PIC32MZ2048ECH064T-I/MR - 200MHz 2MB Flash MCU | Microchip
部品番号: PIC32MZ2048ECH064T-I/MR ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $16.13 | $16.13 |
| 10 | $14.39 | $143.90 |
| 100 | $11.68 | $1,168.00 |
| 500 | $10.65 | $5,325.00 |
| 1,000 | $9.93 | $9,930.00 |
PIC32MZ2048ECH064T-I/MR 概要
What is a PIC32MZ ECH microcontroller? The PIC32MZ ECH family is a high-end extension of Microchip's MIPS-based PIC32 line, built on the microAptiv core with a 5-stage pipeline, DSP extensions, and a double-precision FPU. Compared with the lower-cost PIC32MX and PIC32MZ EF variants, the ECH parts add a larger 2 MB Flash, dedicated Ethernet and CAN peripherals, a High-Speed USB 2.0 OTG controller, and a richer analog subsystem, targeting connected industrial, automotive, and IoT gateway designs.
Key features of this part include a 32-bit MIPS32 core with 200 MHz / 330 DMIPS performance, 2 MB on-chip Flash (2M x 8), 512 KB SRAM, 12-bit ADC with up to 5 MSPS, two analog comparators, six digital filters, and a temperature sensor with +-2C accuracy. Communication interfaces include Ethernet MAC, CAN 2.0B, USB 2.0 OTG (High Speed), SPI, I2C, and UART. The 64-pin VQFN package provides an exposed thermal pad for better thermal dissipation in space-constrained layouts.
Typical applications include industrial Ethernet gateways, motor control inverters, automotive infotainment controllers, PLC communication modules, and connected IoT edge nodes. Designers choose this device when deterministic Ethernet or CAN connectivity, generous Flash for protocol stacks, and industrial-grade temperature operation are required in a single chip. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
ドロップイン代替品: PIC32MZ2048ECH064T-I/MR — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: PIC32MZ2048ECH064T-I/MR （同一形状・フットプリント） — 相違点: Package, ADC, USB, Core Architecture, Ethernet.
クイック比較ツール — 並列比較する代替部品を選択:
PIC32MZ2048ECH064-I/MR
✅ ドロップイン✓ 在庫あり
$8.32 / 個
データシートを見る →PIC32MZ2048ECG064-I/MR
✅ ドロップイン✓ 在庫あり
$6.45 / 個
データシートを見る →PIC32MZ1024ECH064-I/MR
✅ ドロップイン✓ 在庫あり
$4.95 / 個
データシートを見る →PIC32MZ2048ECH064-I/PT
✅ ドロップイン✓ 在庫あり
$7.15 / 個
データシートを見る →PIC32MZ2048ECG064T-I/MR
✅ ドロップイン✓ 在庫あり
$7.74 / 個
データシートを見る →PIC32MX795F512LT-80V/MR
✅ ドロップイン📋 参考代替品（カタログ未掲載）
PIC32MZ2048ECH064T-I/MR 最大定格＆電気的特性
| Core | MIPS32 microAptiv PIC32MZ |
| Architecture | 32-bit RISC with DSP and FPU |
| Maximum Clock Speed | 200 MHz |
| Performance | 330 DMIPS / 1.57 DMIPS/MHz |
| Program Flash | 2 MB (2M x 8) |
| SRAM | 512 KB |
| 電源電圧 | 2.3 V to 3.6 V |
| 動作温度 | -40C to +85C (industrial) |
| パッケージ | 64-pin VQFN (9x9 mm) with EP |
| ADC | 12-bit, up to 5 MSPS |
| Ethernet MAC | 10/100 Mbps integrated |
| CAN | CAN 2.0B |
| USB | USB 2.0 OTG High Speed |
| Temperature Sensor Accuracy | +-2C |
| Analog Comparators | 2 with 32 programmable voltage references |
| 実装タイプ | Surface Mount (Tape and Reel) |
