PIC32MX250F256HT-I/MR - 32-bit MCU 256KB Flash USB | Microchip
部品番号: PIC32MX250F256HT-I/MR ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $5.65 | $5.65 |
| 10 | $5.1 | $51.00 |
| 100 | $4.45 | $445.00 |
| 500 | $3.85 | $1,925.00 |
| 1,000 | $3.35 | $3,350.00 |
PIC32MX250F256HT-I/MR 概要
A 32-bit microcontroller (MCU) is a programmable processor integrating CPU core, Flash program memory, SRAM data memory, and peripherals on a single silicon die. The PIC32MX family uses the MIPS32 M4K architecture, which sits in the 32-bit MCU taxonomy between 8/16-bit legacy MCUs and higher-end Cortex-M parts. It targets cost-sensitive applications that need deterministic real-time response plus more headroom than 8-bit parts allow.
Key features include 256 KB self-programmable Flash, 32 KB SRAM, 16-channel 10-bit ADC at up to 1 Msps, two I2S and four SPI modules for codec and serial communications, peripheral pin select (PPS), parallel master port (PMP) for graphics interfaces, USB 2.0 Full-Speed device/host/OTG, three analog comparators, RTCC, and CTMU for capacitive touch sensing. The 64-pin QFN package exposes a generous number of remappable I/O and supports both 3.3 V single-supply and dual-rail analog/digital operation.
Technically, the PIC32MX250 executes most instructions in a single cycle and integrates dedicated DMA, a hardware math accelerator for integer DSP, and a flexible clock tree with 8 MHz internal RC plus PLL to reach 50 MHz. PPS allows remapping of digital peripherals to most I/O pins, which simplifies PCB layout. The CTMU provides sub-nanoamp charge-time measurement for capacitive touch, while the PMP module interfaces directly to graphics controllers and parallel memories.
Typical applications include USB peripherals (HID, CDC, audio, mass storage), audio interfaces (I2S codecs), embedded graphics with PMP, capacitive touch human-machine interfaces (HMIs) using CTMU, and industrial control/IoT nodes that need USB connectivity without stepping up to a Cortex-M4 part. Industrial customers pick it for predictable MIPS per cent and for mature MPLAB XC32 toolchain integration.
Design tip: provide a solid 3.3 V decoupling network (1 µF + 0.1 µF near VDD) and keep USB DP/DM traces 90 ohm differential matched with a common-mode choke to pass USB compliance. The Vbus/Vusb pin must see a clean 5 V tolerant supply or be tied off via internal regulator configuration per the datasheet.
This page synthesizes distributor pricing, drop-in alternatives drawn from the PIC32MX1XX/2XX family, and practical design notes not found in the manufacturer datasheet alone.
ドロップイン代替品: PIC32MX250F256HT-I/MR — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: PIC32MX250F256HT-I/MR （同一形状・フットプリント） — 相違点: Package, ADC, Operating Temperature, Timers, SRAM.
クイック比較ツール — 並列比較する代替部品を選択:
PIC32MX230F256H-I/MR
✅ ドロップイン📋 参考代替品（カタログ未掲載）
PIC32MX270F256H-I/MR
✅ ドロップイン📋 参考代替品（カタログ未掲載）
PIC32MX150F256HT-I/MR
✅ ドロップイン✓ 在庫あり
$5.45 / 個
データシートを見る →PIC32MX130F256H-I/MR
✅ ドロップイン📋 参考代替品（カタログ未掲載）
PIC32MX170F256H-I/MR
✅ ドロップイン📋 参考代替品（カタログ未掲載）
PIC32MX250F256H-50I/MR
✅ ドロップイン✓ 在庫あり
$3.05 / 個
データシートを見る →PIC32MX250F256HT-I/MR 最大定格＆電気的特性
| Core | MIPS32 M4K |
| Architecture | 32-bit RISC |
| Maximum CPU Speed | 50 MHz / 83 DMIPS |
