VSC7410XMT - 6-Port Enterprise Ethernet Switch | Microchip
部品番号: VSC7410XMT ✓ 生産中VSC7410XMT 概要
An Ethernet switch is a semiconductor that forwards Ethernet frames between multiple network ports using hardware-based address lookup. It belongs to the network-interface hierarchy that includes Ethernet transceivers, network controllers, and interface ICs. By integrating switch functions and copper PHY resources on one device, the VSC7410XMT reduces the number of discrete components needed for a multiport networking platform while supporting precise timing applications.
The principal features include six configurable switch ports, two integrated copper PHYs, and a core operating range of 0.95 V to 1.05 V. IEEE 1588v2 capability is especially relevant to synchronized networks, while the operating-temperature range of -40°C to 125°C supports industrial and telecommunications equipment. The device also provides a two-wire serial interface and JTAG for configuration, diagnostics, and board-level control.
The VSC7410XMT is part of Microchip's Serval-T switch family and is positioned for market-ready enterprise-switch designs. Its 324-PBGA package concentrates substantial connectivity and switching resources into a 19 mm by 19 mm surface-mount footprint. Because the package contains many balls and requires controlled power and signal integrity, PCB layout should follow the manufacturer's pin assignment, reference-layout, and decoupling guidance exactly.
Typical uses include enterprise Ethernet switching, telecommunications aggregation, industrial Ethernet equipment, and time-sensitive networked systems. The two integrated copper PHYs are useful where the board includes direct copper connections, while the remaining switch ports support broader network-interface configurations when paired with suitable external PHY or serializer resources.
Power-system design is a critical implementation consideration because the specified 1.3 A current draw must be evaluated alongside the 0.95 V to 1.05 V supply range. Provide the required core and I/O supplies with low-impedance decoupling, and validate sequencing, thermal performance, and signal integrity on the final multilayer PCB before production release.
This product page combines the manufacturer's device description with practical guidance on supply requirements, package handling, Ethernet applications, and qualification. Because the 324-ball assignment is complex and no verified pin table accompanies the available technical material, use the manufacturer datasheet for final ball mapping, electrical limits, and layout implementation.
ドロップイン代替品: VSC7410XMT — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
この製品に利用可能なドロップイン代替品はありません。
代替品をリクエストVSC7410XMT 最大定格＆電気的特性
| Product Type | 6-port enterprise Ethernet switch with integrated copper PHYs |
| Number of Switch Ports | 6 ports |
| Integrated Copper PHYs | 2 PHYs |
| Timing Support | IEEE 1588v2 |
| Core Supply Voltage Range | 0.95 V to 1.05 V |
| Typical Current Draw | 1.3 A |
| 動作温度範囲 | -40°C to +125°C |
| Configuration Interface | 2-wire serial |
| Debug Interface | JTAG |
| パッケージ | 324-PBGA (19 mm × 19 mm) |
| 実装タイプ | Surface mount |
| Switch Family | Serval-T |
VSC7410XMT 324-pbga (19 mm × 19 mm) ピン配置ガイド
VSC7410XMT (324-pbga (19 mm × 19 mm) パッケージ) のピン配置。 ピン番号、機能、接続図はメーカーのデータシートで定義されています。正確なフットプリントとはんだ付けのガイドラインについては、データシートを参照してください。
詳細なピン配置データはありません: VSC7410XMT.
詳細は データシート をご参照ください。
主な用途
VSC7410XMT の用途: 6 件s: Enterprise Ethernet Switching, Telecommunications Aggregation, Industrial Ethernet Equipment, Time-Synchronized Network Equipment, Network Interface Expansion, High-Density Communications Line Card.
Enterprise Ethernet Switching
The VSC7410XMT fits centralized enterprise-switch designs that need six ports in a single 19 mm by 19 mm device. Its six-port Serval-T architecture reduces the number of separate switching devices required on a line card, while two integrated copper PHYs provide direct copper-interface resources. IEEE 1588v2 support adds value where synchronized timing is required. The design must accommodate the 324-ball PBGA, 0.95 V to 1.05 V core supply, and approximately 1.3 A typical current draw with careful layer transitions and decoupling.
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Telecommunications Aggregation
The VSC7410XMT is appropriate for telecommunications aggregation equipment requiring multiple Ethernet paths and precise synchronization. IEEE 1588v2 support makes the six-port switch relevant to timing-sensitive transport infrastructure, while the two integrated copper PHYs simplify equipment using copper-facing network ports. Its -40°C to +125°C operating range supports demanding industrial and communications environments. Layout should preserve continuous high-speed return paths and distribute the approximately 1.3 A core current through a low-impedance power network.
