XC3S2000-4FG900I - 2M-Gate Spartan-3 FPGA | AMD Xilinx
部品番号: XC3S2000-4FG900I ✗ 生産終了XC3S2000-4FG900I 概要
A field-programmable gate array is a programmable digital semiconductor in which configurable logic blocks, programmable interconnect, and input/output resources implement digital systems. An FPGA belongs to the broader hierarchy of programmable logic devices, alongside CPLDs, and provides substantially greater logic capacity. The Spartan-3 architecture combines configurable logic, block RAM, dedicated DSP resources, programmable I/O, and on-chip support for clocking and configuration.
The XC3S2000-4FG900I’s headline resources are 2,000,000 system gates, 46,080 logic cells, 565 I/O, and a 900-ball BGA package. Its 1.2 V core supply suits low-voltage digital systems where board-area efficiency and high I/O density are priorities. The large ball-grid array also supports dense connections between programmable resources and external circuitry without relying on a larger leaded package.
Within the Spartan-3 family, the -4 speed grade provides a defined balance between logic performance and device organization. Exact maximum clock rates depend on the selected design, I/O standard, speed grade, timing constraints, and tool version. Because an FPGA’s usable performance is determined by the routed critical path rather than a single headline frequency, timing closure must be completed with the appropriate synthesis and implementation constraints.
Typical uses include network-interface control, industrial automation, communications equipment, embedded video processing, instrumentation, and general-purpose digital signal-processing systems. A design requiring parallel interfaces, substantial logic density, moderate-to-high-speed serial links, and deterministic embedded control can benefit from combining programmable logic, block RAM, DSP, and dedicated I/O in one device.
A 900-ball BGA requires careful PCB planning, including a multilayer board with controlled-impedance routing, via access beneath the device, adequate power and ground distribution, and assembly-process compatibility. Designers should also verify configuration logic, memory-interface topology, I/O standards, voltage tolerances, thermal performance, and pin constraints in the manufacturer datasheet before schematic capture and layout release.
This product page consolidates the device’s principal architecture, package, and application information with engineering-focused comparison data and design guidance. It is intended to help engineers confirm fit, plan the PCB, and assess Spartan-3 alternatives without treating package similarity alone as proof of drop-in compatibility.
ドロップイン代替品: XC3S2000-4FG900I — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
XC3S2000-4FGG900I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XC3S2000-5FGG900I
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
XC3S2000-5FG900I
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
XC3S2000-4FGG900C
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
XC3S2000-5FGG900C
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
XC3S2000-4FG900I 最大定格＆電気的特性
| Device Type | Spartan-3 field-programmable gate array (FPGA) |
| System Gates | 2,000,000 gates |
| Logic Cells | 46,080 cells |
| User I/O | 565 I/O |
| Core Supply Voltage | 1.2 V |
| Speed Grade | -4 |
| Temperature Grade | Industrial grade |
| パッケージ | 900-ball BGA (900-BBGA) |
| Package Body Form | Square |
| Terminal Type | Ball |
| Number of Terminals | 900 balls |
| JEDEC Package Code | S-PBGA-B900 |
| Device Technology | FPGA programmable logic |
| Logic Resource | Configurable logic blocks and programmable interconnect |
| RoHS ステータス | unknown |
XC3S2000-4FG900I s-pbga-b900 ピン配置ガイド
XC3S2000-4FG900I (s-pbga-b900 パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: XC3S2000-4FG900I.
詳細は データシート をご参照ください。
主な用途
XC3S2000-4FG900I の用途: 6 件s: Industrial Automation Controller, Network Interface and Packet Processing, Embedded Video Preprocessing, Communications and Signal Processing, Test and Measurement Instrumentation, Aerospace Ground-Support Equipment.
Industrial Automation Controller
The XC3S2000-4FG900I fits industrial automation controllers because it combines 46,080 logic cells with 565 user I/O in one Spartan-3 package. It can implement motion sequencing, sensor conditioning logic, communications protocols, and machine-safety interlocks while reducing the number of discrete controllers. The industrial I grade is appropriate for systems expected to operate beyond consumer-temperature conditions. Designers should allocate I/O banks carefully, validate the exact operating-temperature limits, and verify timing with the -4 speed constraints before releasing production hardware.
おすすめ
Network Interface and Packet Processing
The XC3S2000-4FG900I is suitable for network-interface and packet-processing logic that requires parallel buses, significant programmable logic, and dedicated digital resources. Its 2,000,000 system gates and 565 I/O allow designers to combine receive buffering, packet classification, state machines, and interface conversion in one FPGA. The 900-ball package provides dense routing access, although controlled-impedance layout and complete timing closure are essential. Validate line rates against the selected I/O standards and confirm that the implemented Spartan-3 resources meet throughput requirements.
おすすめ
Embedded Video Preprocessing
The XC3S2000-4FG900I can implement embedded video preprocessing when a design needs parallel pixel pipelines, line buffers, timing generation, and control interfaces. Its 46,080 logic cells and 2,000,000 system gates provide substantial parallelism, while block RAM and DSP resources can accelerate pixel manipulation when the exact device counts meet the design requirement. Because video timing and external interface speeds constrain achievable resolution and frame rate, use frame timing, clock-domain-crossing, and memory-timing constraints during implementation rather than relying on nominal logic-gate counts.
