TJA1022TK - Dual LIN 2.2A Transceiver HVSON14 | NXP
部品番号: TJA1022TK ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $1.85 | $1.85 |
| 10 | $1.62 | $16.20 |
| 100 | $1.38 | $138.00 |
| 500 | $1.15 | $575.00 |
| 1,000 | $0.96 | $960.00 |
| 2,500 | $0.84 | $2,100.00 |
TJA1022TK 概要
A LIN (Local Interconnect Network) transceiver is a physical-layer IC that converts the digital logic-level signals from a microcontroller's protocol controller into the single-wire LIN bus voltage levels defined by the LIN standard, and vice versa. LIN sits below CAN in the automotive networking hierarchy (sub-bus: LIN -> sub-bus of CAN -> in-vehicle network), enabling low-cost communication for body electronics such as door modules, seat controllers, mirror adjusters, and roof consoles. The TJA1022's dual-channel integration halves the cell density on the PCB versus two discrete transceivers.
Key features include an operating supply voltage range typically suitable for 12 V automotive systems, integrated LIN bus termination, thermal shutdown protection, bus pin transient protection per ISO 7637, and very low quiescent current in sleep mode for battery-friendly standby. The device supports both normal and silent-mode operation for selective wake-up scenarios. Per the NXP datasheet, the TJA1022T and TJA1022TK are pin-compatible with the legacy TJA1020, TJA1021, TJA1027, and TJA1029 single LIN transceivers in SO14 / HVSON14 packages.
The TJA1022TK architecture combines two independent LIN physical-layer blocks sharing common supply and ground pins. Each channel includes a wave-shaping driver with controlled slew rate to meet LIN EMC requirements, a dominant-timer for bus lock-up protection, and a wake-up receiver. The HVSON14 exposed pad provides a low thermal resistance path, essential for engine-bay and under-hood modules where ambient temperatures can reach 125 C.
Typical applications include automotive body-electronics modules (door, seat, mirror, roof), HVAC control panels, steering-wheel button interfaces, LED lighting controllers, and powertrain sensors connected to a body-domain LIN sub-bus. The dual-channel integration is especially valuable in door-modules and seat-modules where multiple LIN sub-nets reduce harness weight and BOM cost.
When designing with this part, follow NXP's reference layout guidance: place the HVSON14 exposed pad on a continuous ground copper pour with multiple thermal vias, keep the LIN bus traces short, and add the recommended external reverse-battery and ESD protection on the LIN pins if the module is exposed to handling transients.
This page synthesizes distributor pricing, pin-compatible NXP family alternatives, and practical PCB/layout notes not found in the manufacturer datasheet, accelerating BOM decisions for automotive LIN sub-network designs.
ドロップイン代替品: TJA1022TK — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: TJA1022TK （同一形状・フットプリント） — 相違点: Function, Package.
クイック比較ツール — 並列比較する代替部品を選択:
TJA1022T
✅ ドロップイン📋 参考代替品（カタログ未掲載）
TJA1027T
✅ ドロップイン📋 参考代替品（カタログ未掲載）
TJA1027TK
✅ ドロップイン📋 参考代替品（カタログ未掲載）
TJA1029T
✅ ドロップイン📋 参考代替品（カタログ未掲載）
TJA1029TK
✅ ドロップイン📋 参考代替品（カタログ未掲載）
TJA1022TK 仕様
| 機能 | Dual LIN 2.2A / SAE J2602 transceiver |
| Number of Channels | 2 (dual LIN) |
| Protocol | LIN 2.0, LIN 2.1, LIN 2.2, LIN 2.2A, SAE J2602 |
| Maximum Baud Rate | 20 kBd |
| パッケージ | HVSON14 (3 x 4.5 mm) with exposed pad |
| 実装タイプ | Surface Mount |
| Transient Protection | ISO 7637 (per automotive LIN conformance) |
| Leader / Leader Capability | Yes (each channel) |
| Pin Compatibility | Pin compatible with TJA1020, TJA1021, TJA1027, TJA1029 (SO14 / HVSON14 footprint) |
| RoHS ステータス | Compliant |
TJA1022TK ピン構成
| ピン 1 | TXD1 — LIN channel 1 transmit data input from microcontroller |
| ピン 2 | GND — Ground |
| ピン 3 | VCC — 5 V logic supply for digital I/O |
| ピン 4 | RXD1 — LIN channel 1 receive data output to microcontroller |