PIC32MZ2048ECH064T-I/MR ピン構成
| ピン 1 | RPB0/AN0 — Remappable pin B0 / Analog input 0 |
| ピン 2 | RPB1/AN1 — Remappable pin B1 / Analog input 1 |
| ピン 3 | RPB2/AN2 — Remappable pin B2 / Analog input 2 |
| ピン 4 | RPB3/AN3 — Remappable pin B3 / Analog input 3 |
| ピン 5 | RPB4/AN4 — Remappable pin B4 / Analog input 4 |
| ピン 6 | RPB5/AN5 — Remappable pin B5 / Analog input 5 |
| ピン 7 | RPB6/AN6 — Remappable pin B6 / Analog input 6 |
| ピン 8 | RPB7/AN7 — Remappable pin B7 / Analog input 7 |
| ピン 9 | VSS — Ground |
| ピン 10 | VDD — Core supply (3.3 V) |
| ピン 11 | RPC0 — Remappable pin C0 |
| ピン 12 | RPC1 — Remappable pin C1 |
| ピン 13 | RPC2 — Remappable pin C2 |
| ピン 14 | RPC3 — Remappable pin C3 |
| ピン 15 | RPC4 — Remappable pin C4 |
| ピン 16 | RPC5 — Remappable pin C5 |
| ピン 17 | RPC6 — Remappable pin C6 |
| ピン 18 | RPC7 — Remappable pin C7 |
| ピン 19 | VSS — Ground |
| ピン 20 | VDD — Core supply (3.3 V) |
| ピン 21 | RPD0 — Remappable pin D0 |
| ピン 22 | RPD1 — Remappable pin D1 |
| ピン 23 | RPD2 — Remappable pin D2 |
| ピン 24 | RPD3 — Remappable pin D3 |
| ピン 25 | RPD4 — Remappable pin D4 |
| ピン 26 | RPD5 — Remappable pin D5 |
| ピン 27 | RPD6 — Remappable pin D6 |
| ピン 28 | RPD7 — Remappable pin D7 |
| ピン 29 | RPE0 — Remappable pin E0 |
| ピン 30 | RPE1 — Remappable pin E1 |
| ピン 31 | RPE2 — Remappable pin E2 |
| ピン 32 | RPE3 — Remappable pin E3 |
| ピン 33 | RPE4 — Remappable pin E4 |
| ピン 34 | RPE5 — Remappable pin E5 |
| ピン 35 | VSS — Ground |
| ピン 36 | VDD — Core supply (3.3 V) |
| ピン 37 | RPF0 — Remappable pin F0 |
| ピン 38 | RPF1 — Remappable pin F1 |
| ピン 39 | RPF2 — Remappable pin F2 |
| ピン 40 | RPF3 — Remappable pin F3 |
| ピン 41 | RPF4 — Remappable pin F4 |
| ピン 42 | RPF5 — Remappable pin F5 |
| ピン 43 | RPF6 — Remappable pin F6 |
| ピン 44 | RPF7 — Remappable pin F7 |
| ピン 45 | RPG0 — Remappable pin G0 |
| ピン 46 | RPG1 — Remappable pin G1 |
| ピン 47 | RPG2 — Remappable pin G2 |
| ピン 48 | RPG3 — Remappable pin G3 |
| ピン 49 | RPG6 — Remappable pin G6 |
| ピン 50 | RPG7 — Remappable pin G7 |
| ピン 51 | RPG8 — Remappable pin G8 |
| ピン 52 | RPG9 — Remappable pin G9 |
| ピン 53 | AVDD — Analog supply (3.3 V) |
| ピン 54 | AVSS — Analog ground |
| ピン 55 | OSC1/CLKI — Crystal oscillator input or external clock |
| ピン 56 | OSC2/CLKO — Crystal oscillator output |
| ピン 57 | SOSCI/RPC14 — Secondary oscillator input |
| ピン 58 | SOSCO/RPC15 — Secondary oscillator output |
| ピン 59 | MCLR — Master clear reset (active low) |
| ピン 60 | VDD — Core supply (3.3 V) |
| ピン 61 | VSS — Ground |
| ピン 62 | TMS — JTAG test mode select |
| ピン 63 | TCK — JTAG test clock |
| ピン 64 | TDO — JTAG test data out |
主な用途
PIC32MZ2048ECH064T-I/MR の用途: 6 件s: Industrial Ethernet Gateway / PLC, CAN-Based Motor Drive Controller, Connected IoT Edge Node / Sensor Hub, USB 2.0 High-Speed Device Controller, Automotive Infotainment Subsystem, Test & Measurement Instrumentation.
