PIC32MZ1024EFE144-E/JWX - 32-bit 180MHz MCU, 1MB Flash | Microchip
部品番号: PIC32MZ1024EFE144-E/JWX ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $18.92 | $18.92 |
| 10 | $17.25 | $172.50 |
| 100 | $15.1 | $1,510.00 |
| 250 | $14.05 | $3,512.50 |
| 500 | $13.4 | $6,700.00 |
PIC32MZ1024EFE144-E/JWX 概要
A 32-bit microcontroller (MCU) is an integrated processor core, SRAM, Flash program memory, and a configurable peripheral set on a single silicon die. The PIC32MZ EF family sits in the high-performance tier of Microchip's MIPS32-based MCU portfolio and inherits the company-wide Harmony software framework. Compared with 8-bit or 16-bit MCUs, a 32-bit core provides higher code density, deterministic interrupt latency, hardware single-cycle MAC for DSP, and the throughput required to drive graphics HMI stacks or encrypted communication stacks. The EF sub-family is the no-CAN / no-Crypto derivative of PIC32MZ, trading those peripherals for lower cost while retaining the FPU, Hi-Speed USB, Ethernet MAC, and 200 MHz-class core.
Key features include a MIPS32 microAptiv core with FPU and DSP extensions, 1 MB dual-bank Live-Update Flash, 256 KB SRAM, Hi-Speed USB 2.0 PHY, 10/100 Ethernet MAC with IEEE 1588, up to 144 I/O pins, multiple UART/SPI/I2C peripherals, a 12-bit ADC up to 500 ksps, and an integrated crypto-less / CAN-less peripheral set. The 144-TFBGA package supports industrial-grade -40 °C to +125 °C operation, making the part suitable for harsh-environment industrial and automotive subsystems.
The architecture combines a 5-stage pipeline, hardware multiply/divide, MMU for full RTOS support (ThreadX, FreeRTOS, OPENRTOS), and dual Flash banks that allow field firmware upgrades without downtime. The integrated FPU accelerates floating-point DSP workloads such as sensor fusion, while the dedicated Hi-Speed USB and Ethernet controllers offload communication processing from the core.
Typical applications include industrial Human-Machine Interface (HMI) touch panels, IoT gateways with Ethernet and USB connectivity, graphics-driven appliances, motor-control BLDC/PMSM drives, and connected medical/measurement instruments. The 200 MHz MIPS32 core plus DSP extensions make the part suitable for real-time control loops and signal-processing tasks at the same node.
When designing with this device, ensure that the 144-TFBGA land pattern matches your PCB process capability (TFBGA typically requires 0.8 mm pitch capability and via-in-pad design rules). Decoupling follows the family reference manual guidance: at least one 0.1 µF ceramic per supply rail plus a 4.7 µF bulk capacitor. The Live-Update dual-bank Flash allows boot-loader-driven firmware updates, but the application must reserve two regions of Flash explicitly.
This page synthesizes distributor stock, parametric context, drop-in alternative analysis, and practical design considerations not collected in any single manufacturer datasheet. Sourced from Microchip's PIC32MZ EF datasheet, DigiKey, Mouser, and Octopart distributor data as of 2026-10-04.
ドロップイン代替品: PIC32MZ1024EFE144-E/JWX — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: PIC32MZ1024EFE144-E/JWX （同一形状・フットプリント） — 相違点: Core Architecture, Package, Operating Temperature, CAN, ADC.
クイック比較ツール — 並列比較する代替部品を選択:
PIC32MZ1024EFM144-E/JWX
✅ ドロップイン✓ 在庫あり
$11.62 / 個
データシートを見る →PIC32MZ1024ECM144-I/PH
✅ ドロップイン✓ 在庫あり
$8.95 / 個
データシートを見る →PIC32MZ1024ECH144T-I/PL
✅ ドロップイン✓ 在庫あり
$9.55 / 個
データシートを見る →PIC32MZ1024EFK144-I/PH
✅ ドロップイン✓ 在庫あり
$11.4 / 個
データシートを見る →PIC32MZ1024EFH144-I/PH
✅ ドロップイン✓ 在庫あり
$11.92 / 個
データシートを見る →PIC32MZ0512EFK144-E/JWX
✅ ドロップイン✓ 在庫あり
$9.21 / 個
データシートを見る →PIC32MZ0512EFE144-E/JWX
✅ ドロップイン✓ 在庫あり
$6.55 / 個
データシートを見る →PIC32MZ0512EFF144-E/JWX
✅ ドロップイン✓ 在庫あり
$10 / 個
データシートを見る →PIC32MZ1024EFE144-E/JWX 最大定格＆電気的特性
| Core | MIPS32 microAptiv M-Class |
| Operating Frequency (max) | 180 MHz (family up to 252 MHz for the EF family overall; this variant per DigiKey listing) |
| Program Memory (Flash) | 1 MB (1M x 8) |
| SRAM | 256 KB |
| パッケージ | 144-lead TFBGA (7x7 mm) |
| 動作温度 | -40 C to +125 C (E = extended temperature) |
| Floating Point Unit | Yes (hardware single-precision FPU) |
| DSP Extensions | Yes (single-cycle MAC) |
| Ethernet | 10/100 MAC with IEEE 1588 |
| USB | Hi-Speed USB 2.0 PHY (device/host/OTG) |
| Crypto Accelerator | No (EFE family excludes Crypto) |
| CAN | No (EFE family excludes CAN) |
| ADC | 12-bit, up to 500 ksps |
| 実装タイプ | Surface Mount (BGA) |
| RoHS ステータス | Compliant |
PIC32MZ1024EFE144-E/JWX 144-lead tfbga (7x7 mm) ピン配置ガイド
PIC32MZ1024EFE144-E/JWX (144-lead tfbga (7x7 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: PIC32MZ1024EFE144-E/JWX.
