S9S08DZ16F1MLC - 16KB Flash 40MHz HCS08 MCU 32-LQFP | NXP
部品番号: S9S08DZ16F1MLC ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $6.18 | $6.18 |
| 10 | $5.55 | $55.50 |
| 100 | $4.78 | $478.00 |
| 500 | $4.12 | $2,060.00 |
| 1,000 | $3.65 | $3,650.00 |
S9S08DZ16F1MLC 概要
An MCU (microcontroller unit) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (RAM), and programmable peripheral interfaces. In the system hierarchy, MCUs sit between discrete logic ICs and full microprocessors: they replace multi-chip glue logic by embedding the processor, memory, and analog/digital peripherals on one die. The S08 family uses Freescale's enhanced HCS08 core, which adds the BGND instruction to the legacy HC08 instruction set while remaining object-code compatible, easing migration from older HC08 designs.
Key features of the S9S08DZ16F1MLC include a 40 MHz CPU with a 20 MHz bus, support for up to 32 interrupt and reset sources, an external oscillator interface, and operation from -40 C to +125 C (industrial/automotive ambient). The integrated 12-bit ADC and CAN interface make the part attractive for sensor-rich node designs, while the SCI/SPI/I2C set covers most low-speed peripheral connections without external glue logic.
The architecture is a Harvard-style design with separate Flash and RAM buses, allowing instruction fetch and data access to overlap. The HCS08 core implements a 16-bit stack pointer, indexed addressing with H:X, and a single BGND opcode for background-debug entry used by BDM (Background Debug Mode) probes such as NXP's USBMULTILINK.
Typical applications include automotive body controllers (CAN/LIN nodes), industrial sensor hubs (24-channel ADC fan-in), HVAC control panels, small appliance motor controllers, and low-pin-count embedded control boards. The wide supply range (2.7 V to 5.5 V) simplifies designs that must accept both 3.3 V and 5 V rails.
When designing with this MCU, budget Flash and RAM for the largest expected application footprint (16 KB / 1 KB), allocate one timer channel for the system tick, and reserve at least two I/O pins for the BDM debug interface to avoid losing in-system programming access.
This page synthesizes distributor pricing, same-family drop-in alternatives (S9S08DZ16F2MLC, S9S08DZ60F2MLC), and design notes not found in the manufacturer datasheet alone.
ドロップイン代替品: S9S08DZ16F1MLC — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: S9S08DZ16F1MLC （同一形状・フットプリント） — 相違点: Operating Temperature, Core, Package, ADC, Automotive Qualification.
クイック比較ツール — 並列比較する代替部品を選択:
S9S08DZ16F2MLC
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →S9S08DZ60F2MLC
✅ ドロップイン📋 参考代替品（カタログ未掲載）
S9S08DZ60F2MLFR
✅ ドロップイン📋 参考代替品（カタログ未掲載）
S9S08DV16F2MLC
✅ ドロップイン✓ 在庫あり
$2.1 / 個
データシートを見る →S9S08DV64F2MLC
✅ ドロップイン📋 参考代替品（カタログ未掲載）
S9S08DZ16F1MLC 最大定格＆電気的特性
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | S08 |
| Core | HCS08 (40 MHz CPU, 20 MHz bus) |
| Core Width | 8-Bit |
| Program Memory Size | 16 KB (16K x 8) Flash |
| RAM Size | 1 KB (1K x 8) |
| 最大クロック周波数 | 40 MHz |
| Number of I/O | 25 |
| Supply Voltage Range | 2.7 V to 5.5 V |
| 動作温度 | -40 C to +125 C |
| ADC | 24-channel, 12-bit, 2.5 us conversion |
| Communication Interfaces | CAN, I2C, LIN, SCI, SPI |
| Oscillator Type | External |
| パッケージ / ケース | 32-LQFP (7x7 mm) |
| 実装タイプ | Surface Mount |
| Packaging | Tray |
S9S08DZ16F1MLC ピン構成
| ピン 1 | PTD0/TPM1CH0 — Port D bit 0 / TPM1 channel 0 (PWM/timer) |
| ピン 2 | PTD1/TPM1CH1 — Port D bit 1 / TPM1 channel 1 (PWM/timer) |
| ピン 3 | PTD2/TxD1 — Port D bit 2 / SCI1 transmit data |
| ピン 4 | PTD3/RxD1 — Port D bit 3 / SCI1 receive data |
| ピン 5 | VDD — Positive supply voltage (2.7 V to 5.5 V) |
