PIC32MX370F512L-V/PF - 32-bit MCU, 512KB Flash, USB, TQFP-100 | Microchip
部品番号: PIC32MX370F512L-V/PF ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $8.95 | $8.95 |
| 10 | $8.05 | $80.50 |
| 100 | $7.15 | $715.00 |
| 500 | $6.45 | $3,225.00 |
| 1,000 | $5.85 | $5,850.00 |
PIC32MX370F512L-V/PF 概要
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (SRAM), and a range of peripheral interfaces (timers, ADC, communication controllers, GPIO) into one package. Within the broader semiconductor taxonomy, an MCU belongs to the family of microcontrollers and embedded processors. The PIC32MX3xx/4xx family specifically combines 32-bit MIPS performance with peripheral integration optimized for human-machine interface (HMI), audio, graphics, and USB-connected designs.
Key features of this part include two SPI/I2S ports, two I2C ports, two UART ports, a 10-bit 1 MSPS ADC with up to 28 analog channels, two analog comparators, five 16-bit timers/counters, a Parallel Master Port (PMP), and a 4-wire resistive touch controller via the CTMU peripheral. The device supports MIPS16e code compression for up to 40% smaller code size and offers multiple low-power modes (Idle, Sleep) ideal for battery-aware designs.
The architecture pairs a single-cycle hardware MAC 32x16 multiply unit with a deterministic interrupt controller featuring individually programmable priorities and a Fail-Safe Clock Monitor. Memory is mapped uniformly with 12 KB boot Flash, configurable prefetch module, and 128 KB SRAM shared between code and data space. JTAG and two-wire programming/debug interfaces support MPLAB X IDE and ICD tools end to end.
Typical applications include automotive infotainment and HMI panels, USB HID peripherals and composite devices, audio processing front-ends (using the integrated I2S interfaces), industrial control with capacitive touch, and low-cost graphics TFT driver boards. The AEC-Q100 qualification makes it suitable for dashboard clusters and body-control modules.
When selecting this part, ensure the 100-pin TQFP land pattern matches your PCB footprint and that your firmware targets the PIC32MX3xx/4xx HAL. Decoupling requires a 0.1 uF ceramic close to each VDD/VSS pair plus a bulk 10 uF near the regulator. The USB peripheral requires the standard 48 MHz clock accuracy and proper PCB-controlled-impedance routing per the USB 2.0 specification.
This page synthesizes distributor pricing, drop-in alternatives, application notes, and design considerations not consolidated on the manufacturer datasheet, providing practical sourcing and engineering context beyond the device summary.
ドロップイン代替品: PIC32MX370F512L-V/PF — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: PIC32MX370F512L-V/PF （同一形状・フットプリント） — 相違点: ADC, Package, Core Architecture, Parallel Master Port (PMP), Operating Temperature Range.
クイック比較ツール — 並列比較する代替部品を選択:
PIC32MX370F512L-I/PF
✅ ドロップイン📋 参考代替品（カタログ未掲載）
PIC32MX370F512LT-V/PF
✅ ドロップイン📋 参考代替品（カタログ未掲載）
PIC32MX470F512L-V/PF
✅ ドロップイン📋 参考代替品（カタログ未掲載）
PIC32MX270F512L-V/PF
✅ ドロップイン✓ 在庫あり
$5.1 / 個
データシートを見る →PIC32MX170F512L-V/PF
✅ ドロップイン✓ 在庫あり
$5.85 / 個
データシートを見る →PIC32MX370F512L-V/PF 最大定格＆電気的特性
| Core Architecture | MIPS32 M4K |
| Core Width | 32-bit |
| Maximum Clock Speed | 120 MHz (up to 150 DMIPS) |
| Program Memory (Flash) | 512 KB (512K x 8) |
| SRAM | 128 KB |
| Boot Flash | 12 KB |
| Supply Voltage Range | 2.3 V to 3.6 V |
| 動作温度範囲 | -40C to +105C (V grade) |
| パッケージ | 100-pin TQFP (14x14 mm) |
| ADC | 10-bit, 1 MSPS, up to 28 channels |
| Analog Comparators | 2 |
| SPI/I2S | 2 |
| I2C | 2 |
| UART | 2 |
| USB | USB 2.0 Full-Speed OTG |
| Timers | 5 x 16-bit |
| Parallel Master Port (PMP) | Yes |
| Touch (CTMU) | Yes |
| Code Compression | MIPS16e (up to 40% smaller code) |
| AEC-Q100 | Qualified |
| RoHS | Compliant |
| 実装タイプ | Surface Mount |
| MSL | 3 |
PIC32MX370F512L-V/PF 100-pin tqfp (14x14 mm) ピン配置ガイド
PIC32MX370F512L-V/PF (100-pin tqfp (14x14 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: PIC32MX370F512L-V/PF.
