SPC5606SF2VLQ6 - 64MHz 1MB Flash Automotive MCU | NXP | 144-LQFP
部品番号: SPC5606SF2VLQ6 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $16.5 | $16.50 |
| 10 | $14.85 | $148.50 |
| 100 | $13.2 | $1,320.00 |
| 500 | $11.85 | $5,925.00 |
| 1,000 | $10.55 | $10,550.00 |
SPC5606SF2VLQ6 概要
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program and data memory, peripherals, and I/O on one die. The SPC5606SF2VLQ6 belongs to the power-architecture microcontroller sub-category, which descends into the broader automotive-qualified MCU family and ultimately the semiconductor taxonomy. Qorivva devices specifically address body, chassis, and instrument-cluster applications where deterministic real-time behavior and a long-life supply window are mandatory.
Key features of this part include 1 MB on-chip Flash, 48 KB SRAM, an e200z0h single-issue 32-bit Power Architecture core running at 64 MHz, integrated TFT display controller peripherals, two 12-bit / one 10-bit ADC subsystem, multiple timers (eMIOS, PIT, STM), and NXP's low-power dynamic power-management scheme. The integrated display controller enables direct driving of TFT panels for instrument clusters without an external graphics controller, which reduces BOM cost and PCB area.
Technically, the SPC5606SF2VLQ6 is built on a 90 nm automotive-qualified process and supports 3.3 V single-supply operation, JTAG and Nexus debug interfaces, CAN, LINFlex, SPI, and I2C communication peripherals. Compared with general-purpose ARM Cortex-M microcontrollers, the Power Architecture e200z0h core provides a more deterministic interrupt response time for real-time cluster workloads and longer software legacy migration paths within the MPC5xxx family.
Typical applications include automotive instrument clusters with color TFT displays, head-up displays, body controllers with CAN/LIN nodes, HVAC control modules, and lighting/ECM modules. The -40C to +105C automotive temperature grade and AEC-Q100 qualification make it a primary choice for under-dash and behind-cluster electronics.
When designing with this device, ensure proper decoupling on VDD/VSS pairs (typically 100 nF per pair plus bulk capacitance) and follow NXP application note AN2865 for oscillator layout. Confirm the device revision with NXP's product change notices before committing to long-life automotive programs because the Qorivva roadmap has shifted toward S32K and S32K1 ARM Cortex-M migration.
This page synthesizes distributor pricing, same-family drop-in NXP alternatives, application notes, and design considerations not found in the manufacturer datasheet, giving automotive embedded engineers a faster basis of decision than distributor product pages alone.
ドロップイン代替品: SPC5606SF2VLQ6 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: SPC5606SF2VLQ6 （同一形状・フットプリント） — 相違点: Maximum Clock Frequency, Package, Core Processor, Program Memory Size, RoHS Status.
クイック比較ツール — 並列比較する代替部品を選択:
SPC5606BK0MLQ6R
✅ ドロップイン📋 参考代替品（カタログ未掲載）
SPC5606SF2VLQ6R
✅ ドロップイン📋 参考代替品（カタログ未掲載）
SPC5604BK0MLQ6R
✅ ドロップイン📋 参考代替品（カタログ未掲載）
SPC5602BK0MLL6R
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC5606BK0MLQ6
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
SPC5644AF0MLU2
✅ ドロップイン✓ 在庫あり
$12.5 / 個
データシートを見る →SPC5606SF2VLQ6 最大定格＆電気的特性
| Core | e200z0h Power Architecture |
| データバス幅 | 32 bit |
| 最大クロック周波数 | 64 MHz |
| Program Memory Size | 1 MB (1M x 8) Flash |
| Data RAM Size | 48 KB |
| ADC Resolution | 10 bit |
| Number of I/Os | 105 I/O |
| 動作電源電圧 | 3.3 V (single supply) |
| Minimum Operating Temperature | -40 C |
| Maximum Operating Temperature | +105 C |
| 実装スタイル | SMD/SMT |
| パッケージ | 144-LQFP (20x20 mm) |
| Package Category | LQFP-144 / Gull Wing |
| Terminal Count | 144 |
| Temperature Grade | Automotive (AEC-Q100) |
| Core Architecture | Power Architecture (e200z0h) |
| Family | MPC560xS Qorivva |
| Peripheral Highlights | TFT display controller, CAN, LINFlex, SPI, I2C, eMIOS, PIT, STM |
| RoHS ステータス | Compliant |
SPC5606SF2VLQ6 lqfp-144 / gull wing ピン配置ガイド
SPC5606SF2VLQ6 (lqfp-144 / gull wing パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: SPC5606SF2VLQ6.
