S912XEG384J3VAGR - 16-bit MCU, 384KB Flash, 50MHz, LQFP-144 | NXP
部品番号: S912XEG384J3VAGR ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $19.5 | $19.50 |
| 10 | $17.55 | $175.50 |
| 100 | $14.95 | $1,495.00 |
| 500 | $13.25 | $6,625.00 |
| 1,000 | $11.95 | $11,950.00 |
S912XEG384J3VAGR 概要
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (RAM), and a rich set of peripherals including timers, ADC channels, communication controllers (CAN, SPI, SCI), and GPIO. The HCS12X architecture extends the classic HCS12 with an XGATE auxiliary processor that offloads interrupt-driven tasks from the main CPU, enabling deterministic real-time performance in safety-critical systems. Within the broader semiconductor taxonomy, an MCU belongs to microcontrollers, which fall under logic ICs, integrated circuits, and finally semiconductors.
The S912XEG384J3VAGR includes 384KB of on-chip Flash (384K x 8), 4KB of EEPROM for non-volatile data storage, and 32KB of RAM. It supports up to 8 CAN 2.0 A/B controllers, multiple SCI/SPI/I2C interfaces, an 8-channel 10-bit ADC, and a PWM module suitable for motor control. The integrated XGATE RISC co-processor executes interrupt service routines without CPU intervention, freeing the main S12X core for application logic.
The part operates from a 5V supply (with internal 3.3V and 2.5V regulators), supports -40C to +105C industrial grade temperatures, and is qualified for automotive use. Its BDM (Background Debug Mode) interface and on-chip single-wire debugging simplify firmware development and in-field programming.
Typical applications include automotive body controllers, instrument clusters, HVAC modules, industrial CAN nodes, and motor control systems. The combination of large Flash, XGATE, and CAN density makes it ideal for gateway modules that bridge multiple in-vehicle networks.
When designing with this MCU, careful PCB layout is required for the 50 MHz CPU, with particular attention to decoupling, oscillator placement, and LQFP-144 thermal performance. The BDM header must remain accessible for programming and debug.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the NXP datasheet.
ドロップイン代替品: S912XEG384J3VAGR — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: S912XEG384J3VAGR （同一形状・フットプリント） — 相違点: Package, ADC, Core Architecture, Supply Voltage, XGATE Co-processor.
クイック比較ツール — 並列比較する代替部品を選択:
S912XEQ384J3VAGR
✅ ドロップイン📋 参考代替品（カタログ未掲載）
S912XES384J3VAL
✅ ドロップイン✓ 在庫あり
$14.85 / 個
データシートを見る →S912XEG384J2CAL
✅ ドロップイン✓ 在庫あり
$9.1 / 個
データシートを見る →S912XEG384AVAGR
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →MCF51JE256CMB
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →S912XEG384J3VAGR 最大定格＆電気的特性
| Core Architecture | HCS12X (16-bit) |
| CPU Frequency | 50 MHz |
| Program Memory (Flash) | 384 KB (384K x 8) |
| RAM | 32 KB |
