RTAX4000SL-1CG1272E - 4M-Gate Rad-Tolerant FPGA | Microchip
部品番号: RTAX4000SL-1CG1272E ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
RTAX4000SL-1CG1272E 概要
A radiation-tolerant FPGA is a field-programmable gate array engineered to survive the ionizing radiation environment of space: it combines inherent single-event upset (SEU) immunity with hardening-by-process and hardening-by-design techniques. Within the power-management hierarchy of spacecraft avionics, this device family serves as the on-board data-processing, telemetry, and payload-control element between the onboard computer and mission peripherals.
Key features of the RTAX-SL family include SEU-hardened flip-flops that largely eliminate the need for triple-module redundancy (TMR), single-chip operation without the external configuration device required by SRAM FPGAs, and live-at-power-up behavior that makes the logic functional immediately after power application. The device offers 840 user I/Os in this package and supports the Axcelerator-style antifuse-like architecture reprogrammed at manufacturing via a one-time programmed metal layer.
Technically, the RTAX4000SL embeds 40,320 core cells organized into VersaTiles, with dedicated embedded SRAM blocks and clock-management resources from the RTAX-DSP heritage. The 'E' suffix denotes the extended -55C to +125C operating temperature range required for deep-space and defense missions; the CCGA 1272 column package provides reliable solder-column attachment for ceramic board assembly and enhanced thermal cycling robustness.
Typical applications include satellite onboard-computer data processing, payload data-handling and compression, spacecraft bus avionics, and launch-vehicle flight-control electronics, where the SEU-hardened registers reduce software overhead and simplify system-level TMR schemes.
When designing with this device, plan power-supply sequencing between the 1.5 V core and 2.5 V I/O rails, and allocate board area for the 37.5 mm square ceramic package with its substantial mass during vibration qualification.
This page synthesizes verified distributor data, drop-in family alternatives, and practical design guidance not found in the manufacturer datasheet.
ドロップイン代替品: RTAX4000SL-1CG1272E — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: RTAX4000SL-1CG1272E （同一形状・フットプリント） — 相違点: Configuration, Family, Package, Logic Cells, Radiation Tolerance.
クイック比較ツール — 並列比較する代替部品を選択:
RTAX4000SL-1CG1272V
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →RTAX4000SL-1CGS1272E
✅ ドロップイン📋 参考代替品（カタログ未掲載）
RTAX4000SL-1CG1272PROTO
✅ ドロップイン📋 参考代替品（カタログ未掲載）
RTAX4000SL-CG1272B
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →RTAX4000SL-LG1272V
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →RTAX2000SL-1CG1152V
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →RTAX4000SL-1CG1272E 最大定格＆電気的特性
| Family | RTAX-SL (Radiation-Tolerant FPGA) |
| System Gates | 4,000,000 |
| Logic Cells | 40,320 |
| Logic Elements / CLBs | 40,320 |
| Process Technology | 0.15 um CMOS |
| Core Voltage | 1.5 V |
| Package Type | CCGA-1272 (Ceramic Column Grid Array) |
| ピン数 | 1272 |
| Number of I/Os | 840 |
| 動作温度 | -55C to +125C |
| Minimum Operating Temperature | -55 C |
| Package Width | 37.5 mm |
| Logic Family | CMOS |
| SEU Immunity | SEU rate < 10^-10 errors/bit-day (per family datasheet) |
| 実装タイプ | Surface Mount |
| Programming | One-time programmable at manufacturing (single-chip, live-at-power-up) |
| Radiation Tolerance | Radiation-tolerant (SEU-hardened registers) |
RTAX4000SL-1CG1272E 37.5 mm ピン配置ガイド
RTAX4000SL-1CG1272E (37.5 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: RTAX4000SL-1CG1272E.