| Operating Voltage Range | 2.3 V to 3.6 V |
| Program Memory (Flash) | 256 KB (256K x 8) |
| Data Memory (SRAM) | 32 KB |
| パッケージ | 64-QFN (9x9 mm) |
| 実装タイプ | Surface Mount |
| 動作温度 | -40 °C to +85 °C (Industrial) |
| ADC | 10-bit, 16-channel, up to 1 Msps |
| Comparators | 3 analog comparators |
| USB | USB 2.0 Full-Speed Device/Host/OTG |
| SPI Modules | 4 |
| I2S Modules | 2 |
| I2C Modules | 2 |
| UART Modules | 2 |
| PMP (Parallel Master Port) | Yes (graphics/memory) |
| CTMU | Yes (capacitive touch) |
| RTCC | Yes (Real-Time Clock/Calendar) |
| Peripheral Pin Select (PPS) | Yes |
| RoHS ステータス | Compliant |
| Lead-Free | Yes |
PIC32MX250F256HT-I/MR ピン構成
| ピン 1 | RB15 — GPIO/Peripheral pin select |
| ピン 2 | VSS — Ground |
| ピン 3 | VDD — I/O supply (3.3 V) |
| ピン 4 | RB14 — GPIO/Peripheral pin select |
| ピン 5 | RB13 — GPIO/Peripheral pin select |
| ピン 6 | RB12 — GPIO/Peripheral pin select |
| ピン 7 | RB11 — GPIO/Peripheral pin select |
| ピン 8 | RB10 — GPIO/Peripheral pin select |
| ピン 9 | RB9 — GPIO/Peripheral pin select |
| ピン 10 | RB8 — GPIO/Peripheral pin select |
| ピン 11 | RB7 — GPIO/Peripheral pin select |
| ピン 12 | RB6 — GPIO/Peripheral pin select (ICDCLK) |
| ピン 13 | RB5 — GPIO/Peripheral pin select (ICDDAT) |
| ピン 14 | RB4 — GPIO/Peripheral pin select |
| ピン 15 | RB3 — GPIO/Peripheral pin select |
| ピン 16 | RB2 — GPIO/Peripheral pin select |
| ピン 17 | RB1 — GPIO/Peripheral pin select |
| ピン 18 | RB0 — GPIO/Peripheral pin select |
| ピン 19 | AVDD — Analog supply (3.3 V) |
| ピン 20 | AVSS — Analog ground |
| ピン 21 | RA0 — GPIO/Analog input |
| ピン 22 | RA1 — GPIO/Analog input |
| ピン 23 | RA2 — GPIO/Analog input |
| ピン 24 | RA3 — GPIO/Analog input |
| ピン 25 | RA4 — GPIO/Analog input |
| ピン 26 | RA5 — GPIO/Analog input |
| ピン 27 | RA6 — GPIO/Analog input |
| ピン 28 | RA7 — GPIO/Analog input |
| ピン 29 | RA8 — GPIO |
| ピン 30 | RA9 — GPIO |
| ピン 31 | RA10 — GPIO |
| ピン 32 | RC0 — GPIO |
| ピン 33 | RC1 — GPIO |
| ピン 34 | RC2 — GPIO |
| ピン 35 | RC3 — GPIO |
| ピン 36 | RC4 — GPIO |
| ピン 37 | RC5 — GPIO |
| ピン 38 | RC6 — GPIO |
| ピン 39 | RC7 — GPIO |
| ピン 40 | RC8 — GPIO |
| ピン 41 | RC9 — GPIO |
| ピン 42 | D+ — USB D+ data line |
| ピン 43 | D- — USB D- data line |
| ピン 44 | VUSB — USB transceiver supply (3.3 V) |
| ピン 45 | VDD — Core supply (3.3 V) |
| ピン 46 | VSS — Ground |
| ピン 47 | OSC1 — Crystal oscillator input |
| ピン 48 | OSC2 — Crystal oscillator output |
| ピン 49 | RD0 — GPIO/PMP data |
| ピン 50 | RD1 — GPIO/PMP data |
| ピン 51 | RD2 — GPIO/PMP data |
| ピン 52 | RD3 — GPIO/PMP data |
| ピン 53 | RD4 — GPIO/PMP data |
| ピン 54 | RD5 — GPIO/PMP data |
| ピン 55 | RD6 — GPIO/PMP data |
| ピン 56 | RD7 — GPIO/PMP data |
| ピン 57 | RD8 — GPIO/PMP data |
| ピン 58 | RD9 — GPIO/PMP data |
| ピン 59 | RD10 — GPIO/PMP data |
| ピン 60 | RD11 — GPIO/PMP data |
| ピン 61 | MCLR — Master clear (reset, active low) |
| ピン 62 | PGEC1 — ICSP programming clock |
| ピン 63 | PGED1 — ICSP programming data |
| ピン 64 | EPAD — Exposed thermal pad (connect to VSS) |
主な用途
PIC32MX250F256HT-I/MR の用途: 7 件s: USB Audio Devices, Capacitive Touch HMIs, Industrial Control Nodes, Embedded Graphics Interfaces, USB Mass Storage / HID Devices, IoT Sensor Gateway Nodes, Educational / Hobbyist Development.
