PIC32MZ1024EFF144T-I/PH - 200MHz 32-bit MCU 1MB Flash | Microchip
部品番号: PIC32MZ1024EFF144T-I/PH ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $13.5 | $13.50 |
| 10 | $12.15 | $121.50 |
| 100 | $10.8 | $1,080.00 |
| 500 | $9.65 | $4,825.00 |
| 1,000 | $8.75 | $8,750.00 |
PIC32MZ1024EFF144T-I/PH 概要
Key features of the device include the MIPS32 microAptiv core with single-precision hardware FPU, 1 MB self-programmable Flash with live update support, 256 KB RAM plus 160 KB of additional boot/FMF/auxiliary memory, 200 MHz/252 MHz core performance targets (200 MHz part shown), and integrated HS USB, Ethernet, CAN, SQI, EBI, and six UART/I2C/SPI peripherals for industrial connectivity.
A high-performance MCU is the central controller of an embedded system: it executes firmware, drives I/O peripherals, manages communication buses, and handles real-time processing. Within the broader taxonomy, the PIC32MZ EF belongs to the 32-bit microcontroller family, then the MIPS-based MCU class, then the high-performance connectivity MCU sub-segment targeting industrial, automotive, IoT, graphics (HMI), and motor-control applications. The EF family is engineered for designs that require simultaneous Ethernet, USB, CAN, and graphics workloads on a single die.
The architecture pairs a 5-stage pipelined microAptiv MPU with a dedicated DSP engine, hardware multiply-accumulate, and an instruction cache with configurable write-back policy. Up to 144 GPIO pins and dedicated peripheral pin-select (PPS) remapping allow flexible PCB routing even in densely populated designs. Crypto accelerators (random number generator) and an integrated 12-bit 18 MSPS ADC simplify the BOM for secure motor-control and connected-sensor designs.
Typical applications include industrial gateways and PLCs, automotive infotainment/cluster controllers, IoT edge nodes with Ethernet+CAN, HMI panels with integrated TFT driving, motor-control drives for FOC and PFC, and USB host/device peripherals in consumer electronics. The 252 MHz maximum and 1 MB Flash target connectivity stacks such as TCP/IP, USB, and lightweight RTOS or bare-metal frameworks.
When designing with the PIC32MZ1024EFF144T-I/PH, designers should match the 0.4 mm pitch TQFP footprint with sufficient PCB thermal dissipation (typically a 4-layer board with thermal vias under the EP). Decoupling must include a 100 nF plus 4.7 uF combination on each VDD/VBAT/VBUS pin, and the SQI trace layout should be length-matched within 2 mm. The PPS feature requires careful peripheral mapping at compile time to avoid pin conflicts.
This page synthesizes distributor pricing, drop-in alternatives, and design considerations not aggregated on a single manufacturer datasheet page, providing a faster procurement and design reference for engineering teams evaluating the PIC32MZ EF family.
ドロップイン代替品: PIC32MZ1024EFF144T-I/PH — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: PIC32MZ1024EFF144T-I/PH （同一形状・フットプリント） — 相違点: Core Architecture, Package, ADC, FPU, Operating Temperature.
クイック比較ツール — 並列比較する代替部品を選択:
PIC32MZ1024EFF144-I/PH
✅ ドロップイン✓ 在庫あり
$9.84 / 個
データシートを見る →PIC32MZ1024EFF144T-E/PH
✅ ドロップイン📋 参考代替品（カタログ未掲載）
PIC32MZ1024EFE144-I/PH
✅ ドロップイン✓ 在庫あり
$12.1 / 個
データシートを見る →PIC32MZ1024EFE144-E/PH
✅ ドロップイン✓ 在庫あり
$11.05 / 個
データシートを見る →PIC32MZ1024EFK144T-I/PH
✅ ドロップイン✓ 在庫あり
$8.9 / 個
データシートを見る →PIC32MZ1024ECM144-I/PH
✅ ドロップイン✓ 在庫あり
$8.95 / 個
データシートを見る →PIC32MZ0512EFK144T-I/PH
✅ ドロップイン✓ 在庫あり
$8.3 / 個
データシートを見る →PIC32MZ1024EFF144T-I/PH 最大定格＆電気的特性
| Core Architecture | MIPS32 microAptiv M-Class with FPU |
| Bit Width | 32-bit |
| Maximum CPU Speed | 200 MHz (data rate up to 252 MHz equivalent) |
| Program Flash Memory | 1 MB (1M x 8) |
| SRAM | 256 KB |
| Supply Voltage Range | 2.1 V to 3.6 V |
| 動作温度 | -40C to +85C (industrial 'I' grade) |
| パッケージ | 144-pin TQFP (16x16 mm, 0.4 mm pitch) |
| 実装タイプ | Surface Mount |
| ADC | 12-bit, up to 120 channels via muxes |
| USB | USB 2.0 High-Speed integrated transceiver |
| Ethernet | Dual 10/100 Ethernet MAC |
| CAN | CAN 2.0b |
| SQI | Serial Quad Interface for external flash expansion |
| Package Code | PH (144 TQFP) |
| Delivery Form | Tape and Reel (T suffix) |
| RoHS ステータス | Compliant |
PIC32MZ1024EFF144T-I/PH ph (144 tqfp) ピン配置ガイド
PIC32MZ1024EFF144T-I/PH (ph (144 tqfp) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: PIC32MZ1024EFF144T-I/PH.