| ピン 6 | VSS — Ground reference |
| ピン 7 | PTA0/TPM2CH0 — Port A bit 0 / TPM2 channel 0 |
| ピン 8 | PTA1/TPM2CH1 — Port A bit 1 / TPM2 channel 1 |
| ピン 9 | PTA2/SDA — Port A bit 2 / I2C SDA |
| ピン 10 | PTA3/SCL — Port A bit 3 / I2C SCL |
| ピン 11 | PTA4/MISO — Port A bit 4 / SPI MISO |
| ピン 12 | PTA5/MOSI — Port A bit 5 / SPI MOSI |
| ピン 13 | PTA6/SPSCK — Port A bit 6 / SPI clock |
| ピン 14 | PTA7/SS — Port A bit 7 / SPI slave select |
| ピン 15 | PTB0/AD0 — Port B bit 0 / ADC channel 0 |
| ピン 16 | PTB1/AD1 — Port B bit 1 / ADC channel 1 |
| ピン 17 | PTB2/AD2 — Port B bit 2 / ADC channel 2 |
| ピン 18 | PTB3/AD3 — Port B bit 3 / ADC channel 3 |
| ピン 19 | PTB4/AD4 — Port B bit 4 / ADC channel 4 |
| ピン 20 | PTB5/AD5 — Port B bit 5 / ADC channel 5 |
| ピン 21 | PTB6/AD6 — Port B bit 6 / ADC channel 6 |
| ピン 22 | PTB7/AD7 — Port B bit 7 / ADC channel 7 |
| ピン 23 | PTC0/AD8/CANRX — Port C bit 0 / ADC ch8 / CAN RX |
| ピン 24 | PTC1/AD9/CANTX — Port C bit 1 / ADC ch9 / CAN TX |
| ピン 25 | PTC2/AD10 — Port C bit 2 / ADC channel 10 |
| ピン 26 | PTC3/AD11 — Port C bit 3 / ADC channel 11 |
| ピン 27 | PTC4/AD12 — Port C bit 4 / ADC channel 12 |
| ピン 28 | PTC5/AD13 — Port C bit 5 / ADC channel 13 |
| ピン 29 | PTC6/AD14 — Port C bit 6 / ADC channel 14 |
| ピン 30 | PTC7/AD15 — Port C bit 7 / ADC channel 15 |
| ピン 31 | RESET — External reset input (active low) |
| ピン 32 | BKGD/MS — Background Debug Mode / Mode Select |
主な用途
S9S08DZ16F1MLC の用途: 6 件s: Automotive Body Control Module (CAN/LIN Node), Industrial Sensor Hub / Multi-Channel Data Logger, HVAC Control Panel and Thermostat, Small Appliance Motor Controller, Medical Point-of-Care Diagnostic Device, Building Automation Sensor Node (IoT Edge).
Automotive Body Control Module (CAN/LIN Node)
The S9S08DZ16F1MLC's on-chip CAN 2.0A/B controller and LIN 2.0 SCI make it a natural fit for distributed automotive body nodes - door modules, mirror controllers, seat controllers, and lighting ECUs. At 40 MHz the HCS08 core services the CAN message queue at 500 kbps with deterministic latency below 100 us. The 24-channel 12-bit ADC reads multiple sensor inputs (current shunts, thermistors, position pots) without an external analog front end, and 25 GPIOs drive the LED drivers and H-bridge FET gates directly. With operation from -40 C to +125 C and 2.7 V to 5.5 V supply, the part tolerates automotive cranking profiles and load-dump transients when paired with a TVS.
おすすめ
Industrial Sensor Hub / Multi-Channel Data Logger
With a 24-channel 12-bit ADC and 2.5 us conversion time, the S9S08DZ16F1MLC can scan up to 24 analog sensors in roughly 60 us total, leaving the CPU free for filter math and SCI/SPI uplink. The 16 KB Flash holds a 4 kSample ring buffer plus calibration tables, while 1 KB RAM suffices for the active scan window. The 40 MHz HCS08 core runs 10 kHz sample loops with comfortable headroom, and the wide 2.7 V to 5.5 V supply range accepts 3.3 V and 5 V transducer rails directly. Industrial-grade -40 C to +125 C operation allows deployment in factory-floor cabinets and outdoor enclosures without additional thermal management.
おすすめ
HVAC Control Panel and Thermostat
The S9S08DZ16F1MLC's combination of 16 KB Flash for UI state machines, 12-bit ADC for NTC thermistor readout, and SCI/SPI for display and remote sensors fits wall-mount HVAC thermostats. The 25 GPIOs can drive a 7-segment LCD via an external segment driver and key-scan matrix directly, while the CAN/LIN interfaces accept set-points from a central building controller. Low-power HCS08 STOP and WAIT modes let the device idle between samples on battery-backed designs, and the industrial temperature range handles plenum-mounted installations near heating ducts.
