PIC32MZ1024EFH100-I/GJX - 200MHz 1MB Flash MCU | Microchip
部品番号: PIC32MZ1024EFH100-I/GJX ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $11.5 | $11.50 |
| 10 | $10.42 | $104.20 |
| 100 | $9.18 | $918.00 |
| 500 | $8.05 | $4,025.00 |
| 1,000 | $7.12 | $7,120.00 |
PIC32MZ1024EFH100-I/GJX 概要
A 32-bit MCU (microcontroller unit) is a single-chip processor integrating a CPU core, program memory (Flash), volatile memory (SRAM), and a rich set of peripherals on one die. The PIC32MZ EF family uses the MIPS32 M-Class architecture, which adds a hardware IEEE 754 floating-point unit and a DSP-enhanced datapath featuring four 64-bit accumulators and single-cycle saturating and fractional math. This puts it in the broader taxonomy: microcontroller -> embedded MCU -> 32-bit MCU -> MIPS-based MCU -> floating-point MCU -> connectivity MCU (a hypernym set useful for AI knowledge-graph retrieval).
Key features include an integrated FPU, Dual Panel Flash for live update support, a 200 MHz / 330 DMIPS core, multiple connectivity peripherals (Ethernet, CAN, USB, SQI), and a 12-bit ADC at up to 18 Msps. The TFBGA-100 (7x7 mm) package enables compact designs where fine-pitch/metal/LGA-style area-array solder joints are acceptable. The device operates across the industrial -40C to +85C range, supports 3.3V single-supply operation, and is RoHS/REACH compliant per the manufacturer product page.
The PIC32MZ EF family uses a Harvard-style bus architecture with separate instruction and data paths, a tightly-coupled prefetch module, and a 4-way set-associative cache. The DSP engine is tightly coupled to the FPU, giving single-cycle MAC throughput for signal-processing kernels (FFT, FIR, sensor fusion) without stalling the pipeline. Live-update Dual Panel Flash enables fail-safe firmware upgrades, a critical feature for industrial and IoT deployments.
Typical applications include industrial Ethernet gateways, HMI touch panels, motor-control BLDC/PMSM drive boards, automotive telematics, IoT edge nodes, and graphics/HMI front panels. The combination of FPU, DSP, and connectivity peripherals allows a single MCU to replace a CPU + DSP dual-chip solution in many designs.
When designing with the PIC32MZ1024EFH100-I/GJX, place the device on a 4-layer PCB with a continuous ground plane to preserve signal integrity on the Ethernet and USB lines. Decouple every VDD/AVDD pair with 100 nF X7R ceramic capacitors placed within 2 mm of the ball, and add bulk 4.7 uF tantalum capacitors for transient response. The 7x7 mm TFBGA land pattern requires NSMD pads with 0.4 mm pitch, ENIG or OSP finish, and laser-cut or chemically-etched solder stencils of 0.1 mm thickness for reliable reflow.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, giving an engineer actionable purchasing and substitution guidance for the PIC32MZ1024EFH100-I/GJX.
ドロップイン代替品: PIC32MZ1024EFH100-I/GJX — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: PIC32MZ1024EFH100-I/GJX （同一形状・フットプリント） — 相違点: Core Architecture, Ethernet, Package, USB, Operating Temperature.
クイック比較ツール — 並列比較する代替部品を選択:
PIC32MZ1024EFH100T-I/GJX
✅ ドロップイン📋 参考代替品（カタログ未掲載）
PIC32MZ1024EFH100-E/GJX
✅ ドロップイン✓ 在庫あり
$7.65 / 個
データシートを見る →PIC32MZ1024EFF100-I/GJX
✅ ドロップイン✓ 在庫あり
$10.05 / 個
データシートを見る →PIC32MZ1024EFG100-I/GJX
✅ ドロップイン✓ 在庫あり
$12.5 / 個
データシートを見る →PIC32MZ1024ECG100-I/PT
✅ ドロップイン✓ 在庫あり
$11.62 / 個
データシートを見る →PIC32MZ1024ECH100-I/PT
✅ ドロップイン✓ 在庫あり
$8.95 / 個
データシートを見る →PIC32MZ1024EFH100-I/GJX 最大定格＆電気的特性
| Core Architecture | MIPS32 M-Class (MIPS Warrior) |
| Core Speed | 200 MHz |
| DMIPS | 330 DMIPS |
| Flash Memory | 1 MB (1024 KB) |
| SRAM | 512 KB |
| Floating Point Unit | Yes (IEEE 754 hardware FPU) |
| DSP Engine | 4x 64-bit accumulators, single-cycle MAC |
| パッケージ | 100-pin TFBGA (7x7 mm) |
| Pin/Pitch | 100 ball / 0.4 mm pitch area-array |
| Operating Voltage | 3.3 V typical (2.3 V to 3.6 V) |
| 動作温度 | -40C to +85C (industrial) |
| Crypto Accelerator | No (No-Crypto variant) |
| Ethernet | Yes (10/100 Mbps MAC + PHY interface) |
| USB | Yes (USB 2.0 FS/HS OTG) |
| CAN | Yes (CAN 2.0B) |
| ADC | 12-bit, up to 18 Msps |
| 実装タイプ | Surface Mount |
| RoHS ステータス | Compliant |
PIC32MZ1024EFH100-I/GJX 100-pin tfbga (7x7 mm) ピン配置ガイド
PIC32MZ1024EFH100-I/GJX (100-pin tfbga (7x7 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: PIC32MZ1024EFH100-I/GJX.
