XC6SLX150-2FG484I - 147443-Cell Spartan-6 FPGA | AMD
部品番号: XC6SLX150-2FG484I ✗ 生産終了XC6SLX150-2FG484I 概要
A field-programmable gate array is a reconfigurable digital semiconductor containing programmable lookup logic, programmable interconnect, block RAM, and dedicated I/O resources. Within the broader hierarchy, an FPGA is a programmable logic device that sits above simple fixed-function logic ICs and below application-specific programmable devices. Spartan-6 LX devices combine programmable logic, embedded memory, digital signal processing resources, and high-speed I/O in one integrated silicon package.
The XC6SLX150-2FG484I provides 11,519 logic cells as identified in the package description, 147,443 total logic elements, and 4,939,776 bits of RAM. Its 338 I/O allow external interfaces to connect processors, memories, communications transceivers, sensors, displays, and industrial equipment. The device uses a nominal core supply range of 1.14 V to 1.26 V, while supporting circuitry determines the appropriate I/O voltage for the selected bank configuration.
The -2 suffix identifies the device speed grade, which must be considered during timing closure rather than treated as a software feature. Spartan-6 designs rely on AMD development tools for synthesis, implementation, timing analysis, programming, and debug. Engineers should preserve the electrical, mechanical, and pinout characteristics of the FG484 package when upgrading an existing board or adapting a proven design.
Typical applications include industrial control, test and measurement, networking equipment, embedded vision, communications infrastructure, and high-density embedded systems. The combination of 147,443 logic cells and 4,939,776 RAM bits supports parallel data processing, protocol handling, control logic, buffering, and interface bridging without requiring multiple programmable devices.
Design attention should focus on bank voltage compatibility, clock requirements, decoupling, thermal performance, and differential-pair routing. Confirm the pinout against the official Spartan-6 package files and complete static timing analysis for the -2 speed grade before releasing a PCB or production bitstream.
This product page consolidates package-specific logic, memory, I/O, and device-selection details with practical application guidance. It also distinguishes package-compatible Spartan-6 ordering variants by speed grade, temperature grade, and device type so engineers can identify a replacement without overlooking timing or I/O differences.
ドロップイン代替品: XC6SLX150-2FG484I — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: XC6SLX150-2FG484I （同一形状・フットプリント） — 相違点: Device Type, Logic Cells, Core Supply Voltage, Lead-Free Status, Operating Temperature.
XC6SLX150-2FG484C
✅ ドロップイン価格はお問い合わせください
データシートを見る →XC6SLX150-2CSG484I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XC6SLX150-2FGG484I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XC6SLX150-3FG484C
✅ ドロップイン価格はお問い合わせください
データシートを見る →XC6SLX150-3FG484I
✅ ドロップイン価格はお問い合わせください
データシートを見る →XC6SLX150-2FG484I 最大定格＆電気的特性
| Device Type | Spartan-6 LX Field Programmable Gate Array |
| Logic Elements | 147,443 cells |
| Logic Cells | 11,519 cells |
| RAM | 4,939,776 bits |
| Number of I/O | 338 I/O |
| パッケージ | 484-ball BGA, 19 mm x 19 mm |
| Package Ball Pitch | 0.80 mm |
| 実装タイプ | Surface Mount |
| Internal Frequency | 667 MHz |
| Speed Grade | -2 |
| Core Supply Voltage | 1.14 V to 1.26 V |
| Device Family | Spartan-6 LX |
| Programmability | User-programmable FPGA |
| Embedded Memory | 4,939,776 RAM bits |
| Manufacturer | AMD / Xilinx |
| Lead-Free Package | Yes |
| Package Length | 19 mm |
| Package Width | 19 mm |
XC6SLX150-2FG484I 19 mm ピン配置ガイド
XC6SLX150-2FG484I (19 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: XC6SLX150-2FG484I.
詳細は データシート をご参照ください。
主な用途
XC6SLX150-2FG484I の用途: 6 件s: Industrial Control Systems, Test and Measurement Equipment, Networking and Communications Infrastructure, Embedded Vision and Image Processing, Programmable Logic Controllers, Communications Adapters and Protocol Bridges.
Industrial Control Systems
The XC6SLX150-2FG484I fits industrial controllers that combine sequencing, motion control, safety interlocks, and communications in one FPGA. Its 147,443 logic cells and 4,939,776 RAM bits can host parallel control pipelines, diagnostic state machines, and local data buffers, while 338 I/O provide substantial connectivity to sensors, actuators, encoders, and field buses. The -2 speed grade provides a defined timing class for closing control loops, but the implementation should be checked for timing margin and power at the system's operating temperature. Use the official FG484 pinout to assign voltage-compatible banks.
おすすめ
Test and Measurement Equipment
The XC6SLX150-2FG484I is suitable for parallel acquisition, pattern generation, timing instrumentation, and data processing because it combines 147,443 logic cells with 4,939,776 RAM bits. The RAM can implement circular buffers and sample storage, while the 338 I/O can connect converters, trigger logic, counters, and communication controllers. Its -2 speed grade should be selected against the required clock rate and pipeline depth, and static timing analysis should be performed for every implemented clock domain. Separate I/O banks must remain within their permitted voltage ranges.
