SPC5603PEF1MLL4 - 32-bit MCU, e200z0h, 384KB Flash, 40MHz | NXP
部品番号: SPC5603PEF1MLL4 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.4 | $164.00 |
| 100 | $14.2 | $1,420.00 |
| 500 | $12.3 | $6,150.00 |
| 1,000 | $10.95 | $10,950.00 |
SPC5603PEF1MLL4 概要
A microcontroller (MCU) is a single-chip computer that integrates a processor core, program and data memory, peripherals, and I/O interfaces. The SPC5603PEF1MLL4 belongs to the Power Architecture (e200z0h) lineage of MCUs, which sits within the broader family of embedded 32-bit microcontrollers used across automotive and industrial systems. Compared with simple 8-bit MCUs, this 32-bit part delivers higher computational throughput, larger addressable memory, and richer peripheral integration required for real-time control loops, sensor fusion, and on-board diagnostics (OBD).
Key features include 384KB of embedded Flash with ECC for safety, 40MHz e200z0h core delivering approximately 60 DMIPS, an integrated FlexRay/CAN/LIN communication subsystem, an enhanced modular I/O subsystem, a 12-bit ADC for sensor acquisition, and an on-chip interrupt controller. The LQFP-100 package provides ample I/O count (typically 79 GPIO) while remaining compatible with standard PCB manufacturing and inspection processes.
The architecture is built on a Harvard-style bus with tightly coupled Flash and SRAM paths, plus a crossbar switch that allows multiple bus masters (DMA, FlexRay, eDMA) to access memory concurrently without stalling the core. The e200z0h implements a Power Architecture VLE (variable-length encoding) subset that combines 32-bit performance with 16-bit code density to maximize Flash utilization.
Typical applications include automotive chassis control modules, electronic stability programs (ESP/ESC), electric power steering (EPS) sensor and motor pre-drivers, airbag control units (ACU), body control modules (BCM), and CAN/LIN gateway nodes. The wide temperature range and AEC-Q100 qualification also make it suitable for industrial drives and any environment requiring long-term reliability.
When designing with this part, allocate a sufficient Flash shadow block for EEPROM emulation and reserve the on-chip FlexRay message RAM for deterministic bus scheduling. The internal voltage regulator requires a robust bulk capacitor on the VDD core supply pin to handle load transients during radio-block events.
This page synthesizes distributor pricing from DigiKey and Mouser, automotive-grade cross-reference alternatives within the MPC560x family, and practical design notes supplementing the NXP datasheet and reference manual.
ドロップイン代替品: SPC5603PEF1MLL4 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: SPC5603PEF1MLL4 （同一形状・フットプリント） — 相違点: Core Processor, Program Memory Size, Series.
クイック比較ツール — 並列比較する代替部品を選択:
SPC5604 series
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
SPC5602BF2MLL6
✅ ドロップイン✓ 在庫あり
$5.59 / 個
データシートを見る →SPC5606BF0MLL6
✅ ドロップイン📋 参考代替品（カタログ未掲載）
STM32F101VDT6
✅ ドロップイン📋 参考代替品（カタログ未掲載）
SPC5603PEF1MLL4 最大定格＆電気的特性
| Manufacturer | NXP Semiconductors |
| Series | MPC560xP (Qorivva MPC56xx) |
| Core Processor | e200z0h Power Architecture |
| Core Architecture | Power Architecture VLE |
| Bit Width | 32-bit |
| Program Memory Size | 384 KB Flash |
| 最大クロック周波数 | 40 MHz |
| 動作温度範囲 | -40C to +125C |
| パッケージ | 100-LQFP (14x14 mm) |
| 実装タイプ | Surface Mount |
| Automotive Qualification | AEC-Q100 Grade 1 (target automotive) |
| Communication Interfaces | CAN, LIN, FlexRay, SENT (per MPC560xP family) |
| ADC | 12-bit (integrated, channel count not provided) |
| MSL Moisture Sensitivity Level | MSL3 (per JEDEC J-STD-020, typical for LQFP) |
| RoHS ステータス | Compliant |
| Processor DMIPS (approx.) | ~60 DMIPS at 40 MHz |
SPC5603PEF1MLL4 100-lqfp (14x14 mm) ピン配置ガイド
SPC5603PEF1MLL4 (100-lqfp (14x14 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: SPC5603PEF1MLL4.
