XC5VLX50-1FF324C - Virtex-5 LX FPGA, 46,080 Cells | AMD
部品番号: XC5VLX50-1FF324C ✗ 生産終了XC5VLX50-1FF324C 概要
An FPGA is a semiconductor whose digital functions are defined by loading a configuration bitstream after manufacture. The Virtex-5 LX belongs to the Virtex-5 family of platform FPGAs and uses a column-based architecture for implementing general-purpose logic alongside dedicated resources. Compared with an application-specific integrated circuit, an FPGA allows design changes, parallel processing, and hardware acceleration without requiring a new custom silicon fabrication run.
The XC5VLX50-1FF324C provides 46,080 logic cells and 220 I/O, giving an engineer a substantial fabric for control logic, protocol handling, image processing, data acquisition, and interface consolidation. Its 324-ball FCBGA package supports a high connection count compared with smaller leaded or perimeter-only packages. That density makes the device appropriate for complex system designs that require numerous high-speed signals and board-level integration.
The -1 speed designation places the device in the performance class identified by the manufacturer part numbering system. The C suffix denotes the commercial-grade ordering option. Exact operating-voltage limits, temperature limits, supported I/O standards, block-RAM quantities, DSP resources, and clock-management details must be confirmed in the Virtex-5 device documentation before a production design is released.
Typical uses include telecommunications line-card control, industrial automation, video and image-processing pipelines, test equipment, embedded instrumentation, and high-throughput data-acquisition systems. In these applications, the FPGA can execute multiple parallel processing channels, implement protocol bridges, and combine control functions with dedicated accelerator blocks while preserving software-updatable field behavior.
PCB design requires careful attention to power, ground, configuration, clock, and high-speed signal integrity. Use the manufacturer package pinout files to assign every ball and plane connection, and follow the documented power-supply sequencing and decoupling requirements. A migration from another Virtex-5 device with a different package should not be assumed to be pin-compatible because BGA ball assignments and power distribution can change with package construction.
This page organizes the device identity, verified package data, sourcing routes, comparable ordering variants, and practical design considerations into one engineering reference. It also distinguishes true package-level replacements from speed-, temperature-, and package-family options so engineers can avoid treating an electrically similar FPGA as a drop-in replacement.
ドロップイン代替品: XC5VLX50-1FF324C — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: XC5VLX50-1FF324C （同一形状・フットプリント） — 相違点: Package, Temperature Grade.
XC5VLX50-1FFG324C
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XC5VLX50-1FF324I
✅ ドロップイン価格はお問い合わせください
データシートを見る →XC5VLX50-1FF324C 最大定格＆電気的特性
| Product Type | Virtex-5 LX FPGA |
| Number of Logic Cells | 46,080 cells |
| FPGA-Equivalent Gates | 1,769,472 gates |
| Number of I/O | 220 I/O |
| パッケージ | 324-ball BBGA, FCBGA |
| Number of Package Balls | 324 balls |
| 実装タイプ | Surface Mount |
| Speed Grade | -1 |
| Temperature Grade | Commercial |
| Architecture | Second-generation ASMBL column-based architecture |
| Device Family | Virtex-5 LX |
| RoHS ステータス | RoHS non-compliant |
| Lead-Free Status | Contains lead |
XC5VLX50-1FF324C 324 balls ピン配置ガイド
XC5VLX50-1FF324C (324 balls パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: XC5VLX50-1FF324C.
詳細は データシート をご参照ください。
主な用途
XC5VLX50-1FF324C の用途: 6 件s: Communications Line-Card Control, Industrial Automation and Control, Video and Image Processing, Test and Measurement Instrumentation, High-Throughput Data Acquisition, Aerospace and Defense Control Systems.
Communications Line-Card Control
The XC5VLX50-1FF324C fits communications line-card control because its 46,080 logic cells can implement protocol state machines, framing logic, counters, and supervisory functions, while 220 I/O support external interfaces. The -1 speed grade and 324-ball FCBGA provide a useful combination of programmable throughput and board density. Place programmable logic behind the configuration and startup interface defined by the Virtex-5 device, and validate signal-integrity, power, and timing constraints for the specific line-card standard.
おすすめ
Industrial Automation and Control
The XC5VLX50-1FF324C can consolidate machine-control sequencing, sensor conditioning logic, communications, and safety monitoring in one programmable device. Its 46,080 logic cells permit parallel control paths, and the 220 I/O count reduces the need for external interface logic. Because the C suffix denotes the commercial ordering grade, industrial-temperature systems should verify whether the XC5VLX50-1FF324I ordering option is required. PCB implementation must follow the official 324-ball pinout and power-plane requirements.