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Industrial Ethernet Equipment
The VSC7410XMT supports compact industrial Ethernet equipment that needs several network ports and robust temperature performance. The -40°C to +125°C range covers widely deployed industrial environments, and the integrated copper PHYs reduce board-level component count where direct copper connectivity is needed. IEEE 1588v2 can assist synchronized industrial control and monitoring networks. Engineers should validate thermal margins at the actual enclosure temperature and use the manufacturer's 324-PBGA reference layout for signal and power integrity.
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Time-Synchronized Network Equipment
The VSC7410XMT is suited to time-synchronized network equipment because its six-port switching core includes IEEE 1588v2 support. This capability is relevant to systems distributing timing across multiple Ethernet links while maintaining deterministic traffic handling. The device's integrated copper PHYs can simplify local access-port implementation, and its 0.95 V to 1.05 V core supply keeps the switching function compatible with compact high-performance hardware. Final validation should include clock, jitter, thermal, and network traffic testing in the completed system.
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Network Interface Expansion
The VSC7410XMT can form the switching core of a modular network-interface platform that expands beyond a single Ethernet port. Six switch ports provide a concentrated path for traffic aggregation, and the two integrated copper PHYs handle selected direct copper links on the same assembly. This arrangement can shorten board routing compared with a collection of unrelated network controllers. However, the 324-PBGA implementation requires exact ball mapping, layer-transition control, and power sequencing verification before fabrication.
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High-Density Communications Line Card
The VSC7410XMT suits communications line cards where multiple Ethernet connections must be consolidated into a limited board area. Its 324-PBGA package measures 19 mm by 19 mm and integrates two copper PHYs, providing a compact route to a six-port network function. IEEE 1588v2 support benefits synchronized transport systems, while the industrial temperature range accommodates equipment outside controlled office environments. Thermal analysis must account for the approximately 1.3 A typical core current and the enclosure's heat-transfer path.
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おすすめ製品の概要
エンジニアリング参考データ: VSC7410XMT — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 |
|---|---|
| Product Type | 6-port enterprise Ethernet switch |
| Brand | Microchip Technology |
| Package | 324-PBGA (19 mm × 19 mm) |
| Integrated Copper PHYs | 2 PHYs |
| Core Supply Voltage | 0.95 V to 1.05 V |
| Typical Current Draw | 1.3 A |
| Operating Temperature | -40°C to +125°C |
| Timing Support | IEEE 1588v2 |
| Configuration Interfaces | 2-wire serial and JTAG |
主な差別化要因
- Six-port switching integration （vs No verified drop-in alternative)
- Integrated copper-interface resources （vs No verified drop-in alternative)
- Precision timing capability （vs No verified drop-in alternative)
設計ノート
Design the core supply around the stated 0.95 V to 1.05 V range and approximately 1.3 A typical current draw. Place all required bulk and local decoupling capacitors directly at the associated power balls, provide short supply connections, and avoid creating narrow necks between planes. Review the manufacturer's power-sequencing, absolute-maximum, and recommended-operating sections before assigning rails or setting power-up limits.
Follow the manufacturer's 324-PBGA ball map and reference layout exactly. A 19 mm by 19 mm package with hundreds of connections is highly sensitive to layer transitions, via placement, and return-path continuity. Use symmetry for high-speed nets, maintain the specified layer stack, and route clock and Ethernet signals over continuous reference planes to control impedance variation and crosstalk.
Evaluate heat flow from the PBGA into both the PCB and the surrounding enclosure. The approximately 1.3 A typical core current at a nominal 1.0 V corresponds to roughly 1.3 W of core power, before I/O and external-circuit losses. This calculation is an estimate using the stated core voltage and current; actual dissipation, junction temperature, and required copper area must be confirmed against the complete datasheet operating conditions.
Do not infer the complete pinout from the package name or distributor diagrams. Confirm every signal, supply, and ground ball in the Microchip datasheet VMDS-10479, including multiplexing and no-connect guidance. Also separate the 0.95 V to 1.05 V core requirement from any external I/O supply or reference voltage, and verify configuration access through both the two-wire serial interface and JTAG before board bring-up.
コンプライアンス情報
Compliance status is not stated in the accessible manufacturer and distributor information. The -40°C to +125°C operating-temperature rating does not by itself establish AEC-Q100 qualification. Confirm environmental, material, and automotive declarations with Microchip before qualification.