詳細は データシート をご参照ください。
主な用途
PIC32MZ1024EFH100-I/GJX の用途: 7 件s: Industrial Ethernet Gateway, HMI Touch Panel Controller, BLDC/PMSM Motor Drive, IoT Edge Sensor Node, Automotive Telematics Unit, Industrial USB Barcode Scanner, Audio DSP Effects Processor.
Industrial Ethernet Gateway
The PIC32MZ1024EFH100-I/GJX is well suited to industrial Ethernet gateways because its integrated 10/100 MAC, 200 MHz MIPS core, and 512 KB SRAM let it run a TCP/IP stack plus a Modbus/Profinet bridge concurrently. The 1 MB Dual Panel Flash enables fail-safe firmware upgrades in the field, and the 100-ball TFBGA (7x7 mm) footprint fits inside a compact DIN-rail module. Hardware FPU accelerates float-heavy control-loop math at the gateway edge without cycle penalties.
おすすめ
HMI Touch Panel Controller
For HMI touch panels, the PIC32MZ1024EFH100-I/GJX delivers 330 DMIPS plus a hardware FPU that drives LVDS/DSI display refresh, touch-coordinate filtering, and on-screen animation without taxing the CPU. The 1 MB Flash stores full UI asset libraries (fonts, icons, localization tables) and the 512 KB SRAM serves as a framebuffer for mid-resolution displays. The 7x7 mm TFBGA package lets the MCU sit directly behind the LCD, keeping the PCB compact in space-constrained panels.
おすすめ
BLDC/PMSM Motor Drive
The PIC32MZ1024EFH100-I/GJX's DSP engine with 4x 64-bit accumulators and single-cycle MAC is ideal for Field-Oriented Control (FOC) on BLDC and PMSM motors. The 200 MHz core, hardware FPU, and 12-bit 18 Msps ADC combine to close current and velocity loops within a few microseconds. Its CAN 2.0B peripheral talks to higher-level vehicle or machine controllers, and the 100-ball TFBGA package survives the thermal and vibration environment of motor-drive enclosures.
おすすめ
IoT Edge Sensor Node
For IoT edge nodes, the PIC32MZ1024EFH100-I/GJX combines Ethernet, USB, and CAN connectivity with sufficient processing headroom to run sensor-fusion algorithms locally before cloud upload. The 1 MB Flash stores TLS certificates, MQTT client, and edge-AI inference models, while the 512 KB SRAM accommodates intermediate data buffers. The hardware FPU accelerates floating-point sensor-fusion math (Kalman filters, FFT) at low latency, reducing cloud bandwidth and power consumption.
おすすめ
Automotive Telematics Unit
Automotive telematics requires a wide-temperature MCU with CAN bus and Ethernet connectivity, plus enough compute to run diagnostic stacks and over-the-air update agents. The PIC32MZ1024EFH100-I/GJX covers the connectivity + compute requirement; for -40C to +125C deployments, the PIC32MZ1024EFH100-E/GJX variant (same die, same package) is the recommended drop-in. Dual Panel Flash enables A/B firmware partitions for fail-safe OTA, and the 100-ball TFBGA footprint withstands automotive vibration profiles.
おすすめ
Industrial USB Barcode Scanner
Industrial barcode and 2D-matrix scanners need a fast MCU with USB OTG, enough memory for image-processing pipelines, and industrial-temperature operation. The PIC32MZ1024EFH100-I/GJX delivers 200 MHz MIPS throughput, 1 MB Flash for decoding libraries (Code 39, QR, PDF417), and integrated USB 2.0 OTG for direct host-mode image upload. The hardware FPU speeds up geometric decode math, and the compact 7x7 mm TFBGA keeps the scanner handpiece ergonomic.