USB Audio Devices
The PIC32MX250F256HT-I/MR fits USB audio because it integrates USB 2.0 Full-Speed OTG plus two I2S interfaces on the same die. With a 50 MHz MIPS M4K core, the MCU handles 16-bit/48 kHz stereo USB audio streams while leaving cycles for HID controls or DSP effects. Place the part between the USB connector and the I2S codec, with the on-chip CTMU optionally handling playback buttons. Versus a Cortex-M0 + external USB transceiver, this part saves board area and BOM cost while keeping the MPLAB XC32 toolchain. Trade-off: Full-Speed USB tops out at 12 Mbps, so high-resolution asynchronous USB audio designs need the MX270 upgrade.
おすすめ
Capacitive Touch HMIs
The PIC32MX250F256HT-I/MR's CTMU enables sub-nanoamp charge-time measurement for capacitive buttons, sliders, and proximity sensors. With 256 KB Flash and 32 KB SRAM, the MCU supports a touch library plus a small UI without external memory. Place each touch electrode on a dedicated ADC-capable pin with the on-chip CTMU current source handling timing measurement autonomously. Versus an external touch controller, integrating CTMU reduces BOM and simplifies layout while keeping the MIPS core free for a 50 MHz UI update loop. Trade-off: CTMU supports up to 16 channels, so designs with more pads need a multiplexer.
おすすめ
Industrial Control Nodes
The PIC32MX250F256HT-I/MR suits industrial control nodes because it operates from -40 °C to +85 °C with USB for commissioning and a 16-channel 10-bit ADC for analog sensor reads. The 50 MHz core handles deterministic control loops (RTCC + DMA offload), while PPS remaps peripherals to clean up PCB routing. Place the part between field sensors and the USB host, with the RTCC timestamping events. Versus an 8-bit PIC16, this part gives deterministic 32-bit math for PID loops at similar cost. Trade-off: only 10-bit ADC, so high-precision measurement needs an external SAR.
おすすめ
Embedded Graphics Interfaces
The PIC32MX250F256HT-I/MR's Parallel Master Port (PMP) directly drives small TFT/LCD controllers without an external bridge, while the 50 MHz core handles pixel refresh. With 256 KB Flash and 32 KB SRAM, the MCU holds framebuffers plus a graphical UI library in on-chip memory, removing the need for an external SRAM. Place PMP data/control lines on the 64-QFN's high-pin-count ports, with USB used for firmware updates. Versus a SPI-only display upgrade, PMP unlocks faster parallel graphics at similar cost. Trade-off: PMP consumes many I/O, so simultaneous USB + graphics requires careful PPS remapping.
おすすめ
USB Mass Storage / HID Devices
The PIC32MX250F256HT-I/MR's USB Full-Speed OTG controller implements Mass Storage, HID, CDC, and DFU classes on-chip, eliminating the need for an external USB peripheral. With 256 KB Flash, the MCU holds a USB stack plus an MSC bootloader, and the 50 MHz core keeps enumeration latency under 100 ms. Place the part on the USB bus with the on-chip transceiver connected to DP/DM with a 90 ohm differential pair. Versus an external FTDI bridge, this part eliminates $1+ of BOM cost and enables custom device classes. Trade-off: Full-Speed tops out at 12 Mbps, so high-throughput storage needs High-Speed.
おすすめ
IoT Sensor Gateway Nodes
The PIC32MX250F256HT-I/MR suits IoT sensor gateways because it combines USB for host connectivity, 16-channel 10-bit ADC for analog sensing, and a 50 MHz MIPS core for local preprocessing. The CTMU handles proximity triggers, while I2S supports microphone arrays for voice-triggered IoT. Place the part between the USB host port and sensor arrays, with the RTCC timestamping events to flash. Versus an 8-bit PIC, this part delivers 32-bit deterministic math at a similar price. Trade-off: no on-chip radio, so wireless IoT needs an external module (Wi-Fi, LoRa, BLE).