詳細は データシート をご参照ください。
主な用途
PIC32MX370F512L-V/PF の用途: 6 件s: Automotive Infotainment HMI Panel, USB HID / Composite Device, Audio Processing Front-End, Industrial Control with Capacitive Touch, Low-Cost Graphics TFT Driver Board, Body Control Module (Automotive BCM).
Automotive Infotainment HMI Panel
The PIC32MX370F512L-V/PF is well suited for automotive infotainment HMI panels thanks to its 120 MHz MIPS32 M4K core, 100-pin TQFP, AEC-Q100 qualification, and integrated Parallel Master Port for driving TFT LCDs directly. With 512 KB Flash and 128 KB SRAM it comfortably holds graphics assets, font tables, and the MPLAB Harmony graphics library. The 2x I2S interfaces support external audio DACs for premium in-cabin audio. Compared with a Cortex-M0+ solution, the 32-bit MIPS core executes GUI state machines 2-3x faster at the same MHz, improving touch responsiveness and animation smoothness.
おすすめ
USB HID / Composite Device
The PIC32MX370F512L-V/PF integrates a USB 2.0 Full-Speed OTG controller with on-chip transceiver, eliminating external PHY cost. Its 120 MHz MIPS core plus 128 KB SRAM executes the Microchip USB stack (HID, CDC, MSD, composite) at full USB FS throughput without timing bottlenecks. Per the Microchip datasheet, the device supports Host, Device, and OTG roles, enabling USB event-based designs. Compared with software-bit-banged USB on smaller MCUs, the integrated controller achieves deterministic latency and frees CPU cycles for the application task, making it ideal for USB keyboard/joystick/gamepad products.
おすすめ
Audio Processing Front-End
The PIC32MX370F512L-V/PF provides two dedicated SPI/I2S interfaces that connect directly to audio codecs (e.g., DACs and ADCs) without glue logic. Its 120 MHz core and MIPS16e instruction set can run lightweight DSP algorithms (EQ, mixing, dynamic range compression) while the I2S ports stream 16/24-bit audio at 48 kHz. The 128 KB SRAM provides comfortable buffering for 10-20 ms of audio at typical frame sizes. Compared with a Cortex-M0 solution, the MIPS M4K core offers higher DMIPS/MHz, enabling more sophisticated audio processing at lower power.
おすすめ
Industrial Control with Capacitive Touch
The PIC32MX370F512L-V/PF integrates the CTMU (Charge Time Measurement Unit) peripheral that implements 4-wire resistive and capacitive touch sensing without an external touch controller IC. Combined with 512 KB Flash for touch firmware plus the 28-channel 10-bit ADC, the MCU can scan 10-20 touch keys/electrodes in real time. Per the Microchip datasheet, the CTMU is supported by the MPLAB Harmony Touch library. Compared with discrete touch controllers, the integrated approach saves $1-2 per node in industrial control panels and reduces PCB area.
おすすめ
Low-Cost Graphics TFT Driver Board
The PIC32MX370F512L-V/PF drives small TFT displays (3.5 inch to 5 inch QVGA/WQVGA) via its integrated Parallel Master Port (PMP) at 8/16-bit widths. The 120 MHz core and 128 KB SRAM are sufficient for framebuffer-less rendering of icons, fonts, and simple animations. Per Microchip documentation, the PMP supports up to 8 MP/s sustained throughput, adequate for mid-sized TFTs. Compared with external display controllers, the integrated PMP eliminates $2-3 of BOM cost and simplifies the schematic.
