PIC32MZ2064DAL169-I/HF - 200MHz 32-bit MCU 2MB Flash LFBGA-169 | Microchip
部品番号: PIC32MZ2064DAL169-I/HF ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $14.85 | $14.85 |
| 10 | $13.62 | $136.20 |
| 100 | $12.41 | $1,241.00 |
| 500 | $11.3 | $5,650.00 |
| 1,000 | $10.45 | $10,450.00 |
PIC32MZ2064DAL169-I/HF 概要
A microcontroller (MCU) is a single-chip computer that integrates a processor core, program memory (Flash), data memory (SRAM), and a wide range of peripherals such as ADC, timers, communication controllers, and GPIOs. PIC32MZ DAL devices sit at the high end of Microchip's PIC32 line, with 32-bit MIPS cores and peripherals aimed at GUI designs, industrial HMI, and audio/video processing. Within the broader taxonomy they are members of the embedded microcontroller family -> 32-bit microcontroller -> graphics-enabled MCU -> semiconductor.
Key features of the PIC32MZ2064DAL169-I/HF include 2 MB Flash for code and graphics assets, 640 KB SRAM for frame buffers, a 12-bit 18 MSPS ADC supporting up to 45 analog channels, an integrated Graphics Processing Unit (GPU) with dedicated DDR2 controller, and a peripheral set that includes High-Speed USB 2.0, two CAN modules, multiple SPI/I2C/UART channels, and up to 9 PWM outputs. The card runs at up to 200 MHz with MIPS32 microAptiv instructions, delivering MPU-class performance while remaining programmable as a single-chip MCU.
In terms of architecture, the device couples a single-core MIPS32 microAptiv with a parallel GPU/display pipeline. The integrated DDR2 controller supports up to 32 MB on-chip or 128 MB externally addressable memory, freeing the main bus for CPU-bound tasks. The 12-bit 18 MSPS ADC is suitable for general analog sensing, while the graphics block accelerates JPEG decoding, alpha blending, and LCD/3D rendering without burdening the CPU.
Key applications include industrial control HMI panels, medical patient monitors, automotive infotainment clusters, point-of-sale terminals, and graphics-rich embedded products. The wide peripheral mix and DDR2 memory support make it ideal for systems with TFT LCDs needing fast image processing.
Design tip - the LFBGA-169 package requires careful PCB design with matched-impedance routing and proper DDR2 trace length matching for reliable high-speed operation.
This page synthesizes distributor stock and pricing, drop-in alternative MCUs from the PIC32MZ family, and practical design notes not found in the manufacturer datasheet alone.
ドロップイン代替品: PIC32MZ2064DAL169-I/HF — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: PIC32MZ2064DAL169-I/HF （同一形状・フットプリント） — 相違点: Core Architecture, Operating Temperature, USB, CAN, Graphics Controller.
クイック比較ツール — 並列比較する代替部品を選択:
PIC32MZ2064DAK169-I/HF
✅ ドロップイン✓ 在庫あり
$12.8 / 個
データシートを見る →PIC32MZ2064DAL169-V/HF
✅ ドロップイン📋 参考代替品（カタログ未掲載）
PIC32MZ2064DAK169-V/HF
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$9.78 / 個
データシートを見る →PIC32MZ2064DAK169T-I/HF
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$13.5 / 個
データシートを見る →PIC32MZ2064DAA169-I/HF
✅ ドロップイン📋 参考代替品（カタログ未掲載）
PIC32MZ1064DAA169-I/HF
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$12.1 / 個
データシートを見る →PIC32MZ2064DAL169-I/HF 最大定格＆電気的特性
| Core Architecture | MIPS32 microAptiv (32-bit) |
| Maximum CPU Frequency | 200 MHz |
| Program Memory (Flash) | 2 MB (2M x 8) |
| Data Memory (SRAM) | 640 KB |
| External Memory Interface | DDR2 DRAM, up to 32 MB on-chip / 128 MB externally addressable |
| パッケージ | 169-pin LFBGA (11x11 mm) |
| 実装タイプ | Surface Mount |
| 動作温度範囲 | -40 C to +85 C (Industrial, 'I' suffix) |
| ADC | 12-bit, 18 MSPS, up to 45 analog inputs |
| Graphics Controller | Integrated, with dedicated GPU |
| Digital I/O Pins | 120 |
| External Bus Width | 16-bit data, 24-bit address |
| USB | USB 2.0 High-Speed |
| CAN Modules | Yes |
| PWM Channels | Yes (peripheral) |
| DMA Channels | Yes |
| RoHS ステータス | Compliant |
| MSLレベル | 3 (per JEDEC J-STD-020, reflow at 260 C) |
PIC32MZ2064DAL169-I/HF 169-pin lfbga (11x11 mm) ピン配置ガイド
PIC32MZ2064DAL169-I/HF (169-pin lfbga (11x11 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: PIC32MZ2064DAL169-I/HF.