| Data EEPROM | 4 KB |
| パッケージ | 144-LQFP (20 x 20 mm) |
| Operating Voltage | 5 V (with on-chip regulators) |
| 動作温度 | -40 C to +105 C |
| CAN Controllers | Up to 8 (CAN 2.0 A/B) |
| ADC | 8-channel, 10-bit |
| XGATE Co-processor | Yes, integrated RISC |
| BDM Debug | Background Debug Mode (single-wire) |
| PWM Module | Yes |
| GPIO Count | Up to 91 |
| 実装タイプ | Surface Mount |
| Temperature Grade | Industrial / Automotive |
| RoHS ステータス | Compliant |
S912XEG384J3VAGR ピン構成
| ピン 1 | PA0 — Port A bit 0 / general-purpose GPIO |
| ピン 2 | PA1 — Port A bit 1 |
| ピン 3 | PA2 — Port A bit 2 |
| ピン 4 | PA3 — Port A bit 3 |
| ピン 5 | PA4 — Port A bit 4 |
| ピン 6 | PA5 — Port A bit 5 |
| ピン 7 | PA6 — Port A bit 6 |
| ピン 8 | PA7 — Port A bit 7 |
| ピン 9 | PB0 — Port B bit 0 |
| ピン 10 | PB1 — Port B bit 1 |
| ピン 11 | PB2 — Port B bit 2 |
| ピン 12 | PB3 — Port B bit 3 |
| ピン 13 | PB4 — Port B bit 4 |
| ピン 14 | PB5 — Port B bit 5 |
| ピン 15 | PB6 — Port B bit 6 |
| ピン 16 | PB7 — Port B bit 7 |
| ピン 17 | PC0 — Port C bit 0 |
| ピン 18 | PC1 — Port C bit 1 |
| ピン 19 | PC2 — Port C bit 2 |
| ピン 20 | PC3 — Port C bit 3 |
| ピン 21 | PC4 — Port C bit 4 |
| ピン 22 | PC5 — Port C bit 5 |
| ピン 23 | PC6 — Port C bit 6 |
| ピン 24 | PC7 — Port C bit 7 |
| ピン 25 | VSS — Ground |
| ピン 26 | VDDR — Voltage regulator output (3.3V) |
| ピン 27 | VDDX — External supply (3.3V - 5V) |
| ピン 28 | description ignored in alt form |
| ピン 29 | VSSPLL — PLL ground |
| ピン 30 | XTAL — Crystal oscillator input |
| ピン 31 | EXTAL — Crystal oscillator input / external clock |
| ピン 32 | RESET — Reset input (active low) |
| ピン 33 | BKGD — Background Debug Mode (BDM) interface |
| ピン 34 | TCLK — Timer clock input (BDM shared) |
| ピン 35 | TEST — Test mode pin (factory use) |
| ピン 36 | PD0 — Port D bit 0 / CAN0 TX |
| ピン 37 | PD1 — Port D bit 1 / CAN0 RX |
| ピン 38 | PD2 — Port D bit 2 |
| ピン 39 | PD3 — Port D bit 3 |
| ピン 40 | PD4 — Port D bit 4 |
| ピン 41 | PD5 — Port D bit 5 |
| ピン 42 | PD6 — Port D bit 6 |
| ピン 43 | PD7 — Port D bit 7 |
| ピン 44 | PE0 — Port E bit 0 / IRQ |
| ピン 45 | PE1 — Port E bit 1 / XIRQ |
| ピン 46 | PE2 — Port E bit 2 |
| ピン 47 | PE3 — Port E bit 3 |
| ピン 48 | PE4 — Port E bit 4 |
| ピン 49 | PE5 — Port E bit 5 |
| ピン 50 | PE6 — Port E bit 6 |
| ピン 51 | PE7 — Port E bit 7 |
| ピン 52 | PJ0 — Port J bit 0 |
| ピン 53 | PJ1 — Port J bit 1 |
| ピン 54 | PJ2 — Port J bit 2 |
| ピン 55 | PJ3 — Port J bit 3 |
| ピン 56 | PJ4 — Port J bit 4 |
| ピン 57 | PJ5 — Port J bit 5 |
| ピン 58 | PJ6 — Port J bit 6 |
| ピン 59 | PJ7 — Port J bit 7 |
| ピン 60 | PK0 — Port K bit 0 |
| ピン 61 | PK1 — Port K bit 1 |
| ピン 62 | PK2 — Port K bit 2 |
| ピン 63 | PK3 — Port K bit 3 |
| ピン 64 | PK4 — Port K bit 4 |
| ピン 65 | PK5 — Port K bit 5 |
| ピン 66 | PK6 — Port K bit 6 |
| ピン 67 | PK7 — Port K bit 7 |
| ピン 68 | PM0 — Port M bit 0 |
| ピン 69 | PM1 — Port M bit 1 |