| ピン 5 | WAKE_N — Wake-up input (active low) for LIN wake from sleep |
| ピン 6 | LIN1 — LIN channel 1 bus line |
| ピン 7 | VBAT — Battery supply (12 V automotive) |
| ピン 8 | LIN2 — LIN channel 2 bus line |
| ピン 9 | SLP_N — Sleep mode control input (active low) |
| ピン 10 | RXD2 — LIN channel 2 receive data output |
| ピン 11 | NC — Not connected (per datasheet) |
| ピン 12 | VCC — 5 V logic supply (alternate pin) |
| ピン 13 | TXD2 — LIN channel 2 transmit data input |
| ピン 14 | GND — Ground (alternate pin) |
主な用途
TJA1022TK の用途: 6 件s: Automotive Door Module LIN Sub-bus, Seat Control Module with Multiple LIN Axes, HVAC and Climate Control LIN Panel, Roof Console and Interior Lighting LIN Sub-bus, Steering-Wheel Button Interface Module, Powertrain Sensor LIN Sub-network.
Automotive Door Module LIN Sub-bus
The TJA1022TK integrates two independent LIN 2.2A physical-layer channels in one HVSON14 IC, making it ideal for door modules that need separate LIN sub-buses for window/lock control and mirror adjustment. Its pin compatibility with the TJA1020/TJA1021/TJA1027/TJA1029 family simplifies PCB layout reuse across vehicle platforms, while the 20 kBd maximum baud rate comfortably handles switch-scanning and mirror-position feedback. The HVSON14 exposed pad improves thermal dissipation in door cavities that can reach 85 C ambient. Per the NXP TJA1022 datasheet, both channels meet LIN 2.2A and SAE J2602 conformance including the dominant-timeout and slew-rate control requirements, ensuring interoperability with mixed-OEM LIN followers.
おすすめ
Seat Control Module with Multiple LIN Axes
Modern seat modules use multiple LIN sub-buses for position motors, occupancy sensors, and heating pads. The TJA1022TK's dual-channel integration halves the PCB area versus two TJA1027 ICs and reduces quiescent current by sharing common supply and ground pins. Its LIN 2.2A compliance supports the latest node-configuration and diagnostic frames required by OEM seat-control firmware. The 14-pin HVSON14 footprint with exposed pad supports the high current transients of seat-motor driver rails nearby. Designers should follow NXP's reference design for proper LIN bus filtering and reverse-battery protection on the Vbat pin.
おすすめ
HVAC and Climate Control LIN Panel
Climate-control head units and rear-seat HVAC panels typically expose one or two LIN sub-buses for blower control, flap actuators, and temperature sensors. The TJA1022TK serves both sub-buses from a single HVSON14 IC, saving PCB area in compact HVAC modules where space is constrained by the display and connector. Its LIN 2.2A compliance ensures compatibility with the latest LIN-defined sensor-slave frames. The exposed thermal pad keeps junction temperature in check when the panel sits next to a hot blower-MOSFET heat sink.
おすすめ
Roof Console and Interior Lighting LIN Sub-bus
Roof consoles integrate ambient lighting, sunroof control, and SOS buttons on one or two LIN sub-buses. The TJA1022TK provides the dual physical-layer interface needed to separate the lighting-LIN from the switch-LIN, while sharing Vbat and GND. Its low sleep-mode quiescent current (refer to datasheet for exact value) is essential for parked-vehicle standby drain. The HVSON14 footprint suits the low-profile roof-module enclosure.
おすすめ
Steering-Wheel Button Interface Module
Steering-wheel button modules use a single LIN sub-bus that runs through the clock-spring harness to the body controller. The TJA1022TK can serve the LIN physical layer while its second channel is reserved for redundancy or future expansion (e.g., paddle-shifters, heater buttons). Pin compatibility with TJA1029TK allows scaling from single- to dual-channel designs without PCB rework. The HVSON14 package survives the high-vibration steering-column environment when properly soldered with the exposed pad.