詳細は データシート をご参照ください。
主な用途
RTAX4000SL-1CG1272E の用途: 6 件s: Satellite Onboard Computer Data Processing, Payload Data Handling and Compression, Spacecraft Bus Avionics, Launch Vehicle Flight Control Electronics, Space-Grade Prototyping and Migration, Deep-Space Instrumentation and Defense Electronics.
Satellite Onboard Computer Data Processing
The RTAX4000SL-1CG1272E serves as the main data-processing fabric in satellite onboard computers, where 4 M gates and 40,320 logic cells implement housekeeping, command decoding, memory controllers, and bus interfaces in one live-at-power-up chip. Its SEU-hardened registers keep single-event-upset rates below 10^-10 errors per bit-day per the family datasheet, eliminating most external triple-module redundancy and reducing software error-handling overhead. In a typical architecture the FPGA sits between a rad-hardened processor and spacecraft buses, using up to 840 user I/Os of the CCGA-1272 package for wide parallel interfaces. The -55C to +125C 'E' grade covers launch and eclipse thermal cycles, while the ceramic column package withstands vibration and CTE stress over mission life.
おすすめ
Payload Data Handling and Compression
High-data-rate imaging and SAR payloads require framing, buffering, and lossless compression logic close to the sensor, and the RTAX4000SL-1CG1272E provides 4 M gates of fabric with embedded SRAM blocks for FIFOs and line buffers. The 840 available I/Os absorb wide sensor parallel buses, while SEU-hardened flip-flops protect compression state machines in orbit, keeping error rates below 10^-10 errors per bit-day without heavy TMR. Implementing CCSDS packetization on the same chip removes external glue logic. The 1.5 V core delivers low dynamic power for power-limited satellites, and the CCGA-1272 ceramic package with -55C to +125C operation survives the thermal profile of eclipse cycles and launch vibration environments.
おすすめ
Spacecraft Bus Avionics
Spacecraft bus avionics, including attitude control, power distribution control, and telemetry aggregation, benefit from the RTAX4000SL-1CG1272E's single-chip, live-at-power-up behavior, which guarantees deterministic logic at power application without an external boot device. The 40,320 logic cells implement motor PWM, MIL-STD-1553 style interfaces, and redundant sensor voting, while SEU-hardened registers provide intrinsic upset immunity to mission LET thresholds. The 'E' temperature grade (-55C to +125C) matches avionics bay environments, and the 37.5 mm CCGA-1272 package supports reliable ceramic assembly with solder columns that tolerate CTE mismatch across thermal cycling. Designers should plan the 1.5 V core rail sequencing during power-distribution qualification.
おすすめ
Launch Vehicle Flight Control Electronics
Flight-control electronics on launch vehicles face minutes of extreme vibration plus radiation from high-altitude flight, making the RTAX4000SL-1CG1272E's ceramic column package and SEU-hardened fabric a strong fit. The 4 M gate capacity implements redundant sensor fusion, voting logic, and actuator control loops, with 840 I/Os of the CCGA-1272 package accommodating triple-redundant input channels. The -55C to +125C 'E' grade covers pre-launch conditioning and ascent thermal excursions, and the solder-column attachment of the 37.5 mm package is more forgiving of board flexure than ball-array equivalents during shock events. Its live-at-power-up operation ensures control logic is armed immediately at ignition-power application without configuration latency.
おすすめ
Space-Grade Prototyping and Migration
Microchip's RTAX methodology supports prototyping flight designs on footprint-compatible devices before committing to one-time-programmed flight silicon. The RTAX4000SL-1CG1272PROTO prototype unit shares the die and CCGA-1272 footprint of the flight RTAX4000SL-1CG1272E, allowing EDIF-netlist and pinout conversion onto adaptor boards per the manufacturer's Prototyping for RTAX-S and RTAX-SL application note. Teams verify timing, power, and SEU-mitigation strategies on the prototype, then migrate to the 'E'-grade extended-temperature flight part with no PCB respin. The 4 M gate, 40,320-cell capacity of both devices keeps the netlist identical, and the -55C to +125C flight grade carries the qualification through flight lot acceptance.
