XB3-24Z8UM - XBee 3 PRO Zigbee 3.0 Micro U.FL MMT Module | Digi
部品番号: XB3-24Z8UM ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $36 | $36.00 |
| 10 | $32.4 | $324.00 |
| 100 | $28.8 | $2,880.00 |
| 500 | $25.92 | $12,960.00 |
| 1,000 | $23.4 | $23,400.00 |
XB3-24Z8UM 概要
An RF module (radio-frequency module) is a small PCB sub-assembly that integrates a wireless transceiver IC, matching network, crystal, and antenna interface into a single, EMC-compliant package. RF modules sit in the wireless connectivity hierarchy below discrete transceivers and above raw silicon ICs, abstracting RF design complexity so that MCU-based host boards can add wireless capability with a simple UART/SPI/I2C interface. The XB3-24Z8UM belongs to the XBee 3 PRO family, which adds extended RF link budget (PRO = higher TX power, lower RX sensitivity threshold) for longer-range mesh deployments.
Key features of the XB3-24Z8UM include 8 dBm (PRO) TX power, 2.4 GHz worldwide ISM band operation, Zigbee 3.0 mesh networking support, and a wide -40C to +85C industrial operating temperature range. The module integrates a Silicon Labs EFR32MG SoC with on-board microcontroller, eliminating the need for an external host MCU in many edge-IoT designs. UART, SPI, and I2C host interfaces are exposed through the 34-pin MMT land pattern. The U.FL RF connector enables use of an external antenna selected for the deployment enclosure.
Typical applications include building automation nodes, smart lighting controllers, smart energy metering, digital health peripherals, industrial sensor mesh networks, and any IoT device requiring certified multi-vendor Zigbee 3.0 interoperability. The XBee 3 platform is supported by Digi's XCTU configuration tool and Digi Remote Manager cloud integration, simplifying provisioning and OTA firmware updates.
When designing with this module, note that antenna selection is critical - although the U.FL connector is present, RF performance depends entirely on the chosen external antenna, its placement, and ground plane clearance. Allow at least 5 mm of keep-out under the antenna feed trace, follow the MMT footprint exactly, and avoid placing the module near large metal planes that detune the antenna.
ドロップイン代替品: XB3-24Z8UM — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: XB3-24Z8UM （同一形状・フットプリント） — 相違点: Frequency Band, Protocol.
クイック比較ツール — 並列比較する代替部品を選択:
XB3-24Z8RM
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XB3-24Z8RM-J
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XB3-24Z8UM-J
✅ ドロップイン✓ 在庫あり
$17.9 / 個
データシートを見る →XB3-24Z8PT
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XB3-24Z8CM
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XB3-24Z8UM 仕様（メーカー公開）
| Manufacturer | Digi International |
| Series | XBee 3 PRO |
| Protocol | Zigbee 3.0 / IEEE 802.15.4 |
| Frequency Band | 2.4 GHz ISM (2400 - 2483.5 MHz) |
| RF Data Rate (OTA) | 250 kbps |
| Serial Data Rate | up to 1 Mbps |
| Modulation | DSSS (Direct Sequence Spread Spectrum) |
| Transmit Power | 8 dBm (PRO) |
| Antenna Connector | U.FL (external antenna not included) |
| 実装タイプ | Surface Mount (MMT - Micro Mount) |
| 電源電圧 | 2.1 V to 3.6 V |
| Host Interface | UART, SPI, I2C |
| ピン数 | 34 |
| 動作温度 | -40C to +85C |
| RF IC | Silicon Labs EFR32MG |
| RoHS ステータス | Compliant |
| Form Factor | MMT (XBee 3 Micro) |
XB3-24Z8UM インターフェースとコネクタ
XB3-24Z8UM は、メーカーが公開している以下のインターフェースとコネクタを備えています: 電力入力。拡張ヘッダーのピン配置、コネクタのピン番号、電気的制限はメーカーのドキュメントで定義されています。
| 電力入力 | 2.1 V to 3.6 V |
詳細は メーカー資料 をご参照ください（拡張ヘッダーのピン配置とコネクタのピン番号の詳細）。
電力・熱特性
| 電力入力 | 2.1 V to 3.6 V |
| 動作温度 | -40C to +85C |
メーカーが公開している XB3-24Z8UM の電力入力および熱パラメータ。
主な用途
XB3-24Z8UM の用途: 6 件s: Building Automation Mesh Nodes, Smart Lighting Controllers, Smart Energy Metering, Industrial Wireless Sensor Networks, Digital Health Peripherals, Smart Home / Consumer IoT Hubs and End Nodes.