詳細は データシート をご参照ください。
主な用途
SPC5603PEF1MLL4 の用途: 6 件s: Electronic Stability Control (ESC/ESP) Module, Airbag Control Unit (ACU), Electric Power Steering (EPS) Sensor Hub, Body Control Module (BCM), CAN/LIN Gateway Node, Industrial Servo Drive Controller.
Electronic Stability Control (ESC/ESP) Module
The SPC5603PEF1MLL4's 40 MHz e200z0h core delivers the deterministic real-time throughput required by ESC control loops running at 5-10 ms cycle times, while the integrated FlexRay and CAN controllers synchronise with the chassis CAN network. The 384 KB Flash holds the sensor-fusion and wheel-slip Kalman-filter firmware typical of ESC ECUs. AEC-Q100 Grade 1 qualification and the -40C to +125C range support under-hood mounting where brake-by-wire sensors report extreme thermal stress. The 100-LQFP package exposes the GPIO count needed to drive wheel-speed sensor inputs, hydraulic-modulator valves, and watchdog diagnostics.
おすすめ
Airbag Control Unit (ACU)
The SPC5603PEF1MLL4's 384 KB ECC Flash and Power Architecture VLE core run the deploy-decision algorithm and crash-sensor fusion typical of airbag ECUs, where deterministic interrupt latency is non-negotiable. The -40C to +125C operating range and AEC-Q100 Grade 1 qualification cover deployment-temperature testing from cold soak through high-temperature soak. The 12-bit ADC samples redundant G-sensors with deterministic conversion timing, while the on-chip crossbar switch lets the eDMA engine stream sensor data without interrupting the deploy decision. The 100-LQFP package keeps the Bill-of-Materials compact for a passive-safety module with tight cost budgets.
おすすめ
Electric Power Steering (EPS) Sensor Hub
In EPS sensor pre-processing and torque-sensing ECUs, the SPC5603PEF1MLL4's FlexRay and dual CAN controllers deliver deterministic steering-angle synchronization to other vehicle domains. The 40 MHz core handles a 1 ms steering-loop cycle that includes resolver decoding, torque-vector calculations, and CAN/CCP diagnostics. The 384 KB Flash stores the calibration tables, torque-steer compensation curves, and fault-handling state machines typical of an EPS control unit. Operating from -40C to +125C, the part survives under-hood thermal stress while the 100-LQFP package exposes the rotary-encoder inputs needed for resolver interfaces.
おすすめ
Body Control Module (BCM)
The SPC5603PEF1MLL4 drives body-control ECUs that aggregate CAN/LIN body bus traffic, manage lighting drivers, central locking, and HVAC load sequencing. The integrated LINFlex and CAN controllers map cleanly to modern vehicle body-network topologies with low-cost LIN sub-buses. The 384 KB Flash reserves space for the BCM's lighting-pattern matrix, diagnostic libraries, and LIN slave-node descriptors. The automotive temperature rating (-40C to +125C) supports interior cabin mounting, while the 100-LQFP package keeps the ECU footprint low for cost-sensitive body-control applications.
おすすめ
CAN/LIN Gateway Node
The SPC5603PEF1MLL4's multi-channel CAN and FlexRay support makes it well-suited as a gateway between chassis CAN sub-buses and the central vehicle network. The on-chip eDMA engine moves bus traffic without CPU intervention, freeing the 40 MHz e200z0h core for routing-policy logic. The 384 KB Flash stores protocol translation tables, signal-routing descriptors, and UDS diagnostic services. The wide operating temperature range (-40C to +125C) suits central-gateway mounting inside the cabin while the 100-LQFP package keeps the gateway module compact.
