STM32G0B1KEU6 - 64MHz Cortex-M0+ 512KB Flash MCU | STMicroelectronics
部品番号: STM32G0B1KEU6 ✓ 生産中STM32G0B1KEU6 概要
A microcontroller is a programmable semiconductor device that combines a processor core, memory, and peripherals into one integrated circuit. The STM32G0 family hierarchy runs from the Cortex-M0+ core to 32-bit RISC microcontrollers, embedded controllers, and semiconductor devices for embedded systems. This device is intended for designs that need more general-purpose control capability than a basic fixed-function logic component while retaining a compact package.
The STM32G0B1KEU6 provides 512 KB of flash for firmware and 144 KB of RAM according to the product listing. Its Arm Cortex-M0+ core operates up to 64 MHz. The device is identified in the 32-pin UFQFPN package, and the U6 ordering code denotes tray packaging. The operating voltage range shown for this ordered device is 1.8 V, 2.5 V, and 3.3 V, supporting common embedded supply rails.
Its architecture combines a 32-bit RISC processor with multiple embedded peripherals for communication, timing, control, and data acquisition. A 64 MHz operating point provides useful responsiveness for protocol handling, digital control, and human-interface tasks without requiring a higher-complexity processor. Dual-bank flash with protection and a securable area, together with read-while-write support, is identified for this MCU family and can support controlled firmware-update and data-retention workflows.
Typical uses include compact industrial controllers, sensor-hub and IoT equipment, building-access terminals, appliance control boards, and USB-connected embedded accessories. The small 5 mm by 5 mm UFQFPN package is particularly useful when board area is constrained, although its fine-pitch footprint requires careful PCB design, thermal planning, and assembly-process control.
When laying out a board, follow the exact pin table and exposed-pad requirements in the manufacturer datasheet. Place input, output, decoupling, and programming-access components in accordance with the reference layout, and reserve the exposed thermal pad for the required copper and solder pattern. Confirm startup, clock, reset, and communication settings in firmware rather than assuming behavior from another STM32 family.
This product page combines the exact orderable-part information, manufacturer documentation, package details, practical design guidance, and an explicit drop-in-replacement assessment for engineers comparing STM32G0B1KEU6 sourcing and redesign options.
ドロップイン代替品: STM32G0B1KEU6 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
この製品に利用可能なドロップイン代替品はありません。
代替品をリクエストSTM32G0B1KEU6 最大定格＆電気的特性
| Product Type | 32-bit microcontroller |
| Processor Core | Arm Cortex-M0+ |
| Architecture | 32-bit RISC |
| Maximum CPU Frequency | 64 MHz |
| Embedded Flash Memory | 512 KB |
| Flash Organization | 512K x 8 bits |
| RAM Memory | 144 KB |
| Flash Memory Banks | 2 banks |
| Read-While-Write Support | Supported |
| Flash Protection | Supported |
| Securable Area | Supported |
| Operating Voltage Options | 1.8 V, 2.5 V, and 3.3 V |
| パッケージ | 32-pin UFQFPN, 5 mm x 5 mm |
| 実装タイプ | Surface mount |
| Order Code Packaging | Tray |
| 動作温度範囲 | -40°C to 85°C, 105°C, or 125°C, depending on ordering variant |
STM32G0B1KEU6 32-pin ufqfpn, 5 mm x 5 mm ピン配置ガイド
STM32G0B1KEU6 (32-pin ufqfpn, 5 mm x 5 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: STM32G0B1KEU6.
詳細は データシート をご参照ください。
主な用途
STM32G0B1KEU6 の用途: 6 件s: Compact Industrial Control Module, IoT Sensor Hub, USB-C Accessory Controller, Building Access Terminal, Appliance Control Board, Condition Monitoring Node.
Compact Industrial Control Module
The STM32G0B1KEU6 fits compact industrial control modules that coordinate sensors, digital I/O, status indicators, and local communications. Its 64 MHz Arm Cortex-M0+ core provides sufficient throughput for protocol tasks and deterministic control logic, while 512 KB flash and 144 KB RAM support a layered firmware design. The 32-pin UFQFPN package reduces board area, and the 1.8 V, 2.5 V, and 3.3 V options accommodate common industrial supply arrangements. For production use, verify the selected temperature grade, transient immunity, isolation boundaries, and exposed-pad copper against the enclosure and grounding architecture.
おすすめ
IoT Sensor Hub
The STM32G0B1KEU6 is appropriate for a small IoT sensor hub that samples inputs, filters measurements, applies local rules, and forwards results over a serial interface. Its 512 KB flash provides room for application firmware and communication stacks, while 144 KB RAM supports buffering and protocol state. Operating up to 64 MHz helps the processor service multiple peripheral events without an external controller. The compact 5 mm by 5 mm package supports dense sensor assemblies, although final certification and battery life depend on the radio, power-management strategy, and duty cycle rather than the MCU alone.