詳細は データシート をご参照ください。
主な用途
PIC32MZ1024EFE144-E/JWX の用途: 6 件s: Industrial HMI Touch Panels, IoT Gateways with Ethernet and USB, BLDC / PMSM Motor Control, Connected Medical Instrumentation, Graphics-Driven Appliances, Industrial IoT Sensor Hubs.
Industrial HMI Touch Panels
The PIC32MZ1024EFE144-E/JWX suits industrial Human-Machine Interface (HMI) touch panels thanks to its MIPS32 core at 180 MHz, hardware FPU, 1 MB Flash, and 256 KB SRAM. The 144-TFBGA package exposes enough GPIO for a parallel TFT or RGB interface and a touch controller, while the 32-bit DSP extensions accelerate gesture-recognition and on-screen filtering. Unlike lower-end Cortex-M0+ MCUs that struggle with graphics framebuffers, this part holds a small framebuffer in SRAM directly and renders via DMA without taxing the CPU. Its -40 C to +125 C industrial temperature range covers factory-floor and outdoor kiosks. The Hi-Speed USB and Ethernet peripherals enable connected service portals over the same node, removing the need for a separate communication MCU.
おすすめ
IoT Gateways with Ethernet and USB
The PIC32MZ1024EFE144-E/JWX is well matched to IoT edge gateways because it integrates a 10/100 Ethernet MAC with IEEE 1588 timestamp support and a Hi-Speed USB 2.0 PHY on the same die. The 180 MHz MIPS32 core runs TLS, MQTT, and HTTP stacks concurrently, and the 256 KB SRAM accommodates TLS session buffers without external memory. The 1 MB dual-bank Live-Update Flash enables remote firmware upgrades without service interruption - critical for unattended gateways deployed in the field. Compared with a Cortex-M4 + external PHY solution, this part reduces BOM by eliminating the external Ethernet transceiver and shrinking PCB area inside the compact 144-TFBGA footprint.
おすすめ
BLDC / PMSM Motor Control
Field-oriented control of brushless DC (BLDC) and permanent-magnet synchronous motors (PMSM) requires deterministic 32-bit DSP throughput, fast ADC sampling, and flexible PWM generation - all delivered by the PIC32MZ1024EFE144-E/JWX. The hardware single-cycle MAC and DSP extensions handle Clarke/Park transforms and PI current loops within microseconds, while the 12-bit ADC at up to 500 ksps samples phase currents synchronously to PWM edges. The 1 MB Flash stores field-weakening tables, observer algorithms, and full motor-startup routines without resorting to external memory. The 144-TFBGA exposes ample GPIO for three-phase gate drivers, encoder or Hall sensors, and a CAN-style comm bus (note: this EFE variant omits CAN; use ECH if CAN is mandatory).
おすすめ
Connected Medical Instrumentation
Portable and connected medical instruments - such as patient monitors, infusion pumps, and point-of-care diagnostics - benefit from the PIC32MZ1024EFE144-E/JWX's combination of MIPS32 performance, deterministic interrupt latency, and Hi-Speed USB for tethered data export. The 180 MHz core processes DSP sensor-filtering pipelines (heart-rate, SpO2 plethysmography) in real time, while 256 KB SRAM holds waveform buffers. The -40 C to +125 C operating range covers clinical environments and sterilization cycles. Compared with discrete analog front-ends paired with a low-end MCU, this part integrates Ethernet for EMR upload and USB for service diagnostics on a single chip, reducing BOM and board space.
おすすめ
Graphics-Driven Appliances
Appliances such as smart ovens, washing machines, and HVAC controllers increasingly ship color TFT displays and animated UI flows. The PIC32MZ1024EFE144-E/JWX drives small-to-medium TFT panels directly through its parallel GPIO and dedicated DMA, while the hardware FPU accelerates image scaling and rotation. The 1 MB Flash holds bilingual UI assets and graphics libraries, and the 256 KB SRAM acts as a working framebuffer. The 144-TFBGA exposes the GPIO count required for 16-/18-/24-bit RGB interfaces and capacitive-touch I2C bridges. Compared with PIC32MX-class parts, this PIC32MZ EF part eliminates the need for an external graphics controller.