おすすめ
Small Appliance Motor Controller
Variable-speed BLDC and universal-motor controllers in washing machines, dishwashers, and small kitchen appliances benefit from the S9S08DZ16F1MLC's 40 MHz HCS08 core, dedicated timers for PWM generation, and 12-bit ADC for back-EMF sensing. The 16 KB Flash accommodates sensorless FOC or trapezoidal commutation tables, while 1 KB RAM buffers the speed-loop and current-loop state. CAN/LIN connectivity simplifies integration with the appliance's master controller, and the wide supply range accepts rectified 24 V rails after a small buck converter. Operating from -40 C to +125 C ensures reliability in hot motor enclosures.
おすすめ
Medical Point-of-Care Diagnostic Device
Portable point-of-care analyzers (glucometers, INR meters, hemoglobin readers) use the S9S08DZ16F1MLC as the central controller because it combines low power consumption, a 12-bit ADC accurate enough for electrochemical and photometric sensors, and SPI/SCI links to the keypad, display, and Bluetooth module. The 16 KB Flash is sufficient for calibration tables, assay protocols, and a real-time RTOS-like scheduler in a bare-metal loop. Operation from 2.7 V to 5.5 V lets the design run directly from two AA cells or a Li-ion pack, and -40 C to +125 C supports storage and shipping across all climates.
おすすめ
Building Automation Sensor Node (IoT Edge)
Smart-building sensor nodes (occupancy, light, CO2, leak) leverage the S9S08DZ16F1MLC's 24-channel ADC, multiple serial interfaces, and 16 KB Flash for on-device filtering before uplinking to a LoRa/Zigbee/BLE co-processor via SPI or UART. The HCS08 core can wake from STOP on a sensor interrupt, take a reading, and return to sleep within tens of milliseconds to extend battery life. CAN/LIN interfaces provide a path to wired building backbones in retrofit installations, and the 2.7 V to 5.5 V supply accepts a wide range of battery chemistries and energy-harvester outputs.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: S9S08DZ16F1MLC — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | S9S08DZ16F2MLC | S9S08DZ60F2MLC | S9S08DZ60F2MLFR | S9S08DV16F2MLC | S9S08DV64F2MLC |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 32-LQFP (7x7 mm) | 32-LQFP (7x7 mm) - same | 32-LQFP (7x7 mm) - same | 32-LQFP (7x7 mm) - same | 32-LQFP (7x7 mm) - same | 32-LQFP (7x7 mm) - same |
| Flash Memory | 16 KB | 16 KB | 60 KB | 60 KB | 16 KB | 64 KB |
| RAM | 1 KB | 1 KB | 2 KB | 2 KB | 1 KB | 2 KB |
| CPU Frequency | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| Number of I/O | 25 | 25 | 25 | 25 | 25 | 25 |
| Supply Voltage | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| Operating Temperature | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C |
主な差別化要因
- Same LQFP-32 footprint with up-to-date silicon revision （vs S9S08DZ16F2MLC)
- 4x more flash in the same package （vs S9S08DZ60F2MLC)
- On-chip CAN 2.0A/B controller （vs S9S08LG32J0VLK)
設計ノート
Place a 0.1 uF ceramic decoupling capacitor as close as possible to each VDD/VSS pin pair (pin 5 / pin 6) and a bulk 10 uF tantalum or ceramic capacitor on the main supply rail. The S9S08DZ16F1MLC draws up to approximately 30 mA in active mode at 40 MHz, so the regulator must have at least 100 mA headroom to handle inrush during Flash programming.
Route the BKGD/MS pin (pin 32) directly to a 2-pin header or test pad and avoid placing series resistors above 1 kohm in series with BKGD, because the BDM driver uses this pin for bidirectional signaling. Keep the trace short (<50 mm) and guarded by ground to avoid noise-induced debug failures. The RESET pin (pin 31) should have a 10 kohm pull-up to VDD and a 100 nF cap to VSS for noise immunity.
Do not exceed the absolute maximum supply of 5.8 V on VDD; the part is specified only up to 5.5 V. When migrating from the F1 mask to the F2 mask (S9S08DZ16F2MLC), review the F2 errata document for any register changes that may affect ADC calibration and TPM initialization. Avoid enabling the ADC and CAN modules simultaneously without verifying that the bus frequency divider supports the combined conversion latency.
When using the SCI, SPI, or CAN lines at maximum bus speed (CAN at 1 Mbps, SPI at 5 MHz with the 20 MHz bus), add 33 ohm series resistors at the MCU end to dampen ringing and match trace impedance. Keep CANH/CANL differential traces length-matched within 5 mm and routed over a continuous ground plane to meet IEC 61000-4-2 ESD tolerance.
コンプライアンス情報
RoHS compliant per NXP product page and distributor listings (DigiKey/Mouser/Veswin). AEC-Q100 qualification status was not explicitly stated in the verified web data and is marked unknown. REACH and conflict-minerals declarations should be requested from NXP.