詳細は データシート をご参照ください。
主な用途
SPC5606SF2VLQ6 の用途: 6 件s: Automotive Instrument Cluster with Color TFT, Head-Up Display (HUD) Controller, Automotive HVAC Control Module, Body Control Module (BCM) Gateway, Lighting Control Module (LCM), Industrial HMI with TFT Display.
Automotive Instrument Cluster with Color TFT
The SPC5606SF2VLQ6 is purpose-built for color TFT instrument cluster applications in automotive dashboards. Its integrated TFT display controller directly drives WXGA-class panels without an external graphics controller, reducing BOM cost. The 1 MB Flash holds full cluster firmware, AUTOSAR MCAL, and TFT frame buffers; the 48 KB SRAM supports render double-buffering. The e200z0h 64 MHz core provides deterministic interrupt response critical for real-time gauge and telltale updates, and AEC-Q100 qualification plus -40C to +105C rating allow deployment behind the cluster in cabin thermal environments.
おすすめ
Head-Up Display (HUD) Controller
The SPC5606SF2VLQ6 serves as the central controller in entry-level automotive Head-Up Displays where the e200z0h core runs speed, navigation, and warning overlays. Its 64 MHz clock, 1 MB Flash, and CAN/LINFlex peripherals deliver enough headroom for OEM-proprietary HUD image processing layers. The TFT display controller and SPI peripherals handle DLP/Laser HUD light-engine interfaces. AEC-Q100 qualification and 105 C thermal rating suit behind-windshield modules where solar loading elevates ambient temperature.
おすすめ
Automotive HVAC Control Module
The SPC5606SF2VLQ6 fits mid-range HVAC control modules that drive TFT climate-control displays and manage actuator PWM via eMIOS timers. Its 105 GPIO, dual CAN, and LINFlex enable HVAC-to-BCM and HVAC-to-cluster networking. The 1 MB Flash holds graphical HVAC UI plus CAN stack; 48 KB SRAM supports multitask scheduling. AEC-Q100 grade 1 qualification at 105 C supports under-dash mounting where engine-bay heat radiates into the cabin.
おすすめ
Body Control Module (BCM) Gateway
In body control modules, the SPC5606SF2VLQ6 acts as a CAN/LIN gateway, fusing messages between chassis, body, and cluster domains. Dual CAN controllers, multiple LINFlex nodes, and 105 I/O satisfy OEM BCM pin budgets. The 1 MB Flash stores gateway routing tables, while the e200z0h core executes AUTOSAR with sub-10 us interrupt latency. Automotive 105 C temperature rating supports under-dash or in-cabin placement without thermal derating.
おすすめ
Lighting Control Module (LCM)
The SPC5606SF2VLQ6 drives exterior and interior lighting modules that require AEC-Q100 grade 1 and CAN/LIN connectivity. Its eMIOS PWM channels generate high-resolution LED dimming signals at frequencies above 200 Hz to avoid flicker. The 1 MB Flash accommodates adaptive-drive beam algorithms and LIN diagnostic stacks. With 105 GPIO the MCU interfaces directly to LED driver ICs without external logic.
