USB7206T/KDX - 6-Port USB 3.1 Gen 2 Hub Controller | Microchip
部品番号: USB7206T/KDX ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $13.5 | $13.50 |
| 10 | $12.15 | $121.50 |
| 100 | $10.8 | $1,080.00 |
| 500 | $9.65 | $4,825.00 |
| 1,000 | $8.55 | $8,550.00 |
USB7206T/KDX 概要
A USB hub is a tiered-connectivity device that expands a single upstream USB port into multiple downstream ports while handling protocol translation, transaction scheduling, port power management, and suspend/resume events. In modern embedded designs, hubs belong to the broader class of interface ICs (USB-interface ICs) and sit between the system-on-chip host processor and end-user peripherals such as storage, displays, and human-interface devices. The USB7206 family implements the latest USB 3.1 Gen 2 specification, doubling the per-port bandwidth of legacy Gen 1 hubs and enabling downstream support for 4K cameras, NVMe enclosures, and dual-display docking stations.
Key features of the USB7206T/KDX include a USB 3.1 Gen 2 compliant PHY, integrated 5 Gbps and 10 Gbps SerDes, native USB Type-C mux logic, I2C/SPI/GPIO host configuration interface, and ARM Cortex-M0 core for firmware configurability. Per Microchip datasheet 00002875A, the device supports USB Power Delivery 3.0 billboard messaging, FlexConnect role-swap, and USB-IF Battery Charging v1.2 CDP/SDP/DCP modes on every port. Native 1.09 V core supply and 3.3 V I/O allow direct connection to modern SoC rails.
Architecture-wise, the USB7206T/KDX uses a multi-clock-domain design with an embedded USB 3.1 Gen 2 PHY on each downstream port. An integrated ARM Cortex-M0 microcontroller handles configuration, GPIO bridging, and I2C/SPI slave interfaces, eliminating external MCU requirements for hub bring-up. The 100-VQFN exposed pad enables direct PCB thermal coupling, sustaining 6-port operation at industrial-grade ambient temperatures.
Typical applications include USB Type-C docking stations, automotive head-unit USB expansion, industrial PCs, and medical-imaging consoles. The wide temperature grade of 0°C to 70°C supports commercial embedded chassis. Designers should evaluate upstream Type-C mux partners and downstream port-protection ICs for full USB-IF compliance.
ドロップイン代替品: USB7206T/KDX — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
クイック比較ツール — 並列比較する代替部品を選択:
USB7206T-I/KDX
✅ ドロップイン📋 参考代替品（カタログ未掲載）
USB7206T/KDXD01
✅ ドロップイン📋 参考代替品（カタログ未掲載）
USB7206C
✅ ドロップイン📋 参考代替品（カタログ未掲載）
USB5744T/2GD01
✅ ドロップイン📋 参考代替品（カタログ未掲載）
USB7206T/KDX 仕様
| 機能 | USB Hub Controller |
| Protocol | USB |
| USB Standard | USB 3.1 Gen 2 (backward-compatible to USB 2.0) |
| Downstream Ports | 6 |
| Host Interfaces | I2C, SPI |
| 電源電圧 | 1.09 V to 3.6 V |
| パッケージ | 100-VQFN (12x12 mm) with exposed pad |
| 実装タイプ | Surface Mount |
| 動作温度 | 0 °C to 70 °C |
| Maximum Data Rate | 10 Gbps (SuperSpeed+) |
| SuperSpeed Support | Yes (5 Gbps SS and 10 Gbps SS+) |
| Power Delivery Support | USB PD 3.0 billboard |
| Battery Charging | USB-IF BC v1.2 (CDP/SDP/DCP) |
| Lead-Free / RoHS | Yes / Compliant |
USB7206T/KDX 100-vqfn (12x12 mm) with exposed pad ピン配置ガイド
USB7206T/KDX (100-vqfn (12x12 mm) with exposed pad パッケージ) のピン配置。 ピン番号、機能、接続図はメーカーのデータシートで定義されています。正確なフットプリントとはんだ付けのガイドラインについては、データシートを参照してください。
詳細なピン配置データはありません: USB7206T/KDX.
詳細は データシート をご参照ください。
主な用途
USB7206T/KDX の用途: 6 件s: USB Type-C Docking Station, Embedded Industrial PC USB Expansion, Automotive Head-Unit USB Hub, Medical Imaging Console, Workstation Docking & Multi-Display, Gaming Peripheral Hub.
USB Type-C Docking Station
The USB7206T/KDX's 10 Gbps SuperSpeed+ per-port bandwidth and 6 downstream ports make it ideal for USB Type-C docking stations aggregating NVMe SSD, dual 4K display outputs, and high-speed peripherals. It is fully USB-IF Type-C compliant and supports USB PD 3.0 billboard messaging for alternate-mode negotiation. Designers pair the hub with a USB Type-C mux such as the TUSB320HAIRWBR from the Site MPN list, sourcing 5 V/3 A through VBUS while maintaining upstream Power Delivery contracts. The 100-VQFN (12x12 mm) footprint enables slim docking-station form factors where PCB area is at a premium.
おすすめ
Embedded Industrial PC USB Expansion
Industrial PCs and edge-computing gateways rely on the USB7206T/KDX to fan-out a single root-hub port into 6 USB-3.1-Gen-2 ports while preserving backward compatibility with legacy USB-2.0 industrial sensors and HMIs. The 1.09 V core supply integrates directly with modern Intel/AMD SoC rails, and the exposed-pad 100-VQFN package sustains 6-port concurrent operation at 0-70 °C. The hub's per-port CDP/SDP/DCP charging modes streamline connectivity for barcode scanners, label printers, and instrumentation without auxiliary charge controllers.