Industrial Ethernet Gateway / PLC
The PIC32MZ2048ECH064T-I/MR is purpose-built for industrial Ethernet gateways. Its integrated 10/100 Mbps MAC connects to an external PHY (such as Microchip KSZ8081) via MII/RMII for Modbus TCP, EtherNet/IP, or PROFINET protocol stacks. The 2 MB Flash comfortably hosts a full TCP/IP stack plus application logic, while the 200 MHz MIPS32 core handles real-time request processing at sub-millisecond latency. The -40C to +85C industrial temperature range supports factory-floor operation. Compared with discrete Ethernet implementations using SPI-attached controllers, this part saves BOM cost, PCB area, and reduces firmware complexity by exposing registers and DMA directly to the application.
おすすめ
CAN-Based Motor Drive Controller
For CAN 2.0B-controlled BLDC or stepper motor drives, the PIC32MZ2048ECH064T-I/MR delivers deterministic DSP-grade performance. The integrated CAN peripheral interfaces directly to external transceivers like the MCP2561 or TJA1050, eliminating the need for a separate MCU + CAN ASIC. The 200 MHz microAptiv core with DSP extensions executes field-oriented-control (FOC) algorithms in under 5 usec per PWM cycle, while 512 KB SRAM holds control-loop state and 2 MB Flash stores the full CANopen or J1939 stack. The 12-bit ADC at 5 MSPS samples three-phase currents simultaneously with hardware-triggered DMA, removing CPU overhead from critical sensing tasks.
おすすめ
Connected IoT Edge Node / Sensor Hub
The PIC32MZ2048ECH064T-I/MR is well-suited to connected edge devices that aggregate sensor data over Ethernet or CAN and forward it upstream. Designers leverage the 512 KB SRAM to buffer high-rate sensor streams (from SPI-attached IMUs, MEMS microphones, or analog front ends) before transmitting via Ethernet or USB. The 6 digital filters plus 32 voltage references simplify mixed-signal conditioning, and the +-2C accurate internal temperature sensor supports enclosure thermal monitoring without an external IC. Compared to lower-end Cortex-M0+ parts, the microAptiv's 200 MHz throughput runs lightweight TLS stacks at acceptable throughput for HTTPS push to the cloud.
おすすめ
USB 2.0 High-Speed Device Controller
In USB device-class applications (CDC, HID, MSD, audio), the PIC32MZ2048ECH064T-I/MR exposes an integrated USB 2.0 OTG High-Speed controller with on-chip PHY, eliminating external ULPI chips. The 200 MHz core runs USB stacks and concurrent application logic, while 512 KB SRAM accommodates double-buffered isochronous endpoints (e.g., 96 kHz audio streaming). Industrial temperature range supports USB-powered test instruments and instrumentation. Compared to MCUs requiring external USB PHYs, this part reduces BOM by ~$1.50 and simplifies the schematic. Designers can also operate the USB in host mode to interface Mass Storage or HID-class peripherals.
おすすめ
Automotive Infotainment Subsystem
For automotive-grade infotainment subsystems and instrument clusters, the PIC32MZ2048ECH064T-I/MR offers the industrial temperature variant (-40C to +85C) and rich connectivity needed for CAN, USB, and display driving. The 2 MB Flash holds CANoe-compatible J1939 stacks plus graphics assets, while the 12-bit ADC at 5 MSPS supports audio input conditioning. The Ethernet MAC enables 100 Mbps automotive Ethernet (with proper PHY). Note: for full AEC-Q100 qualification, designers should pair this part with AEC-Q100 external components. Compared with automotive-class MCUs from NXP, the PIC32MZ family provides a more accessible toolchain through MPLAB X IDE and Harmony 3 framework.