おすすめ
Communications and Signal Processing
The XC3S2000-4FG900I fits communications equipment requiring configurable filters, modulation logic, framing, and parallel data movement. Its large logic capacity permits several independent processing pipelines, and the -4 speed grade provides a defined device timing class for implementation. Designers should partition high-speed transceiver interfaces from DSP logic with careful clock planning and use the manufacturer’s DSP and block-RAM documentation to verify utilization. Post-route timing analysis should confirm setup and hold margins for every memory, transceiver, and external peripheral interface.
おすすめ
Test and Measurement Instrumentation
The XC3S2000-4FG900I is useful in programmable test and measurement equipment because it can combine acquisition control, pattern generation, timing sequencing, and data processing in a single device. The 565 I/O support multiple digital channels, while the 46,080 logic cells allow parallel algorithms and instrument-control state machines to coexist. A successful implementation requires disciplined clock distribution, deterministic I/O timing, and careful treatment of analog companion devices. Validate edge rates, channel skew, and trigger latency against the instrument’s measurement specification.
おすすめ
Aerospace Ground-Support Equipment
The XC3S2000-4FG900I can support programmable ground-support and telemetry equipment where multiple I/O channels, long control sequences, and flexible logic are valuable. Its large FPGA resource count allows protocol handling, data acquisition, and supervisory logic to be consolidated, while the industrial temperature designation provides a useful starting point for controlled-environment equipment. Actual aerospace suitability depends on system qualification, radiation, environmental, and procurement requirements that are outside the component’s basic device specification. Confirm these requirements before designing the FPGA into a safety-critical system.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: XC3S2000-4FG900I — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | XC3S2000-4FGG900I | XC3S2000-5FGG900I | XC3S2000-5FG900I | XC3S2000-4FGG900C | XC3S2000-5FGG900C |
|---|---|---|---|---|---|---|
| Brand | AMD Xilinx | AMD Xilinx | AMD Xilinx | AMD Xilinx | AMD Xilinx | AMD Xilinx |
| Package | 900-BBGA | 900-BBGA | 900-BBGA | 900-BBGA | 900-BBGA | 900-BBGA |
| Series | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3 |
| System Gates | 2,000,000 gates | 2,000,000 gates | 2,000,000 gates | 2,000,000 gates | 2,000,000 gates | 2,000,000 gates |
| Logic Cells | 46,080 cells | 46,080 cells | 46,080 cells | 46,080 cells | 46,080 cells | 46,080 cells |
| Speed Grade | -4 | -4 | -5 | -5 | -4 | -5 |
| Temperature Grade | Industrial (I) | Industrial (I) | Industrial (I) | Industrial (I) | Commercial (C) | Commercial (C) |
主な差別化要因
- High-density logic and I/O integration （vs XC3S2000-4FGG456I)
- Industrial temperature ordering option （vs XC3S2000-4FGG900C)
- Lower-numbered speed grade for timing-constrained designs （vs XC3S2000-5FG900I)
- Directly identifiable 900-ball package organization （vs XC3S2000-4FGG456I)
設計ノート
Construct the 900-ball BGA footprint from the exact manufacturer package drawing rather than from a generic BGA-900 library. Confirm ball pitch, ball-map orientation, package dimensions, solder-mask and paste-land geometry, and whether exposed thermal features are represented separately. Place the device so every power and ground ball has a short via connection into the relevant plane; otherwise, high-speed return paths and supply integrity can degrade despite a mechanically correct outline.
Use the manufacturer’s recommended power, ground, decoupling, and bank-supply assignments for the XC3S2000-4FG900I. Separate noisy switching supplies and external interface supplies from the 1.2 V core rail as directed by the pinout and power-architecture guidance. Keep high-frequency ceramic decoupling close to its assigned power balls, provide adequate bulk energy near the device, and use separate distribution branches so switching current in one I/O bank does not disturb another bank or the core.
Plan controlled-impedance routes for every high-speed interface and clock signal before placing the BGA. Match trace length where the source interface requires source-synchronous operation, route clocks on suitable layers without splits, and provide return paths beneath high-speed traces. After placement, inspect the complete BGA fanout, escape vias, power via distribution, and external memory or transceiver interfaces for congestion. Run design-rule and post-route timing checks before releasing fabrication data.
Do not infer FPGA interchangeability from family name or package ball count alone. The configuration pins, I/O-bank supplies, initialization behavior, speed grade, temperature grade, and timing constraints must match the PCB and bitstream. When changing between the -4 and -5 speed designations, repeat synthesis and implementation for the replacement device and verify all timing paths. When changing industrial and commercial suffixes, confirm that the complete operating environment remains within the replacement device’s specified limits.
コンプライアンス情報
The product pages identify a lead-free package option but do not state a definitive RoHS, REACH, halogen-free, or conflict-minerals status for the exact ordering code.