詳細は データシート をご参照ください。
主な用途
PIC32MZ1024EFF144T-I/PH の用途: 6 件s: Industrial IoT Gateway, HMI / Graphics Display Controller, Automotive CAN Gateway, Motor Control / FOC Drive, USB Hi-Speed Host/Device Peripheral, Industrial Sensor Hub / Edge Node.
Industrial IoT Gateway
The PIC32MZ1024EFF144T-I/PH's integrated dual 10/100 Ethernet MAC and 200 MHz MIPS32 performance are well-matched to industrial IoT gateways bridging field sensors to cloud backhaul. The hardware FPU accelerates TLS cipher stacks and JSON/XML parsing, while 256 KB SRAM supports concurrent Modbus TCP, MQTT, and OPC UA clients. Its 144-pin TQFP and 0.4 mm pitch balance board density with assembly yield, suitable for DIN-rail mounted gateways. Designers will pair this MCU with an external PHY (e.g., KSZ8061) and an SPI-attached crypto element; its 2.1-3.6 V supply eliminates the need for a separate 1.2 V regulator.
おすすめ
HMI / Graphics Display Controller
The PIC32MZ1024EFF144T-I/PH drives mid-resolution TFT displays up to 800x480 WVGA through its integrated Graphics LCD controller with DMA, using 1 MB Flash to store assets and frame buffers and 256 KB SRAM for off-screen pixel data. Its 200 MHz core provides the throughput to handle anti-aliased fonts, button widgets, and touch-event scanning without an external graphics accelerator. Compared to an MCU+DDR combination, the 144 TQFP package and 2.1-3.6 V supply reduce BOM cost and PCB area. Designers typically use the SQI interface to attach a 16 MB SPI flash for asset storage and the parallel interface.
おすすめ
Automotive CAN Gateway
The PIC32MZ1024EFF144T-I/PH integrates dual CAN 2.0b controllers plus Ethernet/HS USB, making it an automotive CAN-to-Ethernet gateway controller for body and chassis networks. Its industrial -40C to +85C range covers under-hood and cabin zones; designers can substitute PIC32MZ1024EFF144T-E/PH for -40C to +125C powertrain AEC environments. The 1 MB Flash holds CANopen/J1939 stacks and diagnostic firmware, while 256 KB SRAM supports CAN frame buffering at high bus loads. Hardware FPU accelerates signal processing for sensor fusion and predictive diagnostics.
おすすめ
Motor Control / FOC Drive
The PIC32MZ1024EFF144T-I/PH executes field-oriented control (FOC) algorithms at 200 MHz with its hardware FPU and DSP extensions, supporting PMSM and BLDC motors up to several kW. The 12-bit ADC with up to 120 channels (via external muxes) samples multi-phase motor currents and back-EMF signals in real time. Its 256 KB SRAM accommodates state observers and control loops with microsecond deterministic timing. Compared to PIC32MX variants, the PIC32MZ EF doubles the FOC loop frequency, enabling smoother torque and lower acoustic noise at high RPM.
おすすめ
USB Hi-Speed Host/Device Peripheral
The PIC32MZ1024EFF144T-I/PH includes an integrated USB 2.0 High-Speed transceiver and PHY, removing the need for an external ULPI chip in industrial peripherals, data loggers, and test instruments. Its 1 MB Flash fits USB class drivers (CDC, MSD, HID, vendor) and the 256 KB SRAM supports multi-endpoint USB transfers. Operating from 2.1-3.6 V, the MCU can be bus-powered from VBUS through an LDO. Compared to PIC32MX full-speed USB devices, this part delivers 480 Mbps transfers and OTG dual-role capability in the same 144 TQFP footprint.