おすすめ
Networking and Communications Infrastructure
The XC6SLX150-2FG484I can support protocol termination, packet processing, data steering, and interface bridging in network equipment. Its 147,443 programmable logic cells provide parallelism for framing, header parsing, filtering, and traffic classification, while 4,939,776 RAM bits support queues and packet buffering. The 338 I/O allow connection to transceivers and parallel network interfaces, subject to bank-voltage rules. For timing-critical traffic paths, verify the -2 grade against the required clock frequency and review power consumption after implementation.
おすすめ
Embedded Vision and Image Processing
The XC6SLX150-2FG484I is appropriate for image pipelines requiring parallel pixel processing, thresholding, color conversion, feature extraction, or frame buffering. Its 147,443 logic cells can support wide datapaths, and 4,939,776 RAM bits can hold line buffers and working frames, depending on pixel width and architecture. The 338 I/O provide camera interface, memory, and control connectivity, although high-speed interfaces must comply with voltage and timing constraints. Prototype the design with the -2 timing model and evaluate whether the XC6SLX150T LXT variant offers a better resource balance.
おすすめ
Programmable Logic Controllers
The XC6SLX150-2FG484I supports highly parallel PLC and real-time control designs where deterministic logic, multiple I/O, and local data storage are required. The 147,443 logic cells can accommodate multiple control domains, while 4,939,776 RAM bits can support buffers, event histories, and communication data structures. Its 338 I/O are useful for discrete sensing, relay or valve control, counters, and operator interfaces. Designers should use hardware constraints to define clock groups, assign I/O standards, and confirm timing closure for the -2 speed grade before production programming.
おすすめ
Communications Adapters and Protocol Bridges
The XC6SLX150-2FG484I can implement protocol converters, serial links, bus arbitration, and data-routing adapters where several interfaces must operate concurrently. Its 147,443 logic cells enable parallel handling of framing and flow control, and its 4,939,776 RAM bits can support FIFOs and packet staging. The 338 I/O provide broad connectivity to transceivers and parallel buses, but each bank must be assigned a supported voltage. Compare the full LX resource set with the XC6SLX150T-2FG484I LXT device, which offers 296 I/O, before standardizing a communications adapter.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: XC6SLX150-2FG484I — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | XC6SLX150-2FG484C | XC6SLX150-2CSG484I | XC6SLX150-2FGG484I | XC6SLX150-3FG484C | XC6SLX150-3FG484I |
|---|---|---|---|---|---|---|
| Brand | AMD / Xilinx | AMD / Xilinx | AMD / Xilinx | AMD / Xilinx | AMD / Xilinx | AMD / Xilinx |
| Package | 484-ball BGA | 484-ball BGA - same | 484-ball CSBGA - same | 484-ball BGA - same | 484-ball BGA - same | 484-ball BGA - same |
| Logic Elements | 147,443 cells | 147,443 cells | 147,443 cells | 147,443 cells | 147,443 cells | 147,443 cells |
| RAM Bits | 4,939,776 bits | 4,939,776 bits | 4,939,776 bits | 4,939,776 bits | 4,939,776 bits | 4,939,776 bits |
| Number of I/O | 338 I/O | 338 I/O | 338 I/O | 338 I/O | 338 I/O | 338 I/O |
| Speed Grade | -2 | -2 | -2 | -2 | -3 | -3 |
主な差別化要因
- Full LX resource complement with extensive I/O （vs XC6SLX150T-2FG484I)
- Industrial ordering suffix for the selected configuration （vs XC6SLX150-2FG484C)
- Higher timing class available without changing the package （vs XC6SLX150-3FG484I)
設計ノート
Decouple each required supply rail at its ball with the capacitance values specified in the Spartan-6 power-guidance document, placing the smallest capacitors closest to the device. Keep the 1.14 V to 1.26 V core supply within its permitted operating range and use separate filtering paths for noisy I/O banks. Estimated: core dissipation equals core voltage multiplied by core current; compare that value with the package power limit and the board's thermal resistance before production release.
Use the official Spartan-6 FG484 package file as the authority for all 484 ball assignments. Preserve the 19 mm by 19 mm land pattern, 0.80 mm pitch, and via requirements shown for the selected PCB stack-up. Because the package has 338 I/O plus power, ground, configuration, and reserved balls, do not infer individual signal names from I/O count. Run manufacturing rule checks for ball-to-ball shorts, solder-mask clearance, and solderability before fabrication.
Constrain clocks, high-speed serial links, and source-synchronous interfaces using the device and board constraints in the implementation project. Match external memory and transceiver timing to the selected -2 speed grade, and inspect post-route timing at the actual operating conditions. For differential signals, maintain symmetry and follow the transceiver vendor's reference layout. Treat the 667 MHz internal figure as a device capability rather than permission to use that frequency on every I/O path.
Account for temperature rise, power consumption, and airflow before defining the operating-temperature envelope. A 484-ball BGA can conduct heat through its solder balls and PCB copper, but board construction and enclosure conditions can dominate junction temperature. Use the post-implementation power report and package thermal model, then verify the worst operating case. Estimated: junction temperature equals ambient temperature plus power dissipation multiplied by the effective thermal resistance.
コンプライアンス情報
The listed package is described as lead-free. RoHS, REACH, halogen-free, conflict-minerals, and AEC-Q100 status were not stated for this ordering code.