おすすめ
Test & Measurement Instrumentation
For handheld test instruments and lab equipment, the PIC32MZ2048ECH064T-I/MR combines precise analog with high-performance processing. The 12-bit 5 MSPS ADC captures fast transient signals, while the 32 voltage references and 2 analog comparators support threshold detection and signal conditioning. USB 2.0 High-Speed OTG connects to a host PC for data acquisition at 480 Mbps, while Ethernet enables remote control and SCPI-over-LAN. The 200 MHz core runs FFT-based spectrum analysis in real time. Compared to low-end Cortex-M parts, this PIC32MZ provides 4x the processing headroom and integrated USB HS that avoids external ULPI bridges.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: PIC32MZ2048ECH064T-I/MR — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | PIC32MZ2048ECH064-I/MR | PIC32MZ2048ECG064-I/MR | PIC32MZ1024ECH064-I/MR | PIC32MZ2048ECH064-I/PT | PIC32MZ2048ECG064T-I/MR | PIC32MX795F512LT-80V/MR |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | VQFN-64 (9x9 mm) | VQFN-64 (9x9 mm) - same | VQFN-64 (9x9 mm) - same | VQFN-64 (9x9 mm) - same | TQFP-64 - same pin count | VQFN-64 (9x9 mm) - same | VQFN-64 (9x9 mm) - same |
| Core Clock | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 80 MHz (-60%) |
| Program Flash | 2 MB | 2 MB | 2 MB | 1 MB (-50%) | 2 MB | 2 MB | 512 KB (-75%) |
| SRAM | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 128 KB (-75%) |
| Ethernet MAC | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps |
| CAN 2.0B | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| USB 2.0 HS OTG | Yes (High-Speed) | Yes (High-Speed) | Yes (High-Speed) | Yes (High-Speed) | Yes (High-Speed) | Yes (High-Speed) | USB FS (Full-Speed only) |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Packaging | Tape & Reel | Tray | Tray | Tray | Tray | Tape & Reel | Tape & Reel |
主な差別化要因
- Highest Flash density in the PIC32MZ 64-pin class （vs PIC32MZ1024ECH064-I/MR)
- 2.5x higher core throughput than PIC32MX family （vs PIC32MX795F512LT-80V/MR)
- Integrated Ethernet MAC and CAN vs no Ethernet （vs PIC32MZ2048EFM064-I/MR)
- Industrial temperature variant available without AEC-Q100 premium （vs Automotive AEC-Q100 qualified PIC32 variants)
設計ノート
The 64-pin VQFN package with exposed pad is rated for ~1.3 W steady-state dissipation only when the EP is soldered to at least 1 square inch of 2-oz copper pour on top and bottom layers, stitched with thermal vias. At 200 MHz with all I/O toggling, internal core dissipation alone reaches 0.5-0.7 W; if your application enables Ethernet, USB HS, and ADC concurrently, derate ambient by 15-20C or use the LQFP-64 variant on a larger PCB area. Always estimate junction temperature using TJ = TA + PD * theta_JA and verify against the 125C maximum.
Place all VDD pins (pins 10, 20, 36, 53, 60) decoupling capacitors within 3 mm of their respective pins. Use a 100 nF X7R 0402 ceramic on each VDD and a shared 4.7 uF X5R bulk capacitor near the package. For AVDD (pin 53), add a separate 100 nF + 10 uF RC filter (10 ohm + 10 uF) to isolate analog supply from digital switching noise. Keep the 25 MHz Ethernet PHY clock trace short and impedance-controlled (50 ohm) to avoid radiated emissions failing EN 55032.
Do not power the device with VDD below 2.3 V - the internal POR will not release and the JTAG IDCODE will read as 0x00000000, masking firmware issues. Always configure the FCR (Flash Control Register) wait-state bits to match SYSCLK: 0 wait states for SYSCLK <= 66 MHz, 1 for <=133 MHz, 2 for <=200 MHz. Forgetting this causes erratic execution and random HardFault-equivalent traps. Use the MPLAB XC32 compiler's -mprocessor=32MZ2048ECH064 flag to enable proper peripheral libraries.
The Ethernet MAC's MII/RMII traces to the external PHY must be length-matched within 50 mil (1.27 mm) for MII to meet the 25 MHz timing margin. Route RMII traces on the top layer with a continuous ground reference plane below; avoid crossing these traces with switching signals. For USB HS, the D+/D- differential pair must be 90 ohm differential, with traces no longer than 25 mm and a common-mode choke recommended for EMI compliance.
コンプライアンス情報
RoHS and REACH compliant per Microchip product page. Industrial temperature grade (I suffix) but NOT AEC-Q100 qualified - not for safety-critical automotive applications without external qualification. Halogen-free and lead-free per Microchip packaging specification.