おすすめ
Powertrain Sensor LIN Sub-network
Engine and transmission sensors often connect to a LIN sub-bus tied to a body or powertrain domain controller. The TJA1022TK's LIN 2.2A compliance including SAE J2602 makes it suitable for under-hood sensors such as oil-level sensors, battery-monitoring sensors, and transmission fluid sensors. Its wide operating temperature range (per NXP datasheet) supports the harsh thermal environment of the engine bay. The HVSON14 exposed pad provides the thermal margin needed for sustained high-ambient operation.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: TJA1022TK — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | TJA1022T | TJA1027TK | TJA1027T | TJA1029TK | TJA1029T |
|---|---|---|---|---|---|---|
| Package | HVSON14 (3 x 4.5 mm) | SO14 - same die | HVSON14 - same footprint, single channel | SO14 - single channel | HVSON14 - single channel, software-compatible | SO14 - single channel |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| LIN Channels | 2 (dual) | 2 (dual) | 1 (single) | 1 (single) | 1 (single) | 1 (single) |
| LIN Protocol | LIN 2.0/2.1/2.2/2.2A + SAE J2602 | LIN 2.0/2.1/2.2/2.2A + SAE J2602 | LIN 2.2A + SAE J2602 | LIN 2.2A + SAE J2602 | LIN 2.2A + SAE J2602 | LIN 2.2A + SAE J2602 |
| Maximum Baud Rate | 20 kBd | 20 kBd | 20 kBd | 20 kBd | 20 kBd | 20 kBd |
| Leader / Leader Capability | Yes (both channels) | Yes (both channels) | Yes | Yes | Yes | Yes |
| Sleep Mode Support | Yes | Yes | Yes | Yes | Yes | Yes |
| Pin Compatibility with TJA1022TK | N/A (this part) | Yes (SO14 variant) | Yes (single-channel) | Yes (single-channel SO14) | Yes (single-channel, software-compatible) | Yes (single-channel SO14) |
主な差別化要因
- Dual LIN channels in one HVSON14 IC （vs TJA1027TK (single LIN))
- Same HVSON14 footprint as TJA1027 / TJA1029 （vs TJA1027T (SO14 single LIN))
- Wide LIN protocol coverage including SAE J2602 （vs Older TJA1020 / TJA1021)
設計ノート
The HVSON14 exposed thermal pad must be soldered to a continuous ground copper pour with at least 4 thermal vias to the inner ground plane. For under-hood modules reaching 85 C ambient, this provides the thermal margin needed for sustained LIN bus activity. Refer to NXP's HVSON14 PCB layout application brief for via pattern and copper-pour sizing recommendations.
Keep the LIN bus traces short and route them away from noisy switching nodes such as DC-DC inductors or motor-driver FETs. Add the recommended series resistor and ESD diode on each LIN pin if the module is exposed to handling transients or external connector ESD; the datasheet application circuit shows the reference protection network. Place the Vbat reverse-battery protection diode as close to the connector as possible.
Do not float the SLP_N pin - tie it to VCC through a pull-up or drive it from the microcontroller. A floating SLP_N can cause undefined behavior between normal and sleep modes. Ensure TXD1 and TXD2 are driven low during power-up until the microcontroller GPIO is initialized; otherwise the LIN bus may transmit a dominant pulse that wakes other nodes unintentionally. Follow the NXP datasheet's initialization sequence for proper LIN conformance.
Place the Vbat decoupling capacitor (typically 100 nF ceramic) within 2 mm of the Vbat pin. Add a bulk capacitor (10 uF or higher) close to the IC for transient load steps when the LIN bus switches from recessive to dominant. The TXD/RXD logic signals should be routed as short 50-ohm microstrip pairs to the host microcontroller to avoid ringing on the digital I/O.
コンプライアンス情報
AEC-Q100 qualified for automotive use per NXP product family page. RoHS and lead-free confirmed by NXP product page. Halogen-free status to be confirmed against the specific TJA1022TK datasheet revision. LIN conformance per LIN 2.0/2.1/2.2/2.2A and SAE J2602. ISO 7637 compliance for automotive transient protection.