おすすめ
Deep-Space Instrumentation and Defense Electronics
Deep-space probes and strategic defense electronics operate where repair is impossible and radiation flux is highest, so the RTAX4000SL-1CG1272E's combination of 4 M gates, SEU rate below 10^-10 errors per bit-day, and -55C to +125C 'E' screening is directly aligned with those environments. Instrument control, science-data framing, and safe-mode sequencers implemented in the 40,320-cell fabric benefit from hardened registers that survive heavy-ion events without configuration scrubbing. The hermetic CCGA-1272 ceramic package resists outgassing and moisture, meeting the assembly practices of high-reliability space hardware. Engineers should budget board area and stiffness for the 37.5 mm package and validate power dissipation of the 1.5 V core over the mission temperature profile.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: RTAX4000SL-1CG1272E — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | RTAX4000SL-1CG1272V | RTAX4000SL-1CGS1272E | RTAX4000SL-1CG1272PROTO | RTAX2000SL-1CG1152V |
|---|---|---|---|---|---|
| Package | CCGA-1272 | CCGA-1272 - same | CGS1272 ceramic column - same footprint | CCGA-1272 - same | CCGA-1152 - smaller footprint |
| Brand | Microchip Technology (Actel) | Microchip Technology (Actel) | Microchip Technology (Actel) | Microchip Technology (Actel) | Microchip Technology (Actel) |
| System Gates | 4,000,000 | 4,000,000 | 4,000,000 | 4,000,000 | 2,000,000 |
| Logic Cells | 40,320 | 40,320 | 40,320 | 40,320 | 21,504 |
| Operating Temperature | -55C to +125C (E grade) | Standard (V) grade | -55C to +125C | Prototype screening | Standard (V) grade |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| SEU Hardening | SEU-hardened registers, SEU rate < 10^-10 | Same SEU-hardened fabric | Same SEU-hardened fabric | Same die (prototype use only) | Same SEU-hardened fabric |
主な差別化要因
- Extended temperature screening for space flight （vs RTAX4000SL-1CG1272V)
- Flight-ready vs prototype silicon （vs RTAX4000SL-1CG1272PROTO)
- Double the logic capacity of the smaller family member （vs RTAX2000SL-1CG1152V)
設計ノート
The CCGA-1272 package measures 37.5 mm and uses solder columns rather than solder balls. Provide stiff, multi-point mechanical support under the package footprint on the PCB to control board flexure during launch vibration, and use assembly land patterns and reflow profiles per Microchip's ceramic column assembly guidance. Solder columns tolerate CTE mismatch between the ceramic package and organic PCB far better than BGA spheres, which matters for repeated -55C to +125C thermal cycling in flight hardware.
The RTAX4000SL operates from a 1.5 V core with separate I/O supply rails (2.5 V I/O per the RTAX-S/SL family architecture). Plan a clean, well-decoupled 1.5 V rail with local bulk and high-frequency ceramic capacitance at the 1272-pin package, and respect any power-up sequencing requirements between core and I/O rails described in the family datasheet. Live-at-power-up operation means logic is functional immediately once rails settle, so monitor supply ramp behavior during brownout testing to ensure the design always starts from a known state.
Do not substitute the standard-grade 'V' part for the extended-grade 'E' part in flight hardware without a formal deviation review: the -55C to +125C screening of the 'E' suffix exists specifically for space and defense environments. Also remember the RTAX-SL fabric is programmed at manufacturing (one-time programmed), so lock pin constraints and design freeze before ordering flight lots; use the RTAX4000SL-1CG1272PROTO and the manufacturer's footprint-compatible adaptor-board prototyping flow to verify the netlist first.
コンプライアンス情報
Compliance status not published in verified data as of 2026-09-02. Space-grade ceramic CCGA devices often use leaded high-temperature solder under RoHS exemptions; confirm with Microchip for your program documentation.