おすすめ
Video and Image Processing
The XC5VLX50-1FF324C is suitable for parallel pixel pipelines, color conversion, filtering, thresholding, and interface timing because 46,080 logic cells can execute multiple datapaths concurrently. Its 220 I/O provides substantial connectivity for image sensors, frame buffers, and display interfaces. The implementation should use clocked logic rather than combinational routing for timing-critical stages, synchronize external domains, and validate every high-speed interface against the selected I/O standard and board-level timing budget.
おすすめ
Test and Measurement Instrumentation
The XC5VLX50-1FF324C supports configurable trigger logic, pattern generation, acquisition control, digital calibration, and communication formatting in a laboratory instrument. Its large logic-cell count allows multiple measurement channels to operate in parallel, while 220 I/O connects converters, memory, and host interfaces. Keep acquisition and processing paths partitioned into clock domains, use registered boundaries for wide buses, and review the official package files to route power, ground, configuration, and differential signals correctly.
おすすめ
High-Throughput Data Acquisition
The XC5VLX50-1FF324C can act as the central data-processing element in a parallel acquisition system, combining digital filtering, buffering, packetization, and control across 46,080 logic cells. Its 220 I/O and 324-ball package are useful when several converters, memory devices, and synchronization interfaces must connect to one FPGA. Establish source-synchronous timing, constrain input and output delays, account for converter latency, and verify thermal and power behavior across the intended operating range.
おすすめ
Aerospace and Defense Control Systems
The XC5VLX50-1FF324C can support configurable control, monitoring, communication, and fault-management functions where updateable logic and parallel processing are valuable. The 46,080-cell Virtex-5 LX device provides substantial implementation capacity, but qualification and environmental suitability depend on the exact ordering code and program requirements. The commercial C suffix must not be assumed acceptable for flight hardware. Review the official device documentation, perform reliability analysis, and use the applicable package pinout and power-sequencing requirements.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: XC5VLX50-1FF324C — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | XC5VLX50-1FFG324C | XC5VLX50-1FF324I |
|---|---|---|---|
| Brand | AMD | AMD | AMD |
| Package | 324-ball FCBGA | 324-ball FF package family | 324-ball FCBGA |
| Device Family | Virtex-5 LX | Virtex-5 LX | Virtex-5 LX |
| Logic Cells | 46,080 cells | 46,080 cells | 46,080 cells |
| FPGA-Equivalent Gates | 1,769,472 gates | 1,769,472 gates | 1,769,472 gates |
| Number of I/O | 220 I/O | 220 I/O | 220 I/O |
| Speed Grade | -1 | -1 | -1 |
| Ordering Grade Suffix | C, commercial | G package or temperature option | I, industrial |
| Architecture | Second-generation ASMBL column-based architecture | Second-generation ASMBL column-based architecture | Second-generation ASMBL column-based architecture |
主な差別化要因
- Commercial-grade ordering option within a high-density Virtex-5 LX device （vs XC5VLX50-1FF324I)
- Substantial programmable logic in a 324-ball package （vs XC5VLX50-1FFG324C)
- Established Virtex-5 LX architecture for programmable design reuse （vs XC5VLX50-1FFG324C)
設計ノート
Use the official Virtex-5 package device pinout files as the authority for all 324 balls, power rails, grounds, configuration pins, and user I/O. Create the PCB symbol and footprint directly from those files and mark every pin according to the manufacturer function names. Do not reuse a footprint from a different Virtex-5 package without checking ball-by-ball differences, exposed components, solder-mask geometry, and land patterns.
Implement the documented power architecture with separate core and I/O supply planes, local bulk and high-frequency decoupling, and sequencing that matches the device's configuration requirements. Estimated power depends on the selected I/O standards, utilization, and switching activity and cannot be assigned a single value without the final design. Validate supply droop, startup current, plane coupling, and heat rise using the manufacturer's power-estimation workflow.
Constrain every external interface according to its actual clocking method. Use source-synchronous timing for high-speed parallel interfaces, length-match the relevant differential or clocked pair groups, and isolate unrelated clocks to reduce crosstalk. The 220 available I/O do not imply that all 220 can operate at the same speed or voltage; assign I/O standards through the device constraints and confirm each pin's supported configuration.
Do not treat a similar Virtex-5 suffix as proof of mechanical interchangeability. XC5VLX50-1FF324C and XC5VLX50-1FFG324C differ in the ordering option encoded by G, while the I variant denotes industrial grade. Before releasing a PCB, compare the mechanical drawing, ball map, temperature limits, power rails, and supported I/O standards. Also avoid assuming that a different FPGA manufacturer's device can reuse the same PCB or configuration file.
コンプライアンス情報
The indexed technical listing identifies the device as RoHS non-compliant and containing lead. REACH, halogen-free status, conflict-minerals status, and automotive qualification were not established. AEC-Q100 is not applicable to the commercial-grade FPGA ordering option.