おすすめ
Automotive Head-Unit USB Hub
The USB7206T/KDX aggregates 6 downstream ports in automotive head units serving rear-seat entertainment, smartphone projection (CarPlay/Android Auto), and mass-storage playback. With 10 Gbps SuperSpeed+ per port, simultaneous 1080p mirror plus external HDD playback is achievable. The commercial 0-70 °C grade suits cabin environments; for under-hault or industrial -40 to 85 °C, designers migrate to the USB7206T-I/KDX drop-in variant. Firmware-configurable GPIO bridging simplifies integration with automotive MOST/Ethernet backbones.
おすすめ
Medical Imaging Console
Medical imaging consoles (ultrasound, endoscopy, surgical displays) use the USB7206T/KDX to interface with high-bandwidth cameras, frame grabbers, and capacitive-touch HMIs while remaining USB-IF compliant for EMI/ESD certification. The 10 Gbps downstream bandwidth enables real-time 4K medical-grade video capture, and the integrated ARM Cortex-M0 eliminates an external MCU for hub bring-up. Pairing with medical-isolated USB transceivers ensures IEC 60601-1 patient-safety compliance.
おすすめ
Workstation Docking & Multi-Display
Workstation docking stations leverage the USB7206T/KDX to deliver 10 Gbps SS+ throughput per port, enabling simultaneous dual-4K DisplayPort alt-mode tunneling, NVMe storage, and high-speed audio interfaces. The hub's native USB PD 3.0 billboard messaging advertises alternate-mode capabilities to the host system. The 100-VQFN exposed-pad package maintains thermals within slim aluminum chassis, supporting continuous multi-display workloads without thermal throttling.
おすすめ
Gaming Peripheral Hub
High-end gaming desktops and consoles use the USB7206T/KDX to provide 6 SS+ ports with sub-microsecond latency for VR headsets, racing wheels, and 4K capture cards. The integrated USB-IF BC v1.2 fast-charging modes keep wireless controllers topped up during long sessions. The 10 Gbps per-port pipeline eliminates frame-pacing bottlenecks in VR pass-through cameras and 4K capture setups, while the 1.09 V core supply enables direct PCIe-bus power-rail integration.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: USB7206T/KDX — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | USB7206T-I/KDX | USB7206T/KDXD01 | USB7206C | USB5744T/2GD01 |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-VQFN (12x12 mm) | 100-VQFN (12x12 mm) - same | 100-VQFN (12x12 mm) - same | 100-VQFN (12x12 mm) - same | 100-VQFN (12x12 mm) - same |
| USB Standard | USB 3.1 Gen 2 (10 Gbps) | USB 3.1 Gen 2 (10 Gbps) | USB 3.2 Gen 2 (10 Gbps) | USB 3.2 Gen 2 (10 Gbps) | USB 3.2 Gen 1 (5 Gbps) - lower |
| Downstream Ports | 6 | 6 | 6 | 6 | 4 - lower |
| Host Interfaces | I2C, SPI | I2C, SPI | I2C, SPI, GPIO, I2S, SMBus | I2C, SPI | Serial, SMBus, SPI |
| Lifecycle Status | Active | Active | Active | Active | Obsolete |
主な差別化要因
- Higher downstream data rate (10 Gbps SS+) than the obsolete USB5744T/2GD01 (5 Gbps) （vs USB5744T/2GD01)
- Active lifecycle status vs obsolete USB5744T/2GD01 （vs USB5744T/2GD01)
- Industrial temperature variant via USB7206T-I/KDX （vs USB7206T-I/KDX)
設計ノート
Estimated: The 100-VQFN (12x12 mm) exposed pad is mandatory for sustained 6-port SuperSpeed+ operation. The exposed pad must be soldered to a top-layer copper pour of at least 1 square inch with 9 thermal vias (0.3 mm drill, 1.0 mm pitch) to inner ground plane. With all 6 downstream ports active at SS+, internal dissipation can reach 1.5-2.0 W. Without adequate thermal coupling, junction temperature may exceed 100 °C and trigger thermal shutdown. Add a top-side copper flood around the package and stitch vias at 2 mm spacing.
Route SuperSpeed differential pairs (USB3 TX/RX) with 90 Ω differential impedance and length-matched to within 150 mil (3.8 mm). Use 4-layer stack-up with continuous reference plane on layers 2 and 3. Place AC-coupling capacitors (100 nF) within 200 mil of the USB7206T/KDX SS+ TX pins. Avoid routing USB traces across plane splits; the reference-plane return-path discontinuity introduces severe SS+ jitter and EMI. Stitching vias must surround the high-speed pair exits at 1 mm spacing.
Common pitfalls include: (1) omitting USB-IF-certified common-mode chokes on SS+ pairs (causes EMI failures); (2) failing to populate the 100 nF bypass on every VDD pin (causes link-training failures under load); (3) using standard FR-4 instead of high-Tg or low-loss PCB material (degrades SS+ eye at 10 Gbps); (4) neglecting to update SPI/I2C firmware when migrating from USB7206T/KDX to USB7206T-I/KDX despite identical pinout (revision-specific errata apply).
At 10 Gbps SuperSpeed+, the USB7206T/KDX requires USB-IF-compliant re-timer/redriver evaluation if downstream cable exceeds 3 meters. Reference Microchip application note AN2937 for SS+ signal-integrity compliance patterns. Use a Tektronix or LeCroy real-time scope with at least 12 GHz bandwidth for SS+ eye-diagram validation. Channel loss budgets must remain below -3 dB at 5 GHz to meet USB-IF Gen 2 compliance masks.
コンプライアンス情報
RoHS and lead-free per Microchip product page. Not AEC-Q100 qualified (commercial grade only). USB-IF certified TID available from Microchip upon request.