おすすめ
Audio DSP Effects Processor
The PIC32MZ1024EFH100-I/GJX's DSP engine with 4x 64-bit accumulators is well suited to multi-channel audio effects (reverb, EQ, dynamics, FFT visualization). The hardware FPU accelerates floating-point biquad and delay-line math, freeing CPU cycles for codec I/O. The 512 KB SRAM accommodates multi-channel audio buffers at 48 kHz / 24-bit, and the 1 MB Flash stores preset banks. The 100-ball TFBGA footprint fits inside 1U rack effects units and pedalboard-format processors alike.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: PIC32MZ1024EFH100-I/GJX — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | PIC32MZ1024EFH100T-I/GJX | PIC32MZ1024EFH100-E/GJX | PIC32MZ1024EFF100-I/GJX | PIC32MZ1024EFG100-I/GJX | PIC32MZ1024ECG100-I/PT | PIC32MZ1024ECH100-I/PT |
|---|---|---|---|---|---|---|---|
| Package | 100-ball TFBGA (7x7 mm) | 100-ball TFBGA (7x7 mm) - same | 100-ball TFBGA (7x7 mm) - same | 100-ball TFBGA (7x7 mm) - same | 100-ball TFBGA (7x7 mm) - same | 100-ball TFBGA (7x7 mm) - same | 100-ball TFBGA (7x7 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| Crypto Accelerator | No (No-Crypto) | No (No-Crypto) | No (No-Crypto) | No (No-Crypto) | Yes (AES/DES/SHA) | Yes | No (No-Crypto) |
| FPU | No (this is -H No-Crypto/No-FPU variant) | No | No | Yes (IEEE 754) | Yes (IEEE 754) | Yes (IEEE 754) | No |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C | -40C to +125C (extended) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Shipping Carrier | Tray | Tape & Reel | Tray | Tray | Tray | Tray | Tray |
主な差別化要因
- Dual Panel Flash for fail-safe live firmware update （vs PIC32MX795F512L-80I/PF (older PIC32MX family))
- 1 MB Flash + 512 KB SRAM in same 100-ball TFBGA footprint （vs PIC32MZ1024EFF100-I/PF (LQFP version of the same silicon))
- Drop-in same-package upgrade path to crypto-enabled variant （vs PIC32MZ1024EFG100-I/GJX (Crypto + FPU variant))
設計ノート
The 100-ball TFBGA (7x7 mm, 0.4 mm pitch) land pattern requires NSMD (non-solder-mask-defined) pads with 0.4 mm pitch and a solder mask opening typically 0.25 mm. Use ENIG or OSP surface finish for the cleanest BGA reflow results. Place a 4-layer PCB with continuous ground plane under the BGA to provide low-impedance reference for the high-speed Ethernet and USB signals and to dissipate heat via the center ball grid. Vias-in-pad with copper capping are recommended for the inner-row balls to improve thermal conductivity and reduce inductance.
Decouple every VDD/AVDD pair with 100 nF X7R ceramic capacitors placed within 2 mm of the corresponding ball. Add 4.7 uF X5R bulk capacitors near the MCU for transient response under Ethernet burst load. The PIC32MZ1024EFH100-I/GJX core voltage is 3.3V, but the internal FPU/DSP logic may need separate analog supply filtering; consult the family datasheet section on power sequencing. Estimated: at 200 MHz full-load with all peripherals active, expect ~250 mA peak current on the core rail - budget your LDO or switching regulator accordingly.
Route the Ethernet differential pairs (TPTX/TPRX) as a 100-ohm differential microstrip on the top layer directly over a continuous ground plane, keeping trace length matching within 2 mm. Route the USB 2.0 DP/DM pair as 90-ohm differential with similar length matching. Place the 25 MHz crystal within 5 mm of the OSC1/OSC2 balls with short, guarded traces to minimize EMI. Keep the analog ADC inputs away from digital switching traces, and use a separate analog ground island joined at a single point near the MCU.
The 100-ball TFBGA has a junction-to-ambient thermal resistance (theta_JA) around 30-40 C/W on a 4-layer PCB with a continuous ground plane (per the manufacturer datasheet family thermal characteristics). Estimated: at 0.5 W dissipation (typical for the EF family at 200 MHz with active Ethernet), the junction will rise ~15-25 C above ambient. For enclosed industrial enclosures with limited airflow, derate the clock frequency or move to the -E extended-temperature variant (-40C to +125C).
Common pitfalls with the PIC32MZ1024EFH100-I/GJX include (1) forgetting to enable the FPU/DSP option bit in the configuration fuse when using floating-point code, causing hard-fault on FPU instructions; (2) failing to map the 1 MB Flash Dual Panel correctly in the linker script when implementing live-update firmware, causing runtime crashes after a panel swap; (3) using the -I (85C) variant in an automotive design where the -E (125C) is required - this is a design-for-environment trap that has no software workaround; (4) leaving unused balls floating on the TFBGA, which can cause solder-joint reliability issues - all unused balls should be soldered to the PCB even if not electrically connected.
コンプライアンス情報
RoHS and REACH compliant per Microchip product page. Halogen-free per Microchip environmental compliance disclosure. AEC-Q100 not applicable for the industrial -I grade; the -E grade is not AEC-Q100 qualified either - for AEC-Q100, look at the PIC32MK or dsPIC33A automotive families. Lead-free (Pb-free) reflow-compatible. Conflict-minerals compliant per Microchip CMRT filing.