おすすめ
Educational / Hobbyist Development
The PIC32MX250F256HT-I/MR is a strong fit for hobbyist and educational use because of its USB on-chip, generous 256 KB Flash for tutorials and libraries, plus mature MPLAB XC32 toolchain support. At 50 MHz/83 DMIPS, beginners can experiment with USB stacks, audio I2S, capacitive touch, and PMP graphics from a single part. Place the part on a breadboard-friendly carrier such as the PIC32MX1/2 Starter Kit. Versus Arduino-class Cortex-M0 parts, this PIC32 adds USB OTG and PMP for the same BOM cost. Trade-off: MIPS architecture is less common than ARM in education, so learning resources lean on Microchip-specific docs.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: PIC32MX250F256HT-I/MR — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | PIC32MX230F256H-I/MR | PIC32MX270F256H-I/MR | PIC32MX150F256HT-I/MR | PIC32MX130F256H-I/MR | PIC32MX170F256H-I/MR |
|---|---|---|---|---|---|---|
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same |
| Flash | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| SRAM | 32 KB | 16 KB | 64 KB | 32 KB | 16 KB | 32 KB |
| Max CPU Speed | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 40 MHz | 50 MHz |
| USB | USB 2.0 Full-Speed OTG | USB 2.0 Full-Speed OTG | USB 2.0 High-Speed | None | None | None |
| I2S Modules | 2 | 0 | 0 | 0 | 0 | 0 |
| CTMU (Capacitive Touch) | Yes | Yes | Yes | No | No | No |
| Operating Temperature | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C |
主な差別化要因
- Combines USB OTG + I2S audio on the same die （vs PIC32MX230F256H-I/MR)
- Higher CPU clock vs MX130 family （vs PIC32MX130F256H-I/MR)
- Includes CTMU capacitive touch peripheral （vs PIC32MX150F256HT-I/MR)
- Balanced Flash/SRAM ratio vs higher-tier MX270 （vs PIC32MX270F256H-I/MR)
設計ノート
Estimated: the PIC32MX250F256HT-I/MR draws approximately 30-80 mA active at 50 MHz with USB and I/O toggling, plus up to 25 mA peak from the USB Full-Speed transceiver when driving DP/DM. Place a 10 µF bulk capacitor + 0.1 µF decoupling capacitor on each VDD pin (1, 45) and on AVDD (19). The VUSB pin (44) needs its own 0.1 µF + 4.7 µF network if powering the USB transceiver from internal 3.3 V regulator. USB suspend current (when implementing USB) must stay below 2.5 mA per the USB 2.0 spec - the datasheet discusses the on-chip regulator's suspend mode.
Keep USB DP/DM (pins 42, 43) as a 90 ohm differential pair with characteristic impedance matched to 90 ohms ±10%. Place the common-mode choke close to the connector and keep the trace length under 50 mm total. MCLR (pin 61) needs a 10 kohm pull-up to VDD with a 100 nF cap to ground for clean reset. Exposed pad (EPAD, pin 64) MUST be soldered to a VSS copper pour for thermal dissipation - skipping the EPAD solder connection risks overheating at high CPU loads.
Common PIC32MX250 pitfalls: (1) configure the JTAG/ICSP pins PGEC1/PGED1 (62, 63) as analog-disabled before using them as GPIO or peripherals; (2) the internal 8 MHz RC may not deliver 50 MHz - configure the PLL correctly per datasheet section 32; (3) PMP data pins RD0-RD11 conflict with JTAG pins - enable/disable JTAG with the appropriate config bit; (4) USB Vbus sensing (via VUSB pin 44) requires proper configuration to avoid latch-up; (5) the RTCC requires a 32.768 kHz crystal or external clock source on SOSC pins - it will not run from the internal RC.
For USB Full-Speed, the DP/DM pair must have controlled 90 ohm differential impedance with no stubs. Use a USB 2.0 compliant connector with ESD protection (e.g., USBLC6-2SC6) close to the connector body. For I2S audio interfaces, keep the I2S BCLK and LRCLK traces short and matched to avoid jitter-induced sample misalignment. The PMP interface to graphics controllers benefits from series damping resistors (22-33 ohm) on data/control lines.
Estimated: at full 50 MHz CPU load with USB active, the PIC32MX250F256HT-I/MR dissipates approximately 200-300 mW in the 64-QFN package. With the EPAD properly soldered to a VSS copper pour of at least 1 square inch, the junction-to-ambient thermal resistance (θ_JA) is typically 28 C/W, keeping the junction rise below 10 °C. Without the EPAD connection, θ_JA rises dramatically and thermal shutdown may occur at high ambient temperatures.
コンプライアンス情報
RoHS and lead-free compliant per Microchip product page. Industrial temperature grade (-40 to +85 °C) but not AEC-Q100 qualified for this MPN; AEC-Q100 qualified variants exist in the PIC32MX family but require different part numbers. Per Microchip policy, halogen-free status is declared for the PIC32MX1XX/2XX family.
