VM2152 - Versal Prime Adaptive SoC, 757K Logic Cells | AMD
部品番号: VM2152 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $1500 | $1,500.00 |
| 10 | $1400 | $14,000.00 |
| 100 | $1300 | $130,000.00 |
| 500 | $1200 | $600,000.00 |
| 1,000 | $1100 | $1,100,000.00 |
VM2152 概要
An adaptive SoC (System-on-Chip) combines a processing system (PS) with programmable logic (PL) on a single die, enabling hardware-software co-design and dynamic reconfiguration. The Versal Prime series is the foundational family of AMD's adaptive compute acceleration platform (ACAP), targeting applications that require high data throughput, low latency, and flexibility. The VM2152 specifically uses the Processing System Wizard IP instead of the CIPS IP for configuring the processing system, a unique feature among Versal Prime devices.
Key features of the VM2152 include 112 Gb/s GTM transceivers supporting 600 GbE networking, increased DSP capability compared to previous Versal Prime devices, and support for LPDDR5/DDR5 memory interfaces. The device also integrates a programmable network-on-chip (NoC) for efficient data movement between the PS, PL, and memory interfaces. These features make it suitable for high-speed connectivity, data center networking, and wired communications.
From a technical perspective, the VM2152 leverages AMD's 7nm process technology, offering a balance of performance and power efficiency. The dual-core A72 cluster provides high-performance general-purpose computing, while the R5F cores handle real-time tasks. The programmable logic fabric supports custom accelerators and protocol implementations, and the integrated NoC simplifies system integration by providing a standardized interconnect.
Typical applications include data center networking (600 GbE switches), storage controllers, wired communications (400G connectivity), and high-performance embedded computing. The device's high-bandwidth memory interfaces and transceivers enable it to handle massive data streams with low latency.
When designing with the VM2152, careful attention must be paid to power delivery and thermal management due to its high performance. The 1369-FCBGA package requires a robust PCB layout with adequate decoupling and thermal vias. Additionally, the Processing System Wizard IP should be used for PS configuration, as the traditional CIPS IP is not supported on this device.
ドロップイン代替品: VM2152 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
クイック比較ツール — 並列比較する代替部品を選択:
XCVM2152-1MSENFVM1369
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XCVM2152-2MSENFVM1369
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XCVM2152-1MSENFVM1369
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XCVM2152-2MSENFVM1369
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XCVM2152-1MSENFVM1369
✅ ドロップイン📋 参考代替品（カタログ未掲載）
VM2152 最大定格＆電気的特性
| Family | Versal Prime |
| Logic Cells | 757K |
| Application Processor | Dual ARM Cortex-A72 MPCore with CoreSight |
| Real-Time Processor | Dual ARM Cortex-R5F with CoreSight |
| Max A72 Frequency | 1.4 GHz |
| Max R5F Frequency | 600 MHz |
| GTM Transceivers | 112 Gb/s |
| LPDDR5 Support | Up to 6400 Mb/s |
| DDR5 Support | Up to 5600 Mb/s |
| パッケージ | 1369-FCBGA (35x35 mm) |
| 実装タイプ | Surface Mount |
| RoHS ステータス | Compliant |
| Processing System Configuration | Processing System Wizard IP (not CIPS) |
VM2152 1369-fcbga (35x35 mm) ピン配置ガイド
VM2152 (1369-fcbga (35x35 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: VM2152.
詳細は データシート をご参照ください。
主な用途
VM2152 の用途: 6 件s: Data Center Networking, Wired Communications, Storage Controllers, High-Performance Embedded Computing, Test and Measurement, Aerospace and Defense.
Data Center Networking
The VM2152 is ideal for data center networking applications such as 600 GbE switches and routers. Its 112 Gb/s GTM transceivers support high-speed SerDes links, while the dual ARM Cortex-A72 processors handle control plane tasks. The programmable logic can implement custom packet processing and traffic management, and the integrated NoC ensures low-latency data movement between the PS, PL, and memory interfaces. With support for DDR5 and LPDDR5, the VM2152 can buffer large packets and maintain high throughput.