おすすめ
Industrial IoT Sensor Hubs
Industrial IoT sensor hubs aggregate field-bus sensors (UART, SPI, I2C) and forward telemetry over Ethernet or USB. The PIC32MZ1024EFE144-E/JWX fits this role because its MIPS32 core runs industrial protocols (Modbus TCP, EtherNet/IP) and the integrated 10/100 MAC removes an external PHY cost. The 12-bit ADC at 500 ksps oversamples transducer signals for higher effective resolution, while 1 MB Flash stores factory calibration tables. The -40 C to +125 C operating range and 144-TFBGA's compact 7x7 mm footprint enable small IP67 enclosures. The EFE variant's omission of Crypto is acceptable when TLS terminates on a separate secure gateway rather than on this hub.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: PIC32MZ1024EFE144-E/JWX — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | PIC32MZ1024EFM144-E/JWX | PIC32MZ0512EFK144-E/JWX | PIC32MZ0512EFE144-E/JWX | PIC32MZ0512EFF144-E/JWX |
|---|---|---|---|---|---|
| Package | 144-TFBGA (JWX, 7x7 mm) | 144-TFBGA (JWX, 7x7 mm) - same | 144-TFBGA (JWX, 7x7 mm) - same | 144-TFBGA (JWX, 7x7 mm) - same | 144-TFBGA (JWX, 7x7 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | MIPS32 microAptiv M-Class @ 180 MHz | MIPS32 microAptiv M-Class @ 180 MHz - same | MIPS32 microAptiv M-Class @ 180 MHz - same | MIPS32 microAptiv M-Class @ 180 MHz - same | MIPS32 microAptiv M-Class @ 180 MHz - same |
| Flash | 1 MB | 1 MB - same | 512 KB (-50%) | 512 KB (-50%) | 512 KB (-50%) |
| SRAM | 256 KB | 256 KB - same | 128 KB (-50%) | 128 KB (-50%) | 128 KB (-50%) |
| Hardware Crypto | No | Yes (AES/SHA/TRNG) | No | No | No |
| Operating Temperature | -40 C to +125 C | -40 C to +125 C - same | -40 C to +125 C - same | -40 C to +125 C - same | -40 C to +125 C - same |
| Approx Unit Price (qty 1) | $18.92 | $20.50 (estimated, higher Crypto cost) | $14.20 (estimated, lower Flash) | $13.90 (estimated, lower Flash) | $13.80 (estimated, lower Flash) |
主な差別化要因
- No-CAN / No-Crypto variant of PIC32MZ EF （vs PIC32MZ1024EFM144-E/JWX)
- 1 MB Flash / 256 KB SRAM density （vs PIC32MZ0512EFK144-E/JWX)
- Dual-bank Live-Update Flash （vs PIC32MX family)
- Industrial -40 C to +125 C operating range （vs PIC32MZ1024EFE144-I/JWX)
設計ノート
The 144-TFBGA package requires a PCB process capable of 0.8 mm ball pitch with via-in-pad construction. Use NSMD (non-solder-mask-defined) pads on the BGA side and micro-via fan-outs to inner signal layers. Per IPC-7093 design rules for BGA, place a 0.1 µF decoupling capacitor within 2 mm of each power pin pair, and a 4.7 µF bulk capacitor within 10 mm of each supply rail group. Match the package's 7x7 mm body keep-out to your enclosure to avoid mechanical stress on solder balls.
Estimated: at 200 MHz MIPS32 operation with typical peripheral activity, core current is approximately 80-120 mA from the 1.2 V internal rail. The 144-TFBGA junction-to-ambient thermal resistance (theta_JA) is approximately 25 C/W on a standard 4-layer JEDEC test PCB. Power dissipation is roughly 0.5-1 W under load, leading to a junction temperature rise of 12-25 C above ambient. For continuous operation at +125 C ambient, ensure PCB copper-pour thermal management provides adequate margin. Verify with Microchip's thermal management application notes for the PIC32MZ EF family.
Do not confuse the EFE (no CAN, no Crypto) variant with the EFM (Crypto) or ECH/ECM (CAN) variants - all share the same 144-pin package code letter suffix (/JWX), but the on-die peripherals differ. When migrating between variants, validate that pinout is identical for the chosen package code. Also note that the Live-Update dual-bank Flash requires application firmware to manage the boot loader in a reserved region - do not assume a single contiguous 1 MB program region without configuring the FBTBLIM bits in the NVMCON register.
Route the Hi-Speed USB DP/DN pair as a 90 ohm differential pair with length matching within 150 mils, and the Ethernet TX/RX pairs as 100 ohm differential pairs per IEEE 802.3 - keep these pairs over a continuous ground reference plane and away from switching regulator or PWM traces to minimize EMI coupling. Use a ground flood on layer 2 beneath the TFBGA to control the package's return-current path. Per the PIC32MZ EF family reference manual, group oscillator traces (POSC/SOSC) within a ground-guard ring and keep digital switching traces at least 3 mm away.
コンプライアンス情報
RoHS and REACH compliance per Microchip product page; lead-free reflow-compatible. AEC-Q100 qualification is not stated for this industrial/consumer-grade part - confirm with Microchip for automotive deployments.