おすすめ
USB-C Accessory Controller
The STM32G0B1KEU6 can serve as the central controller in a USB-connected accessory that handles configuration, button input, indicators, and a secondary embedded interface. The 64 MHz Cortex-M0+ core is suitable for protocol servicing and device-state management, and the 512 KB flash accommodates firmware upgrades and control logic. Its low-voltage operating options align with compact powered accessories. The PCB must follow the manufacturer recommendations for decoupling, clocking, programming access, and exposed-pad thermal construction, while USB signal-routing and compliance testing remain separate system-level requirements.
おすすめ
Building Access Terminal
The STM32G0B1KEU6 is suitable for a compact building-access terminal that reads credentials, drives local indicators, controls a lock interface, and maintains communications with a door controller. Its integrated 512 KB flash and 144 KB RAM support credential handling, event buffering, and protocol logic without external memory. The 32-pin package can simplify dense reader electronics, while dual-bank flash and read-while-write support can assist controlled update workflows. Security provisioning, audit logging, lock-driver circuitry, and regulatory requirements should be engineered separately rather than inferred from general MCU capabilities.
おすすめ
Appliance Control Board
The STM32G0B1KEU6 can control a compact appliance by coordinating switches, sensors, displays, relays, and service communications. Its 64 MHz Cortex-M0+ performance supports responsive state-machine control, while 512 KB flash and 144 KB RAM provide sufficient capacity for moderate application logic. Low-voltage operation simplifies power-tree integration, and the compact UFQFPN footprint assists enclosure-driven designs. Engineers should budget regulator dissipation, separate noisy loads, provide stable decoupling, and verify every high-voltage or mains-connected interface through dedicated protection and isolation circuitry.
おすすめ
Condition Monitoring Node
The STM32G0B1KEU6 fits a condition-monitoring node that samples sensor data, performs local filtering, detects thresholds, and transmits event summaries. The 64 MHz core provides deterministic handling for acquisition and control tasks, while 144 KB RAM can support sample buffering and 512 KB flash can hold firmware, configuration, and logs. The small package permits installation close to the monitored equipment. Final performance depends on the selected ADC and sensor front end, which must be reviewed separately, along with grounding, isolation, calibration, and enclosure thermal requirements.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: STM32G0B1KEU6 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 |
|---|---|
| Package | 32-pin UFQFPN, 5 mm x 5 mm |
| Brand | STMicroelectronics |
| Processor Core | Arm Cortex-M0+ |
| Maximum CPU Frequency | 64 MHz |
| Embedded Flash Memory | 512 KB |
| RAM Memory | 144 KB |
| Operating Voltage Options | 1.8 V, 2.5 V, and 3.3 V |
| Flash Organization | Two banks with protection, securable area, and read-while-write support |
| Order Code Packaging | Tray |
主な差別化要因
- Balanced embedded-control resource set （vs STM32F103C8T7TR)
- Compact 32-pin package for space-constrained boards （vs STM32G0B1RET6)
- Modern mainstream Cortex-M0+ platform （vs STM32F103R6T6ATR)
設計ノート
Build the layout from the STM32G0B1KE 32-pin UFQFPN drawing rather than a generic 32-pin QFN footprint. Confirm pad dimensions, exposed-pad geometry, solder-mask clearance, and paste volume for the PCB process. Place decoupling capacitors close to the applicable VDD and VSS pins, provide a clean ground reference, and avoid routing high-current or switching nodes beneath the exposed pad.
Use the exposed pad as both an electrical thermal connection and a heat-spreading feature. Follow the manufacturer's minimum copper and via requirements, and evaluate the worst-case ambient temperature and switching activity. If the device drives relays, LEDs, or power stages, calculate heat in those external components separately. The MCU package should not be treated as an isolated heat sink for a poorly designed power tree.
Separate sensitive analog or communication supply paths from noisy actuator loads. Keep the MCU input, ground, and decoupling geometry compact, and verify power sequencing, voltage tolerances, and startup behavior in the manufacturer electrical-characteristics tables. The 1.8 V, 2.5 V, and 3.3 V operating options must match the internal regulator, peripheral, and external-component requirements rather than being selected independently.
Do not copy firmware or pin assignments from a different STM32 package or family without a complete peripheral-by-peripheral review. Pay particular attention to alternate-function mapping, oscillator pins, debug access, reset behavior, and VREF+ handling. The manufacturer datasheet notes that, on packages without VREF+, VREF+ is internally connected to VDD and the internal voltage-reference buffer must remain disabled.
コンプライアンス情報
Compliance statements for RoHS, REACH, AEC-Q100, lead-free construction, halogen-free construction, and conflict minerals were not present in the reviewed manufacturer and distributor results. The operating-temperature variants are not sufficient to establish AEC-Q100 qualification.
