit), which works with the ADC to implement reliable capacitive touch buttons, sliders, and proximity sensors without external ICs. By measuring the time constant of an RC circuit that includes the touch electrode, the CTMU can detect capacitance changes as low as femtofarads, enabling touch detection through glass or plastic overlays. This eliminates mechanical buttons and reduces BOM cost in appliances, toys, and consumer electronics. Designers can implement up to 16 touch channels with the on-chip ADC and configure scan sequences via the PPS-mappable I/O.
おすすめ
IoT Edge Sensor Node
The PIC32MX120F064HT-I/MR provides enough performance for low-power IoT edge nodes that aggregate sensor data, run simple inference, and connect to a host via USB or UART. The 64 KB Flash can host application firmware plus an MQTT/HTTP client, while 8 KB SRAM is sufficient for buffer management and small protocol stacks. With Peripheral Pin Select, the same I/O can serve either SPI sensors, I2C devices, or UART modems depending on the design's needs. For battery-powered deployments, the PIC32MM0256GPM064 variant offers significantly lower sleep current while preserving pin compatibility. A typical design pairs the MCU with a sensor board, a LoRa/BLE module, and a small Li-ion battery.
おすすめ
Industrial HMI / Control Panel
The PIC32MX120F064HT-I/MR's industrial temperature grade (-40 °C to +85 °C) and wide 2.3 V to 3.6 V supply range make it suitable for industrial HMI panels and small control applications. The 10-bit ADC supports analog sensor inputs, while the integrated USB simplifies field firmware updates via a service port. The Parallel Master Port can drive a small TFT, and the PPS allows designers to remap peripherals to any I/O, simplifying PCB routing in dense panels. For designs that must survive harsh environments, the PIC32MX120F064HT-V/MR variant extends temperature to +105 °C. The 64-QFN package's exposed thermal pad ensures robust thermal performance in sealed enclosures.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: PIC32MX120F064HT-I/MR — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | PIC32MX120F064H-I/MR | PIC32MX120F064HT-50I/MR | PIC32MX120F064HT-V/MR | PIC32MK1024GPK064-I/MR | PIC32MM0256GPM064-E/MR |
|---|---|---|---|---|---|---|
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN - same family | 64-QFN (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Speed | 40 MHz / 66 DMIPS | 40 MHz / 66 DMIPS | 50 MHz / 83 DMIPS | 40 MHz / 66 DMIPS | 120 MHz / 150 DMIPS | 25 MHz / 32 DMIPS |
| Flash | 64 KB | 64 KB | 64 KB | 64 KB | 1 MB | 256 KB |
| RAM | 8 KB | 8 KB | 8 KB | 8 KB | 128 KB | 32 KB |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +105C (Automotive) | -40C to +85C (Industrial) | -40C to +125C (Extended) |
| USB | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG + HS | USB 2.0 FS Device only |
主な差別化要因
- Integrated USB 2.0 full-speed OTG without external PHY （vs STM32F030F4P6 (Cortex-M0 alternative without USB))
- Same-package 50 MHz speed upgrade available （vs PIC32MX120F064HT-50I/MR (50 MHz variant))
- Dual I2S audio support with DMA （vs PIC32MM0256GPM064 (low-power PIC32MM family))
- CTMU capacitive touch with no external ICs （vs External capacitive touch controller (e.g., FDC1004))
設計ノート
The 64-QFN package has an exposed thermal pad on the underside that MUST be soldered to a ground copper pour for both thermal dissipation and electrical grounding. Recommended minimum thermal pad area is 1 square inch of 1 oz copper. Place a 100 nF decoupling capacitor within 5 mm of each VDD pin and a bulk 10 µF tantalum or ceramic capacitor on the supply rail near the IC. A separate 100 nF on AVDD is recommended if ADC accuracy matters.
The MCLR pin is mandatory - even if no external reset circuit is used, MCLR must be pulled high via a 10 kΩ resistor to VDD, with a 100 nF capacitor to ground for noise immunity. Forgetting to populate MCLR can result in intermittent or failed startups. Also, the USB module requires a 48 MHz clock source for proper full-speed USB operation - configure the PLL accordingly or use a 48 MHz external oscillator if the internal 8 MHz + PLL chain cannot meet USB jitter requirements.
Use Peripheral Pin Select (PPS) to route digital peripherals (SPI, UART, I2C, I2S, PWM) to the most convenient physical pins, simplifying PCB layout. Avoid placing noisy switching regulators or high-current traces near the crystal oscillator traces (OSC1/OSC2). Keep analog input traces short and guarded to ground, especially when using the CTMU for capacitive touch - capacitive touch traces must be well-shielded to prevent false triggers.
Estimated: at full USB load with 40 MHz CPU clock, the PIC32MX120F064HT-I/MR typically consumes 60-80 mA from VDD. The 64-QFN junction-to-ambient thermal resistance (θJA) is approximately 24 °C/W with a properly soldered exposed thermal pad on the recommended 1 sq in copper pour. At 3.3 V × 70 mA = 230 mW, the junction temperature rise is roughly 5.5 °C, well within the -40 °C to +85 °C industrial range.
コンプライアンス情報
RoHS compliant per Microchip product page. Not AEC-Q100 qualified - choose -V variants for automotive. Industrial temperature grade -40C to +85C. Halogen-free status not explicitly stated in available data.
