XC5VLX50-1FF676C - Virtex-5 LX 676-FCBGA FPGA | AMD
部品番号: XC5VLX50-1FF676C ✗ 生産終了XC5VLX50-1FF676C 概要
A field-programmable gate array, or FPGA, is a semiconductor whose digital functionality is configured after manufacture. The FPGA category sits within programmable logic devices and broad semiconductor systems, replacing many fixed-function gate arrays with configurable logic, interconnections, memory resources, and I/O. Virtex-5 LX devices are positioned as general-purpose programmable-logic platforms for embedded control, communications, signal processing, and high-performance embedded systems.
Three headline attributes define the XC5VLX50-1FF676C: 46,080 logic cells provide the programmable fabric, 440 I/O support connections to external circuits, and the 676-FCBGA package provides a dense ball-grid interface. Its -1 ordering suffix identifies the speed grade, while the final C suffix identifies the commercial ordering variant. The listed package uses a square BGA body and ball terminals.
The device belongs to the Virtex-5 LX platform and uses AMD's second-generation ASMBL column-based FPGA architecture. This architecture organizes the programmable device into columns and interconnects configurable logic and dedicated resources. The device is fabricated using 65 nm CMOS technology, with a listed operating voltage of 1 V. Exact clock, resource, memory, differential-I/O, and performance limits should be selected from the manufacturer datasheet for the complete device configuration.
Typical uses include network-interface control, industrial automation, embedded video and communications, test equipment, and custom signal-processing systems. Its 440 I/O are useful for designs that require substantial external connectivity, while 46,080 logic cells allow substantial parallel datapaths and control logic to be consolidated into one programmable device. The 676-FCBGA package is especially relevant to multilayer PCB designs using fine-pitch BGA routing.
PCB design must provide all 676 power, ground, configuration, clock, and signal BGA connections defined by the package pinout. The Virtex-5 package files should be used directly during symbol creation, escape routing, power-plane planning, and footprint verification. Because this is a complex BGA package, via-in-pad or through-via escape strategy, thermal design, and board-level power integrity strongly affect reliable operation.
This page organizes the verified device identity, package characteristics, technical alternatives, comparison criteria, and practical implementation guidance into one engineering-focused resource. Use the manufacturer datasheet and package pinout files as the controlling documents for configuration, pin assignments, power sequencing, and guaranteed operating limits.
ドロップイン代替品: XC5VLX50-1FF676C — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: XC5VLX50-1FF676C （同一形状・フットプリント） — 相違点: Device Type, Logic Cells, Package Type, Speed Grade.
XC5VLX50-1FFG676C
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XC5VLX50-1FFV676C
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XC5VLX50-1FFG676I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XC5VLX50-2FFG676I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XC5VLX50-1FFG676CES
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XC5VLX50-1FF676C 最大定格＆電気的特性
| FPGA Family | Virtex-5 LX |
| Device Type | Field Programmable Gate Array (FPGA) |
| Logic Cells | 46,080 cells |
| User I/O | 440 I/O |
| Package Type | 676-FCBGA |
| Total Terminals | 676 terminals |
| Package Code | BGA |
| Package Shape | Square |
| Terminal Form | Ball |
| Process Technology | 65 nm CMOS |
| Listed Operating Voltage | 1 V |
| Speed Grade | -1 |
| Architecture | Second-generation ASMBL column-based FPGA architecture |
| Lead-Free Status | Contains lead |
| RoHS ステータス | RoHS non-compliant |
| Mounting Technology | Surface-mount ball-grid array |
XC5VLX50-1FF676C square ピン配置ガイド
XC5VLX50-1FF676C (square パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: XC5VLX50-1FF676C.
詳細は データシート をご参照ください。
主な用途
XC5VLX50-1FF676C の用途: 6 件s: Network Interface Control, Industrial Automation, Test and Measurement, Video and Image Processing, Embedded Communications, Aerospace and Defense Control.
Network Interface Control
The XC5VLX50-1FF676C fits network-interface designs that combine protocol handling, packet buffering, and parallel data processing in a single FPGA. Its 46,080 logic cells provide substantial programmable capacity, while 440 I/O allow direct connections to transceivers, memory, status logic, and supervisory components. The 676-FCBGA package requires careful multilayer routing, but it supports the dense pin count associated with high-throughput communications equipment. Designers should use the manufacturer package files to create the footprint and should budget power, ground, decoupling, and thermal paths around the full BGA interface before signal integrity testing.
おすすめ
Industrial Automation
The XC5VLX50-1FF676C can implement industrial controllers that coordinate sensors, actuators, motion sequences, and safety monitoring. The 46,080-cell fabric is useful for parallel control algorithms and deterministic logic, and the 440 I/O provide extensive connectivity to field-bus transceivers and digital I/O modules. Engineers should confirm the exact temperature and qualification suffix for the deployed environment. Because the device uses a 676-ball FCBGA package, the board should employ verified escape routing and adequate power-plane segmentation to maintain signal integrity under electrical noise, temperature changes, and long service intervals.
おすすめ
Test and Measurement
The XC5VLX50-1FF676C is appropriate for FPGA-based instrumentation that coordinates acquisition, timing, pattern generation, and result processing. Its 46,080 logic cells can support parallel datapaths and timing-control logic, while 440 I/O offer connections to converters, memories, trigger interfaces, and communication ports. The -1 speed grade should be checked against the design’s timing closure rather than inferred from the suffix alone. Board implementation must treat the device as a high-pin-count BGA component, with separate attention to clock integrity, simulation loading, thermal performance, and grounded return paths for sensitive measurement circuitry.