Building Automation Mesh Nodes
The XB3-24Z8UM is a natural fit for building automation mesh nodes such as wireless HVAC controllers, occupancy sensors, and smart thermostats that participate in Zigbee 3.0 mesh topologies. The 2.4 GHz Zigbee 3.0 protocol provides interoperable multi-vendor mesh networking with self-healing routing, while the +8 dBm PRO TX power extends link budget through interior walls and across floors. The 34-pin MMT footprint allows compact PCB integration behind wall switches or in ceiling sensor housings, and the U.FL connector lets designers select an external antenna tuned to the plastic enclosure. Host MCUs communicate via UART or SPI, and Digi's XCTU tool simplifies commissioning of large mesh deployments.
おすすめ
Smart Lighting Controllers
Wireless smart lighting controllers, dimmers, and luminaire drivers benefit from the XB3-24Z8UM's Zigbee 3.0 mesh support and small MMT footprint. Designers can integrate the module into LED driver housings, occupancy/daylight sensors, and wall-mounted keypads to participate in certified lighting ecosystems. The module's 2.1-3.6 V supply range is compatible with typical LED driver aux rails, and the UART host interface connects directly to low-cost lighting MCUs. The PRO +8 dBm TX power ensures robust wireless coverage across large commercial lighting installations, while the -40C to +85C industrial temperature range suits outdoor and ceiling-mounted fixtures.
おすすめ
Smart Energy Metering
Smart electricity, gas, and water meters increasingly use Zigbee 3.0 for in-home displays (IHD) and demand-response integration. The XB3-24Z8UM module supports these metering applications with its certified Zigbee 3.0 stack, hardware AES-128 encryption, and proven Digi XBee OTA firmware update path. The Silicon Labs EFR32MG SoC's on-board ARM Cortex-M4 with stable hashing enables edge pre-processing of consumption data before transmission, reducing airtime and battery drain. The 2.1 V minimum supply accommodates battery-backed metering designs, while PRO TX power extends coverage to basement-mounted utility panels.
おすすめ
Industrial Wireless Sensor Networks
Industrial IoT deployments with battery-powered vibration, pressure, flow, and environmental sensors can use the XB3-24Z8UM for resilient Zigbee 3.0 mesh networking. The module's -40C to +85C industrial temperature range handles factory floor extremes, and the 2.4 GHz worldwide ISM band eliminates regional variants. The PRO +8 dBm TX power and link-budget headroom overcome metal-rich environments with machinery, while mesh self-healing reroutes around failed nodes. UART/SPI/I2C host interfaces connect to industrial sensor MCUs such as STM32, EFR32, or MSP430 families, and Digi's XCTU and OTA tools streamline commissioning of large mesh deployments.
おすすめ
Digital Health Peripherals
Wearable health monitors, remote patient telemetry patches, and home medical devices can integrate the XB3-24Z8UM for certified Zigbee 3.0 connectivity to hospital and home networks. The module's small MMT footprint suits compact wearables, and the U.FL connector accommodates medical-grade external antennas tuned for body-area propagation. Zigbee 3.0 provides AES-128 hardware encryption essential for HIPAA/GDPR patient data, and Digi's mature XBee OTA update path supports secure firmware updates in clinical environments. The 2.1 V minimum supply extends battery life in low-duty-cycle wearable designs.