おすすめ
Industrial Servo Drive Controller
Outside automotive, the SPC5603PEF1MLL4's deterministic PWM-friendly peripherals and wide -40C to +125C envelope suit industrial servo drives controlling brushless-DC and stepper motors. The 40 MHz core runs the velocity-loop and current-loop control at 10-20 kHz sampling rates typical of three-phase industrial drives. The 384 KB Flash stores encoder calibration, motor-parameter auto-tuning, and field-oriented control (FOC) libraries. The 100-LQFP package supports manufacturing on through-hole or SMT lines typical of industrial automation vendors.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: SPC5603PEF1MLL4 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | SPC5604 series | SPC5602BF2MLL6 | SPC5606BF0MLL6 | STM32F101VDT6 |
|---|---|---|---|---|---|
| Package | 100-LQFP (14x14 mm) | 100-LQFP (14x14) - same | 100-LQFP (14x14) - same | 100-LQFP (14x14) - same | 100-LQFP (14x14) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | STMicroelectronics |
| Core Architecture | e200z0h Power Architecture VLE | e200z0h Power Architecture VLE | e200z0h Power Architecture VLE | e200z0h Power Architecture VLE | ARM Cortex-M3 |
| Bit Width | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit |
| Max Clock Frequency | 40 MHz | 40-64 MHz | 40 MHz | 64 MHz | 36 MHz |
| Operating Temperature Range | -40C to +125C (AEC-Q100 Grade 1) | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +85C (industrial grade) |
| Automotive Qualification | AEC-Q100 Grade 1 (automotive grade) | AEC-Q100 Grade 1 | AEC-Q100 Grade 1 | AEC-Q100 Grade 1 | Industrial grade (not AEC-Q100) |
| Communication Interfaces | FlexRay, CAN, LIN, SENT | FlexRay, CAN, LIN, SENT | CAN, LIN, FlexRay, SENT | FlexRay, CAN, LIN, SENT | CAN, USB, USART, SPI, I2C (no FlexRay) |
主な差別化要因
- Automotive-grade qualification and chassis-domain heritage （vs STM32F101VDT6)
- Integrated FlexRay controller for time-triggered chassis buses （vs STM32F101VDT6)
- Power Architecture VLE gives code-density advantage over RISC ARM （vs STM32F101VDT6)
- Pin-for-pin NXP family scalability across Flash ranges （vs SPC5602BF2MLL6)
設計ノート
The SPC5603PEF1MLL4 houses an internal voltage regulator that supplies the 1.2 V core domain from the external 5 V or 3.3 V supply pin. Place a low-ESR bulk decoupling capacitor (10 uF ceramic plus 100 nF) directly on the VDD pin pair, and provide a robust capacitor on the internal regulator output (typically 4.7 uF). Bulk capacitor sizing matters during large radio-block erase operations on Flash, where core current transients can reach tens of mA within microseconds. Insufficient decoupling causes undervoltage resets during programming.
Although automotive-grade LQFP packages are forgiving thermally, ESP/ESC and airbag ECUs run the SPC5603PEF1MLL4 at near-maximum CPU utilization for sustained periods. Provide at least 1 sq-in of unbroken inner-plane copper directly under the exposed thermal pad of the LQFP-100 footprint to spread heat from corner GPIOs. Junction temperature rise should be checked against worst-case workload envelopes to stay inside the AEC-Q100 Grade 1 silicon temperature budget.
Route the FlexRay differential pair (FR_A, FR_B) over a continuous reference plane with 100-ohm differential impedance, keeping stubs under 5 mm. Maintain solid ground shielding on both sides of the bus lines and place the FlexRay common-mode choke as close to the connector as possible. For CAN bus traces, apply similar differential routing discipline with termination at the bus ends (120 ohms split termination recommended). Avoid routing FlexRay/CAN signals over plane splits to preserve signal integrity.
Designers porting code from S12 microcontrollers often overlook the SPC5603PEF1MLL4's ECC Flash organization. Always enable the Flash ECC controller at startup and verify the EER register semantics before relying on ECC interrupts. Watchdog lockout sequences differ significantly from S12 parts - read the MPC560xP reference manual chapter on the Watchdog Timer (SWT) before reusing S12 watchdog code, because the unlock pattern is hardware-protective and irreversibly disables debugging on incorrect sequences.
Use a four-layer PCB stack-up with continuous ground planes for the chassis and safety ECUs that host the SPC5603PEF1MLL4. Place the JTAG/NPC connector and probe access land pattern on a manufacturing-friendly grid; production-grade chassis ECUs require boundary-scan access for failure analysis. Route the reset line (RESET) as a guarded trace with a 1 kohm pull-up and 100 nF capacitor for noise immunity, since long cable harness lengths introduce EMI that can trigger spurious resets.
コンプライアンス情報
AEC-Q100 Grade 1 qualification per NXP MPC560xP family datasheet. RoHS compliance confirmed via DigiKey product page. REACH status confirmed by NXP product page. Lead-free packaging confirmed per NXP packaging materials specification.