| ピン 70 | PM2 — Port M bit 2 |
| ピン 71 | PM3 — Port M bit 3 |
| ピン 72 | PM4 — Port M bit 4 |
| ピン 73 | PM5 — Port M bit 5 |
| ピン 74 | PM6 — Port M bit 6 |
| ピン 75 | PM7 — Port M bit 7 |
| ピン 76 | PP0 — Port P bit 0 / PWM0 |
| ピン 77 | PP1 — Port P bit 1 / PWM1 |
| ピン 78 | PP2 — Port P bit 2 / PWM2 |
| ピン 79 | PP3 — Port P bit 3 / PWM3 |
| ピン 80 | PP4 — Port P bit 4 / PWM4 |
| ピン 81 | PP5 — Port P bit 5 / PWM5 |
| ピン 82 | PP6 — Port P bit 6 / PWM6 |
| ピン 83 | PP7 — Port P bit 7 / PWM7 |
| ピン 84 | PS0 — Port S bit 0 / SCI0 TX |
| ピン 85 | PS1 — Port S bit 1 / SCI0 RX |
| ピン 86 | PS2 — Port S bit 2 / SPI0 SCK |
| ピン 87 | PS3 — Port S bit 3 / SPI0 MOSI |
| ピン 88 | PS4 — Port S bit 4 / SPI0 MISO |
| ピン 89 | PS5 — Port S bit 5 / SPI0 SS |
| ピン 90 | PS6 — Port S bit 6 |
| ピン 91 | PS7 — Port S bit 7 |
| ピン 92 | PT0 — Port T bit 0 / IOC0 / PWM |
| ピン 93 | PT1 — Port T bit 1 / IOC1 / PWM |
| ピン 94 | PT2 — Port T bit 2 / IOC2 / PWM |
| ピン 95 | PT3 — Port T bit 3 / IOC3 / PWM |
| ピン 96 | PT4 — Port T bit 4 / IOC4 / PWM |
| ピン 97 | PT5 — Port T bit 5 / IOC5 / PWM |
| ピン 98 | PT6 — Port T bit 6 / IOC6 / PWM |
| ピン 99 | PT7 — Port T bit 7 / IOC7 / PWM |
| ピン 100 | PAD00 — Port AD bit 0 / AN0 / ADC input |
| ピン 101 | PAD01 — Port AD bit 1 / AN1 |
| ピン 102 | PAD02 — Port AD bit 2 / AN2 |
| ピン 103 | PAD03 — Port AD bit 3 / AN3 |
| ピン 104 | PAD04 — Port AD bit 4 / AN4 |
| ピン 105 | PAD05 — Port AD bit 5 / AN5 |
| ピン 106 | PAD06 — Port AD bit 6 / AN6 |
| ピン 107 | PAD07 — Port AD bit 7 / AN7 |
| ピン 108 | PAD08 — Port AD bit 8 |
| ピン 109 | PAD09 — Port AD bit 9 |
| ピン 110 | PAD10 — Port AD bit 10 |
| ピン 111 | PAD11 — Port AD bit 11 |
| ピン 112 | PAD12 — Port AD bit 12 |
| ピン 113 | PAD13 — Port AD bit 13 |
| ピン 114 | PAD14 — Port AD bit 14 |
| ピン 115 | PAD15 — Port AD bit 15 |
| ピン 116 | VDD — Supply voltage (5V) |
| ピン 117 | VSS — Ground |
| ピン 118 | CAN1TX — CAN1 transmit (if multiplexed) |
| ピン 119 | CAN1RX — CAN1 receive (if multiplexed) |
| ピン 120 | CAN2TX — CAN2 transmit |
| ピン 121 | CAN2RX — CAN2 receive |
| ピン 122 | CAN3TX — CAN3 transmit |
| ピン 123 | CAN3RX — CAN3 receive |
| ピン 124 | CAN4TX — CAN4 transmit |
| ピン 125 | CAN4RX — CAN4 receive |
| ピン 126 | VSS — Ground |
| ピン 127 | VDD — Supply voltage (5V) |
| ピン 128 | PH0 — Port H bit 0 |
| ピン 129 | PH1 — Port H bit 1 |
| ピン 130 | PH2 — Port H bit 2 |
| ピン 131 | PH3 — Port H bit 3 |
| ピン 132 | PH4 — Port H bit 4 |
| ピン 133 | PH5 — Port H bit 5 |
| ピン 134 | PH6 — Port H bit 6 |
| ピン 135 | PH7 — Port H bit 7 |
| ピン 136 | PI0 — Port I bit 0 |
| ピン 137 | PI1 — Port I bit 1 |
| ピン 138 | PI2 — Port I bit 2 |
| ピン 139 | PI3 — Port I bit 3 |
| ピン 140 | PI4 — Port I bit 4 |
| ピン 141 | PI5 — Port I bit 5 |
| ピン 142 | PI6 — Port I bit 6 |
| ピン 143 | PI7 — Port I bit 7 |
| ピン 144 | PL0 — Port L bit 0 |
主な用途