詳細は データシート をご参照ください。
主な用途
PIC32MZ2064DAL169-I/HF の用途: 7 件s: Industrial HMI / Operator Panels, Medical Patient Monitors, Automotive Infotainment Clusters, Point-of-Sale Terminals, Graphics-Rich Embedded IoT Gateways, Industrial Test & Measurement Front Panels, Smart Appliance Control Boards.
Industrial HMI / Operator Panels
The PIC32MZ2064DAL169-I/HF's 200 MHz MIPS32 core, 2 MB Flash, and 640 KB SRAM make it well-suited to drive TFT LCD panels in industrial HMI systems. The integrated DDR2 controller supports up to 32 MB on-chip or 128 MB external memory, leaving ample headroom for frame storage on QVGA to WVGA displays. Its 120 GPIO pins simplify interfacing to keypads, encoders, and digital sensors typical of factory-floor operator panels. Engineers benefit from Microchip's MPLAB Harmony stacks for touch and GUI libraries. Compared to a Cortex-M4 + external SDRAM approach, the PIC32MZ DAL combines CPU, GPU, and DDR2 in one package, reducing BOM cost and PCB area.
おすすめ
Medical Patient Monitors
Medical patient monitors demand high-resolution graphics for waveforms and numerics, plus precise analog channels for ECG, SpO2, and temperature sensors. The PIC32MZ2064DAL169-I/HF delivers a 12-bit 18 MSPS ADC with up to 45 analog inputs, suitable for multi-parameter vital-sign acquisition. Its 2 MB Flash stores UI assets, fonts, and waveform templates, while 640 KB SRAM serves as the frame buffer. The integrated GPU accelerates 2D rendering, easing CPU load for real-time waveforms. Industrial-grade temperature (-40 C to +85 C) supports hospital and clinical environments. For higher-reliability designs, the V-suffix variant extends to +105 C.
おすすめ
Automotive Infotainment Clusters
Automotive instrument clusters combine animated graphics with CAN bus connectivity to powertrain ECUs. The PIC32MZ2064DAL169-I/HF integrates two CAN modules and an integrated GPU suitable for driving animated gauges and telltales. Its 200 MHz MIPS32 core and 2 MB Flash handle real-time graphics while CAN traffic flows. The DDR2 controller supports up to 128 MB external, ideal for storing map or 3D-model data. For under-hood or direct-sunlight instrument pods, the V-suffix variant extends operating temperature to +105 C. The 12-bit ADC handles battery voltage and temperature monitoring. AEC-Q100 qualification status is not stated in the provided data.
おすすめ
Point-of-Sale Terminals
Point-of-sale (POS) terminals combine a touchscreen, payment peripherals, and secure connectivity. The PIC32MZ2064DAL169-I/HF's HS USB 2.0 interface connects to PIN pads and printers while its graphics engine drives color touch displays up to WVGA resolution. The 12-bit ADC reads battery voltage on portable terminals. With 640 KB SRAM for frame buffer plus 2 MB Flash for firmware and UI assets, the device is well-matched to mid-range POS products. CAN support is unused here but adds flexibility for retail back-end systems.
おすすめ
Graphics-Rich Embedded IoT Gateways
IoT gateways with local graphics displays benefit from the PIC32MZ2064DAL169-I/HF's integrated GPU and DDR2 controller. The 200 MHz core handles TLS encryption for MQTT/HTTPS, and the 2 MB Flash hosts a small web server. The integrated 12-bit ADC monitors analog sensors (temperature, humidity), while HS USB and CAN serve local peripherals. Compared to a Linux-driven gateway MCU, this device boots in microseconds from Flash, ideal for instant-on displays. Lower-cost variants in the same family serve entry-level gateways.
おすすめ
Industrial Test & Measurement Front Panels
Bench-top test equipment such as oscilloscopes, signal generators, and power supplies integrate keypads, encoders, and color TFTs. The PIC32MZ2064DAL169-I/HF's 120 GPIOs handle key matrices and rotary encoders, while the 12-bit 18 MSPS ADC supports front-panel calibration. The integrated GPU drives waveform preview displays, and DDR2 memory (32 MB on-chip or 128 MB external) holds reference waveforms. Industrial temperature grade suits it to typical lab environments. Compared to an FPGA + soft-core approach, this device simplifies BOM and shortens development with Microchip's MPLAB toolchain.