おすすめ
Wired Communications
In wired communications, the VM2152 supports 400G connectivity and high-bandwidth interfaces. Its 112 Gb/s transceivers enable 400G Ethernet and OTN applications. The device's DSP capability is increased compared to previous Versal Prime devices, making it suitable for forward error correction (FEC) and signal processing. The ARM cores can run protocol stacks, while the PL accelerates data path functions. The VM2152's power efficiency is critical for line card designs where thermal constraints are tight.
おすすめ
Storage Controllers
The VM2152 is well-suited for storage controllers in enterprise SSDs and RAID systems. Its high-bandwidth DDR memory interfaces (LPDDR5 up to 6400 Mb/s) provide fast access to metadata and caching. The programmable logic can implement NVMe controllers, RAID engines, and encryption accelerators. The dual ARM Cortex-A72 processors handle host interface protocols, while the R5F cores manage real-time tasks. The VM2152's 112 Gb/s transceivers enable high-speed PCIe or Ethernet connectivity to the host.
おすすめ
High-Performance Embedded Computing
For high-performance embedded computing, the VM2152 offers a balance of processing power and flexibility. The dual ARM Cortex-A72 cores provide high-performance general-purpose computing, while the programmable logic allows custom accelerators for signal processing, AI inference, or protocol handling. The device's 757K logic cells and increased DSP capability support complex algorithms. The integrated NoC simplifies data movement, and the 112 Gb/s transceivers enable high-speed sensor or network interfaces.
おすすめ
Test and Measurement
In test and measurement equipment, the VM2152 can be used for high-speed data acquisition and signal generation. Its 112 Gb/s transceivers allow interfacing with high-speed ADCs/DACs, and the programmable logic can implement custom triggering and processing. The ARM processors can run user interfaces and control algorithms. The device's high-bandwidth memory interfaces support large sample buffers. The VM2152's flexibility enables reconfiguration for different measurement standards.
おすすめ
Aerospace and Defense
The VM2152 is suitable for aerospace and defense applications such as radar, electronic warfare, and secure communications. Its high-performance processing and programmable logic enable real-time signal processing and beamforming. The device's 112 Gb/s transceivers support high-speed data links, and the ARM cores handle control and communication protocols. The VM2152's reliability and long-term availability are important for defense programs. However, for extreme environments, consider the -Q or -M temperature grade variants.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: VM2152 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | XCVM2152-1MSENFVM1369 | XCVM2152-2MSENFVM1369 |
|---|---|---|---|
| Package | 1369-FCBGA (35x35 mm) | 1369-FCBGA (35x35 mm) - same | 1369-FCBGA (35x35 mm) - same |
| Brand | AMD | AMD | AMD |
| Logic Cells | 757K | 757K | 757K |
| Max A72 Frequency | 1.4 GHz | 1.2 GHz (approx) | 1.4 GHz |
| GTM Transceivers | 112 Gb/s | 112 Gb/s | 112 Gb/s |
| LPDDR5 Support | Up to 6400 Mb/s | Up to 6400 Mb/s | Up to 6400 Mb/s |
| DDR5 Support | Up to 5600 Mb/s | Up to 5600 Mb/s | Up to 5600 Mb/s |
| Speed Grade | -2 | -1 | -2 |
主な差別化要因
- Higher transceiver speed (112 Gb/s) compared to previous Versal Prime devices （vs XCVM2152-1MSENFVM1369)
- Increased DSP capability （vs Previous Versal Prime devices)
- Support for LPDDR5 up to 6400 Mb/s （vs XCVM2152-1MSENFVM1369)
設計ノート
The VM2152 requires multiple power rails with specific sequencing. Refer to the Versal Prime power management documentation for recommended power-up sequences. Use PMICs like the TPS650864 or similar to manage the multiple rails. Ensure adequate decoupling capacitors on all power pins to minimize voltage ripple.
The VM2152 can dissipate significant power, especially when using high-speed transceivers and high logic utilization. Use a heatsink and forced airflow to keep the junction temperature within limits. The 1369-FCBGA package has a large thermal pad; ensure proper thermal vias and a solid ground plane for heat spreading.
For high-speed transceivers (112 Gb/s), use controlled impedance traces and minimize via stubs. Follow AMD's PCB design guidelines for Versal devices, including layer stackup recommendations and signal integrity practices. Place transceiver power supply decoupling close to the pins.
コンプライアンス情報
RoHS compliant per AMD product page. Other compliance data not specified in provided sources.