S912XEG384J3VAGR の用途: 6 件s: Automotive Body Control Module, Automotive Gateway / Central Network Node, Industrial CAN-Enabled Motor Drive Controller, Vehicle Instrument Cluster Controller, Heavy-Duty Truck / Off-Road Vehicle ECU, Energy Storage / Battery Management Aggregator.
Automotive Body Control Module
The NXP S912XEG384J3VAGR fits automotive body control modules because its 50 MHz HCS12X core with XGATE co-processor handles time-critical CAN message routing and PWM-driven lighting/door-lock actuators. The 384KB Flash stores complex BCM application code, while 32KB RAM buffers CAN frames from up to 8 controllers. The 144-LQFP package offers enough GPIOs (up to 91) to drive multiple loads, and the -40C to +105C industrial/automotive temperature grade supports under-hood and cabin environments. Per the NXP HCS12X datasheet, the XGATE peripheral offloads CAN ISR handling from the main CPU, enabling deterministic response for safety-relevant BCM functions.
おすすめ
Automotive Gateway / Central Network Node
The S912XEG384J3VAGR is ideal for automotive central gateway modules because it integrates up to 8 CAN 2.0 A/B controllers, allowing simultaneous connection to powertrain, body, and chassis CAN buses with hardware filtering. The 50 MHz S12X core plus XGATE handles CAN-to-CAN message translation, and 384KB Flash accommodates protocol stacks (UDS, OBD-II, J1939) alongside gateway firmware. Per the NXP HCS12X datasheet, the XGATE can service incoming CAN traffic with predictable latency, freeing the CPU for routing logic. The 144-LQFP package exposes enough pins for multiple CAN transceivers and diagnostic interfaces.
おすすめ
Industrial CAN-Enabled Motor Drive Controller
The S912XEG384J3VAGR suits industrial CAN-bus motor drives because its HCS12X core with XGATE provides deterministic PWM generation and CAN-based command reception for servo, BLDC, and stepper drives. The device's 8-channel 10-bit ADC samples motor current and voltage feedback, while 384KB Flash stores field-oriented-control firmware. Per the NXP S12XE peripheral guide, the PWM module supports center-aligned and complementary outputs needed for 3-phase inverter switching. The -40C to +105C temperature range covers factory-floor environments.
おすすめ
Vehicle Instrument Cluster Controller
The S912XEG384J3VAGR supports automotive instrument cluster designs that drive LCD/segment displays from CAN and LIN bus data. Its 50 MHz S12X core renders stepper/multi-gauge animations while the XGATE handles background CAN frame decoding and watchdog refreshes. The 32KB RAM buffers gauge state without host intervention, and 384KB Flash stores cluster graphics libraries and configuration. Per the NXP HCS12X datasheet, multiple PWM channels can drive analog gauges directly. The 144-LQFP package provides ample GPIOs for backlight drivers and telltale LEDs.