おすすめ
Industrial HMI with TFT Display
Although primarily automotive, the SPC5606SF2VLQ6 fits rugged industrial HMIs that need an integrated TFT controller, deterministic real-time core, and 105 C thermal headroom. Its 1 MB Flash and 48 KB SRAM support graphical user-interface state machines plus Modbus/CANopen stacks. The 144-LQFP package simplifies hand-rework and prototype builds. Designers can transition firmware from automotive clusters to industrial HMIs with minimal rework because the e200z0h toolchain is shared.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: SPC5606SF2VLQ6 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | SPC5606BK0MLQ6R | SPC5606SF2VLQ6R | SPC5604BK0MLQ6R | SPC5602BK0MLL6R | MPC5606BK0MLQ6 | SPC5644AF0MLU2 |
|---|---|---|---|---|---|---|---|
| Package | 144-LQFP (20x20 mm) | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | e200z0h 32-bit Power Architecture | e200z0h - same | e200z0h - same | e200z0h - same | e200z0h - same | e200z0h - same | e200z4 (dual-issue) - different |
| Maximum Clock Frequency | 64 MHz | 64 MHz | 64 MHz | 64 MHz | 64 MHz | 64 MHz | 120 MHz |
| Program Memory (Flash) | 1 MB | 1 MB | 1 MB | 512 KB (-50%) | 256 KB (-74%) | 1 MB | 4 MB (+300%) |
| Data RAM Size | 48 KB | 48 KB | 48 KB | 32 KB (-33%) | 24 KB (-50%) | 48 KB | 128 KB (+167%) |
| Operating Temperature | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +125 C |
主な差別化要因
- Integrated TFT display controller （vs SPC5604BK0MLQ6R)
- Largest Flash density in the MPC560xS family （vs SPC5602BK0MLL6R)
- Deterministic e200z0h Power Architecture core （vs STM32F4 (cross-brand))
設計ノート
Estimated: at 64 MHz and 3.3 V single supply with all peripherals enabled, the SPC5606SF2VLQ6 draws approximately 80-120 mA typical. Use a low-impedance 3.3 V LDO with at least 200 mA headroom and place 100 nF decoupling on every VDD/VSS pair as close as possible to the package. Bulk capacitance of 10-22 uF near the package pins reduces voltage transients when the eMIOS or TFT controller peripherals switch heavy loads. Refer to NXP application note AN4830 for the SPC56xx power-tree reference design.
Route the external crystal/oscillator traces within 5 mm of the MCU and shield them with a guard ring tied to ground. The 4 MHz internal FIRC plus 16 MHz external IRC combinations must obey the IPC-2221 controlled-impedance rules for the XTAL/EXTAL pins. The 144-LQFP land pattern uses 0.5 mm pitch with thermal vias under the exposed pad region. Always pour a continuous ground plane beneath the MCU for return-current paths and EMC compliance per IEC 61967 and CISPR 25.
Estimated: with theta_JA around 35 C/W on a 4-layer JEDEC PCB, a 0.5 W dissipation (typical cluster workload) gives a junction rise of 17 C above ambient. The 144-LQFP exposed pad structure requires 16-25 thermal vias to a copper pour to maintain this. Verify in-system with a calibrated thermocouple, and consult NXP errata document for any silicon-revision-specific thermal anomalies.
Common pitfalls: (1) Do not exceed the maximum I/O source/sink current of 4 mA per pin, or 25 mA per VDD/VSS pair - the cluster TFT backlight must use external drivers. (2) The e200z0h interrupt vector table must be initialized before the watchdog is enabled or the MCU will lock up. (3) The JTAG TDI/TDO/TCLK pins must be left floating or pulled to known states during reset per the SPC5606SF2 datasheet - misconfiguration here causes Nexus debug failures.
コンプライアンス情報
AEC-Q100 qualified per NXP MPC560xS family datasheet. RoHS and REACH compliance per NXP product page and DigiKey catalog. Lead-free and halogen-free per NXP material declaration. Conflict-minerals CMRT compliant per NXP corporate policy.