おすすめ
Body Control Module (Automotive BCM)
The PIC32MX370F512L-V/PF is AEC-Q100 qualified and runs from -40C to +105C, fitting body control modules managing lighting, wipers, locks, and mirror actuators. Its 2x UART and 2x I2C interfaces support LIN-bus transceivers, switches, and sensor modules. The 512 KB Flash holds the full BCM application plus bootloader; 128 KB SRAM supports real-time event scheduling. Compared with discrete 8/16-bit BCM solutions, the 32-bit MIPS core consolidates multiple functions onto one MCU, reducing BOM cost by $1-2.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: PIC32MX370F512L-V/PF — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | PIC32MX370F512L-I/PF | PIC32MX370F512LT-V/PF | PIC32MX470F512L-V/PF | PIC32MX270F512L-V/PF | PIC32MX170F512L-V/PF |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | TQFP-100 (14x14) | TQFP-100 (14x14) - same | TQFP-100 (14x14) - same | TQFP-100 (14x14) - same | TQFP-100 (14x14) - same | TQFP-100 (14x14) - same |
| Core / Max Clock | MIPS32 M4K / 120 MHz | MIPS32 M4K / 120 MHz | MIPS32 M4K / 120 MHz | MIPS32 M4K / 120 MHz | MIPS32 M4K / 120 MHz | MIPS32 M4K / 120 MHz |
| Flash | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| SRAM | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB |
| USB | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG |
| Temperature Grade | V (-40C to +105C) | I (-40C to +85C) | V (-40C to +105C) | V (-40C to +105C) | V (-40C to +105C) | V (-40C to +105C) |
| AEC-Q100 | Qualified | Qualified | Qualified | Qualified | Qualified | Qualified |
主な差別化要因
- AEC-Q100 V temperature grade for automotive use （vs PIC32MX370F512L-I/PF)
- Tray packaging for prototyping and low-volume production （vs PIC32MX370F512LT-V/PF)
- MX370 family balances performance and peripheral count vs higher-end MX470 （vs PIC32MX470F512L-V/PF)
設計ノート
Estimated: the PIC32MX370F512L-V/PF draws approximately 25 mA active at 120 MHz with all peripherals on and 8 mA in Sleep mode per the family datasheet. Decouple each VDD/VSS pair with 0.1 uF X7R ceramic placed within 5 mm of the pin, plus a 10 uF bulk near the regulator. Use a low-noise LDO such as the MCP1700 for the analog AVDD rail to maximize ADC SNR.
Route the USB D+ and D- traces as a 90-ohm differential pair with continuous reference ground plane underneath, per the USB 2.0 specification. Keep total D+/D- trace length under 50 mm and avoid splitting the ground plane beneath them. Place the USB connector shield-to-ground capacitors (4.7 uF to 10 uF) close to the connector body for ESD mitigation.
Estimated: at 120 MHz and full peripheral utilization, the TQFP-100 package dissipates approximately 1 W worst-case. With a theta_JA of approximately 50 C/W on a 4-layer JEDEC test board, this yields a 50C junction temperature rise above ambient. In enclosed automotive enclosures, derate accordingly or add a thermal copper pour (at least 1 sq inch) on the top side connected to the thermal pad area.
Do not skip the 12 KB boot Flash configuration words or the PLL setup - the device will not boot without correct FPLLMULT/FPLLODIV values. Ensure VUSB pin is supplied (typically 3.3 V from regulator) even if USB is unused, per the family datasheet. Use the Open-Drain configuration on I2C lines with 4.7 kohm pull-ups to 3.3 V; 5V pull-ups exceed absolute maximum ratings on the I/O cells.
コンプライアンス情報
AEC-Q100 qualified per Microchip PIC32MX370 product page and family datasheet DS60001185. RoHS and REACH compliance confirmed by Microchip product environmental documentation. Lead-free and halogen-free per Microchip packaging specifications.