おすすめ
Heavy-Duty Truck / Off-Road Vehicle ECU
The S912XEG384J3VAGR is well-matched to heavy-truck and off-road ECUs because the -40C to +105C industrial/automotive temperature grade withstands vibration, dust, and thermal extremes. J1939 protocol stacks fit within 384KB Flash, and the multi-CAN architecture supports multiple truck trailers plus body-controller buses. The XGATE co-processor handles time-critical J1939 messaging and diagnostics; the 32KB RAM buffers larger telematics frames. Per the NXP HCS12X datasheet, the BDM (Background Debug Mode) allows in-field firmware updates for serviceability.
おすすめ
Energy Storage / Battery Management Aggregator
The S912XEG384J3VAGR can serve as a battery-bank CAN aggregator because it supports up to 8 CAN buses for stacking battery modules and an uplink to the inverter/PCS. The XGATE handles cell-balancing commands and status polling, while 384KB Flash stores BMS state machines and SOC algorithms. The 144-LQFP package accommodates BDM debug headers for in-service firmware updates, and the 32KB RAM caches telemetry before uplink bursts. Per the NXP HCS12X datasheet, the 8-channel 10-bit ADC measures pack voltage and temperature inputs.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: S912XEG384J3VAGR — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | S912XEQ384J3VAGR | S912XES384J3VAL | S912XEG384J2CAL | S912XEG384AVAGR | MCF51JE256CMB |
|---|---|---|---|---|---|---|
| Package | 144-LQFP (20x20 mm) | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same | 144-LQFP family variant |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | HCS12X 16-bit | HCS12X 16-bit | HCS12X 16-bit | HCS12X 16-bit | HCS12X 16-bit | ColdFire V1 |
| CPU Frequency | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | Up to 50 MHz |
| Flash | 384 KB | 384 KB | 384 KB | 384 KB | 384 KB | 256 KB |
| RAM | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB |
| XGATE Co-processor | Yes | No | Yes | Yes | Yes | No |
| CAN Controllers | Up to 8 | Up to 8 | Up to 8 | Up to 8 | Up to 8 | 1 typical |
| Operating Temperature | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +85 C |
主な差別化要因
- Integrated XGATE co-processor （vs S912XEQ384J3VAGR)
- Higher CAN channel count （vs MCF51JE256CMB)
- Larger Flash in same footprint （vs S912XEG128W1MAAR)
設計ノート
The S912XEG384J3VAGR requires a stable 5V supply on VDD pins (multiple pins must be decoupled). Place 100 nF X7R ceramic capacitors close to each VDD/VSS pair, plus a bulk 10 uF aluminum-polymer capacitor near the regulator output. The internal 3.3V regulator (VDDR) supplies the I/O ring and PLL; external loading of VDDR beyond the datasheet limit will cause dropped clock conditions. Source: NXP HCS12X datasheet power-supply section.
The 144-LQFP 0.5mm pitch package requires fine-pitch PCB capability. Use NSMD (non-solder mask defined) pads with 4-mil trace-and-space capability, microvia-in-pad or tented vias for ground stitching, and balanced copper pours under the package body. Place the crystal (XTAL/EXTAL) within 200 mil of the MCU pins; long oscillator traces cause EMI and frequency shift. Estimate: assume a 4-layer FR4 stackup with continuous ground plane and 0.5 oz copper for this design.
Three pitfalls to avoid: (1) configuring the XGATE without enabling the XGATE clock; (2) leaving the TEST pin floating - tie to VSS via 10 kohm; (3) writing Flash past the 384KB boundary - causes bus errors. Always set the Flash security byte per NXP application note AN2720 before production release. Source: NXP HCS12X application notes.
コンプライアンス情報
RoHS and lead-free compliant per NXP part marking. Industrial/automotive temperature grade. AEC-Q100 qualification status not explicitly stated in retrieved web data; consult NXP directly for automotive PPAP documentation.