おすすめ
Smart Appliance Control Boards
Smart appliances integrate Wi-Fi/BLE modules and a TFT or segment LCD. The PIC32MZ2064DAL169-I/HF's high GPIO count (120) drives keypad scanning, LED arrays, and relay controls for washing machines, ovens, and HVAC systems. The 12-bit ADC reads temperature sensors (NTC) and humidity sensors, while HS USB and CAN support service interfaces. Its 2 MB Flash stores UI assets for premium appliances. Industrial temp rating suits indoor appliance use. Compared to a Cortex-M0 + display driver IC combo, this device integrates CPU, GPU, and ADC in one chip.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: PIC32MZ2064DAL169-I/HF — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | PIC32MZ2064DAK169-I/HF | PIC32MZ2064DAL169-V/HF | PIC32MZ2064DAK169-V/HF | PIC32MZ2064DAA169-I/HF |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 169-LFBGA (11x11 mm) | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same |
| Core Speed | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 2 MB | 2 MB | 2 MB | 2 MB | 2 MB |
| External DDR2 Addressing | 32 MB on-chip / 128 MB external | 128 MB external | 32 MB on-chip / 128 MB external | 128 MB external | 0 MB (no DDR2 controller) |
| Operating Temperature | -40 C to +85 C (Industrial) | -40 C to +85 C | -40 C to +105 C (Extended) | -40 C to +105 C | -40 C to +85 C |
| GPIO Count | 120 | 120 | 120 | 120 | 120 |
| ADC | 12-bit, 18 MSPS, up to 45 channels | 12-bit, 18 MSPS, 45 channels | 12-bit, 18 MSPS, 45 channels | 12-bit, 18 MSPS, 45 channels | 12-bit, 18 MSPS, 45 channels |
| USB | USB 2.0 High-Speed | USB 2.0 High-Speed | USB 2.0 High-Speed | USB 2.0 High-Speed | USB 2.0 High-Speed |
主な差別化要因
- On-chip DDR2 controller with up to 128 MB external addressing （vs PIC32MZ2064DAA169-I/HF)
- Same-die V-suffix variant available for extended temperature （vs PIC32MZ2064DAK169-I/HF)
- 2 MB Flash + 640 KB SRAM integrated （vs PIC32MZ1064DAA169-I/HF)
設計ノート
The LFBGA-169 package requires 4-6 layer PCB stack-up with controlled-impedance routing for DDR2 signals. Use matched-length trace pairs (within 25 mil) for DDR2 DQ/DQS lanes. Place decoupling capacitors (100 nF + 10 uF) within 1 mm of each power pin pair. Avoid routing DDR2 traces across power plane splits to prevent reflections. Reference Microchip AN2667 for DDR2 layout guidelines.
Estimated: at 200 MHz with full peripheral use, core power dissipation reaches 1.0-1.4 W. The LFBGA-169 has theta_JA of approximately 24 C/W on a standard JEDEC 4-layer test board with no airflow. For continuous operation at +85 C ambient, a thermal via array under the center balls is recommended to keep junction below +125 C. For elevated temperature enclosures, specify the V-suffix variant rated to +105 C.
Do not confuse the L (DAL suffix = 32 MB DDR2) with K (DAK suffix = 128 MB DDR2) - they share the same LFBGA-169 footprint but require different firmware memory init sequences. Also note the 'I' (industrial -40 C to +85 C) vs 'V' (extended -40 C to +105 C) temperature grades. The trailing 'T' in PIC32MZ2064DAK169T-I/HF indicates tape-and-reel packaging, not a different silicon revision.
Place the 12-bit ADC reference capacitor (VREF+) close to the dedicated pin with a 100 nF ceramic bypass. For high-ADC accuracy, isolate the analog supply (AVDD) from the noisy digital supply (DVDD) using a ferrite bead and separate PCB planes. Use guard rings around analog input traces to minimize digital crosstalk. Reference Microchip AN2668 for ADC layout best practices on PIC32MZ.
コンプライアンス情報
RoHS and lead-free confirmed per Microchip product page. AEC-Q100 automotive qualification status not stated in provided data; the V-suffix is not equivalent to AEC-Q100 qualification - check Microchip product specs if automotive is required.