おすすめ
Smart Home / Consumer IoT Hubs and End Nodes
Consumer smart home hubs, door/window sensors, smart locks, and appliance controllers can use the XB3-24Z8UM as a Zigbee 3.0 end node or router. The module's interoperable Zigbee 3.0 stack is compatible with Amazon Echo Plus, Philips Hue, Samsung SmartThings, and other major ecosystems. The MMT surface-mount form factor supports compact PCB integration into small consumer enclosures, while the U.FL connector accommodates internal antenna placement in plastic housings. PRO TX power improves whole-home coverage for hard-to-reach end nodes, and the XBee 3 platform's OTA update path supports secure post-deployment firmware maintenance.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: XB3-24Z8UM — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | XB3-24Z8RM | XB3-24Z8RM-J | XB3-24Z8UM-J | XB3-24Z8PT | XB3-24Z8CM |
|---|---|---|---|---|---|---|
| Brand | Digi International | Digi International | Digi International | Digi International | Digi International | Digi International |
| Package | 34-pin MMT (SMT) | 34-pin MMT (SMT) - same | 34-pin MMT (SMT) - same | 34-pin MMT (SMT) - same | Through-hole XBee | Through-hole XBee |
| Antenna | U.FL connector (external, not included) | Integrated RF pad (onboard) | Integrated RF pad (Japan regulatory) | U.FL (Japan regulatory variant) | PCB trace antenna | U.FL or PCB options |
| Mounting Type | Surface Mount (MMT) | Surface Mount (MMT) | Surface Mount (MMT) | Surface Mount (MMT) | Through-hole | Through-hole |
| Protocol | Zigbee 3.0 / IEEE 802.15.4 | Zigbee 3.0 / IEEE 802.15.4 | Zigbee 3.0 / IEEE 802.15.4 | Zigbee 3.0 / IEEE 802.15.4 | Zigbee 3.0 / IEEE 802.15.4 | Zigbee 3.0 / IEEE 802.15.4 |
| TX Power | +8 dBm (PRO) | +8 dBm (PRO) | +8 dBm (PRO) | +8 dBm (PRO) | +8 dBm (PRO) | +8 dBm (PRO) |
| Supply Voltage | 2.1 V to 3.6 V | 2.1 V to 3.6 V | 2.1 V to 3.6 V | 2.1 V to 3.6 V | 2.1 V to 3.6 V | 2.1 V to 3.6 V |
| Regulatory Region | Global (FCC/ETSI/IC) | Global (FCC/ETSI/IC) | Japan | Japan | Global | Global |
主な差別化要因
- External U.FL antenna option for optimized radiation （vs XB3-24Z8RM)
- Surface-mount MMT form factor （vs XB3-24Z8CM)
- PRO RF performance for extended link budget （vs XB3-24Z8RM (same PRO level))
設計ノート
Follow the Digi XBee 3 RF Module Hardware Reference Manual (90001543) MMT land pattern exactly. Maintain at least 5 mm of keep-out under the U.FL antenna feed trace and avoid placing the module near large ground planes or metal structures that detune the antenna. The MMT castellation pads require proper solder paste stencil aperture design - consult the reference manual for recommended paste volumes.
Antenna selection is critical for the XB3-24Z8UM - the U.FL connector is present but the external antenna is NOT included with the module. Choose a 2.4 GHz antenna with 50 ohm impedance matched to your enclosure's plastic composition. Per the Digi forum thread on RM-CM-UM variants, unused internal antenna traces on the PCB do not significantly interfere, but improper antenna selection will severely degrade range and link budget.
Design the host 3.3 V rail to deliver at least 250 mA peak (TX bursts at +8 dBm draw approximately 120 mA plus host MCU margin). Place a 10 uF bulk capacitor and 0.1 uF decoupling capacitor within 5 mm of the module's VCC pin. Avoid sharing the XB3-24Z8UM's supply with noisy digital rails; route a dedicated LDO output if possible. Peak currents during CSMA backoff can cause voltage droop if the host rail is undersized.
コンプライアンス情報
RoHS compliant per Digi product page. FCC/ETSI/IC certified for global deployment. Japan variants (XB3-24Z8UM-J) carry MIC certification. Not AEC-Q100 qualified - module is not intended for automotive under-hood applications.