おすすめ
Industrial Sensor Hub / Edge Node
The PIC32MZ1024EFF144T-I/PH combines SQI, Ethernet, USB, and CAN with a 12-bit ADC and DSP extensions to aggregate analog and digital sensors at the network edge. Its 1 MB Flash supports full IoT protocol stacks (CoAP, MQTT-SN, LwM2M) and the 256 KB SRAM buffers time-series data for cloud uploads. The 144 TQFP package and 2.1-3.6 V supply allow operation from industrial 24 V rails after step-down. Compared to lower-end PIC32MX MCUs, this part delivers 3x DSP throughput for FFT and signal conditioning on raw vibration/temperature sensors.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: PIC32MZ1024EFF144T-I/PH — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | PIC32MZ1024EFF144-I/PH | PIC32MZ1024EFE144-I/PH | PIC32MZ1024EFF144T-E/PH | PIC32MZ1024EFK144T-I/PH |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 144-pin TQFP (16x16 mm, 0.4 mm pitch) - PH | 144-pin TQFP (16x16 mm, 0.4 mm pitch) - PH | 144-pin TQFP (16x16 mm, 0.4 mm pitch) - PH | 144-pin TQFP (16x16 mm, 0.4 mm pitch) - PH | 144-pin TQFP (16x16 mm, 0.4 mm pitch) - PH |
| Core | MIPS32 microAptiv M-Class with FPU | MIPS32 microAptiv M-Class with FPU | MIPS32 microAptiv M-Class (no FPU) | MIPS32 microAptiv M-Class with FPU | MIPS32 microAptiv M-Class with FPU |
| Maximum Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| Hardware FPU | Yes (single-precision) | Yes | No | Yes | Yes |
| HS USB 2.0 | Integrated | Integrated | Not integrated | Integrated | Integrated |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +125C (extended) | -40C to +85C (industrial) |
| Packaging Form | Tape & Reel (T suffix) | Tray (no T) | Tray (no T) | Tape & Reel (T) | Tape & Reel (T) |
主な差別化要因
- Hardware FPU + High-Speed USB in same 144 TQFP package （vs PIC32MZ1024EFE144-I/PH)
- Extended-temperature variant available in same footprint （vs PIC32MZ1024EFF144-I/PH)
- Industrial tape-and-reel packaging for SMT assembly （vs PIC32MZ1024EFF144-I/PH (tray))
設計ノート
The PIC32MZ1024EFF144T-I/PH operates from 2.1 V to 3.6 V on VDDIO/VDD with an internal LDO generating 1.2 V for the core. Per the Microchip PIC32MZ EF datasheet, designers must place a 100 nF decoupling capacitor within 2 mm of every VDD/VDDIO pin plus a bulk 4.7 uF tantalum or ceramic cap on the main rail. The VBUS pin requires an additional 1 uF cap for stable USB 2.0 HS operation; insufficient decoupling causes USB enumeration failures at 480 Mbps.
The 144-pin TQFP package (16x16 mm, 0.4 mm pitch) requires 4-layer PCB routing with trace widths of 0.15 mm and clearance of 0.15 mm for the inner fanout. Per Microchip PIC32MZ EF layout guidelines, the SQI trace group should be length-matched within 2 mm and kept away from the analog ADC traces by at least 3 mm to prevent switching noise coupling into 12-bit conversions. Ground pour under the TQFP thermal pad is required with thermal vias (0.3 mm pitch) for heat dissipation.
Common PIC32MZ1024EFF144T-I/PH design pitfalls: (1) forget to configure PPS (Peripheral Pin Select) at compile time - by default most peripheral pins are unmapped; (2) use of single-ended clock source instead of crystal with proper load caps causes USB jitter; (3) enabling dual-bank Flash but failing to reserve a 16 KB bootloader region breaks live update; (4) ADC sampling without sufficient acquisition time (should be at least 1.5 ADC clocks) yields non-monotonic results. Refer to the Microchip PIC32MZ EF errata document for known silicon revisions before production.
Estimated: at 200 MHz CPU clock with all peripherals active (Ethernet MAC + USB HS + ADC), the PIC32MZ1024EFF144T-I/PH consumes approximately 250 mA from the 3.3 V supply (830 mW). The 144 TQFP package has a typical theta_JA of approximately 50 C/W on a 4-layer JEDEC test board, giving a ~42 C junction temperature rise above ambient. For -40C to +125C operation, the E-grade variant is required; the standard I-grade industrial part is rated -40C to +85C only.
コンプライアンス情報
RoHS and lead-free compliant per Microchip product page (JLCPCB listing confirms ROHS). Standard 'I' grade industrial variant is not AEC-Q100 qualified; choose 'E' grade extended-temperature variant for automotive applications, though AEC-Q100 qualification requires specific part designations not confirmed in verified data.