おすすめ
Video and Image Processing
The XC5VLX50-1FF676C can support video timing, pixel transport, color processing, and interface control where 46,080 logic cells and 440 I/O are sufficient. Parallel datapaths benefit from the large programmable fabric, while the 676-FCBGA package provides the physical density needed for wide interfaces to external memory and display or capture circuitry. Timing closure, memory bandwidth, and output latency remain design-specific rather than fixed device-level guarantees. A production layout should use AMD’s package data, provision adequate power and ground connectivity for all 676 balls, and verify differential and parallel interfaces through post-layout signal-integrity analysis.
おすすめ
Embedded Communications
The XC5VLX50-1FF676C is suitable for embedded communications equipment requiring concurrent protocol conversion, packet control, and external data movement. The programmable fabric’s 46,080 cells can be partitioned among interface logic, state machines, buffers, and supervisory functions, while 440 I/O support connections to serializers, memories, and management circuits. Design partitioning should avoid relying on generic block counts without checking the relevant device documentation. For a reliable 676-FCBGA implementation, engineers must verify ball assignments, preserve clock and power-return continuity, control switching current in external interfaces, and complete thermal and power-distribution analysis before manufacturing.
おすすめ
Aerospace and Defense Control
The XC5VLX50-1FF676C can serve as a programmable control or signal-processing element in aerospace and defense equipment when its qualification, temperature grade, and reliability documentation satisfy the program requirements. Its 46,080 logic cells support complex sequencing and arithmetic functions, and 440 I/O enable integration with sensors, memory, and communication equipment. Qualification cannot be inferred solely from the family name, so procurement and engineering teams should review the exact suffix and governing aerospace standards. Board-level work should include derating analysis, continuous power verification, controlled impedance routing, and fault-tolerant power and clock architecture appropriate to the mission profile.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: XC5VLX50-1FF676C — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | XC5VLX50-1FFG676C | XC5VLX50-1FFV676C | XC5VLX50-1FFG676I | XC5VLX50-2FFG676I | XC5VLX50-1FFG676CES |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 676-FCBGA | 676-FCBGA | 676-FCBGA | 676-FCBGA | 676-FCBGA | 676-FCBGA |
| FPGA Family | Virtex-5 LX | Virtex-5 LX | Virtex-5 LX | Virtex-5 LX | Virtex-5 LX | Virtex-5 LX |
| Logic Cells | 46,080 cells | 46,080 cells | 46,080 cells | 46,080 cells | 46,080 cells | 46,080 cells |
| User I/O | 440 I/O | 440 I/O | 440 I/O | 440 I/O | 440 I/O | 440 I/O |
| Process Technology | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS |
| Listed Operating Voltage | 1 V | 1 V | 1 V | 1 V | 1 V | 1 V |
| Speed Grade | -1 | -1 | -1 | -1 | -2 | -1 |
| Terminal Count | 676 terminals | 676 terminals | 676 terminals | 676 terminals | 676 terminals | 676 terminals |
主な差別化要因
- Closest ordering-level replacement preserves the complete core resource configuration （vs XC5VLX50-1FFG676C)
- Pin-compatible ordering option retains the same FPGA scale （vs XC5VLX50-1FFV676C)
- Higher speed-grade option supports timing-sensitive design comparisons （vs XC5VLX50-2FFG676I)
- Distinct qualified ordering variant for procurement-specific requirements （vs XC5VLX50-1FFG676I)
設計ノート
Create the 676-FCBGA footprint directly from AMD’s Virtex-5 package device pinout files. Treat every listed ball, including power, ground, configuration, clock, and no-connect positions, according to the package documentation. Use a multilayer PCB with short, symmetric escape routes and verify the stack-up against the device’s differential and single-ended interface requirements. Do not substitute a generic 676-BGA symbol because ball assignments and pad geometry are device-specific.
Estimate the complete board power budget before assigning regulators and power planes. The Virtex-5 device operates from a listed 1 V core supply, while configuration, I/O, auxiliary, and external-interface rails must be planned separately according to the manufacturer’s electrical tables. Check both average and transient demand, including configuration activity and high-speed output switching. Decoupling must be distributed across the package rather than concentrated at a single entry point, and supply sequencing must match the device requirements.
Use the package thermal model and actual board construction to assess junction temperature; the 676-ball package is not a substitute for a thermal solution. Keep uninterrupted ground planes beneath the device where the package rules permit, minimize thermal-via bottlenecks, and provide nearby bulk and local decoupling. Validate the final assembly under worst-case clock activity, ambient temperature, airflow, and board orientation. If the estimate approaches the manufacturer’s limit, increase copper area, improve airflow, or change the device placement before production.
Control impedance and return paths for every high-speed interface rather than treating the BGA as a conventional routed package. Account for package parasitics, loss, crosstalk, and the transition from dense BGA escape routing to board-level transmission lines. Keep configuration and sensitive clock routing away from noisy switching nodes, and follow the manufacturer’s clocking and decoupling guidance. Run post-layout extraction and signal-integrity simulation with the actual stack-up, terminations, and connector models.
Avoid substituting XC5VLX50-1FF676C with another Virtex-5 LX ordering code solely because the family and 676-ball package match. Confirm the speed grade, qualification suffix, temperature range, lead or terminal-finish requirements, lifecycle status, and exact package-ball map. The -2 option in this comparison has a different speed grade, while I and CES variants carry different qualification implications. Record the approved substitution in the BOM only after compatibility and lifecycle review.
コンプライアンス情報
The device listing identifies the XC5VLX50-1FF676C as containing lead and RoHS non-compliant. Other compliance attributes are not stated.
