AMD

XC6SLX16-L1FT256I - 14579-Cell Spartan-6 FPGA | AMD

部品番号: XC6SLX16-L1FT256I ✓ 生産中
1 V Vdss 256-pin FTBGA Package L1 Speed
MOQ: 1 |

XC6SLX16-L1FT256I 概要

The AMD XC6SLX16-L1FT256I is a Spartan-6 LX field-programmable gate array with 14,579 logic cells, 1,139 configurable logic blocks, a 45 nm CMOS process, and a 256-pin FTBGA package. Designed for system integration and high-volume programmable logic applications, this device combines programmable logic, block RAM, digital signal processing resources, and dedicated I/O in a single package.

A field-programmable gate array is a semiconductor device whose digital logic, memory blocks, and I/O assignments are configured after manufacture. The Spartan-6 LX FPGA family sits within the broader hierarchy of programmable logic devices, FPGAs, and semiconductors. This architecture makes the XC6SLX16 suitable when fixed-function logic would be inflexible or when product configurations, interface assignments, and firmware updates must evolve after board fabrication.

The Spartan-6 LX configuration provides 14,579 cells and 1,139 CLBs. The listed 1 V supply value identifies the device's low-voltage CMOS operating class, while the 45 nm CMOS process provides the physical technology basis for the logic and embedded resources. The -L1 portion identifies the device speed grade, -I identifies the industrial temperature grade, and FT256 identifies the 256-ball package configuration.

The XC6SLX16 family is intended for moderate-complexity embedded systems requiring a higher level of integration than basic programmable logic. Its resources can support parallel data processing, control logic, protocol bridging, memory-intensive control functions, and mixed peripheral interfaces. Because an FPGA configuration determines which circuit is implemented, engineers must account for routing, timing closure, resource utilization, configuration memory, and startup behavior during system design.

Typical applications include industrial control equipment, communications infrastructure, embedded data-acquisition systems, test and measurement platforms, video or image-processing modules, and compact embedded systems that require programmable hardware. The 256-ball package also supports dense I/O arrangements, although board construction and signal-integrity performance depend on the selected package, PCB stack-up, and interface rates.

Before schematic capture, use the AMD Spartan-6 package pinout files to confirm ball assignments, power rails, configuration pins, and user I/O. Validate every proposed alternative against those package files and the timing constraints of the design; sharing the XC6SLX16 family name alone does not establish interchangeability.

This product record combines the verified device identity, package, process, cell count, CLB count, and temperature grade with engineering guidance, comparison data, and design considerations. It helps distinguish the exact ordered part number from related Spartan-6 devices that differ in speed grade, temperature grade, package suffix, or board footprint.

ドロップイン代替品: XC6SLX16-L1FT256I — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。

このシリーズのバリエーション

同一シリーズでドロップイン互換のモデル: XC6SLX16-L1FT256I (同一形状・フットプリント) — 相違点: Package, Speed Grade, Process Technology, Device Type, Logic Cells.

AMD
Package: FTGBGA-256
Speed Grade: -2
Process Technology: CMOS
比較対象 XC6SLX16-L1FT256I →
AMD
Package: 256-ball FTBGA, 17 x 17 mm, 1.0 mm pitch
Speed Grade: -3 (highest performance in Spartan-6 LX)
Logic Cells: 14,579
比較対象 XC6SLX16-L1FT256I →
AMD
Package: 256-LBGA
Speed Grade: -3
Process Technology: 45 nm
比較対象 XC6SLX16-L1FT256I →

XC6SLX16-L1FTG256I

✅ ドロップイン
📦 256-pin FTBGA
The listed 14,579-cell and 1,139-CLB resources are unchanged, while the package code adds the G character; verify the FT256 versus FTG256 ball map before substitution.

📋 参考代替品(カタログ未掲載)

XC6SLX16-L1FT256C

✅ ドロップイン
📦 256-pin FTBGA
The logic resources and 256-ball package class are unchanged, but the temperature suffix changes from industrial I to commercial C, reducing the temperature-grade scope.

📋 参考代替品(カタログ未掲載)

XC6SLX16-2FTG256I

✅ ドロップイン
AMD
📦 256-pin FTBGA
Field Programmable Gate Array (FPGA) · Spartan-6 LX · 14,579 cells · 1,139 CLBs · 2,278 ALMs · 186 I/Os · 667 MHz · 375 MHz

価格はお問い合わせください

データシートを見る →

XC6SLX16-3FTG256I

✅ ドロップイン ⚠️ 仕様未検証
AMD
📦 256-pin FTBGA
Spartan-6 LX · 14,579 · 1,139 · 589,824 bits · 186 · 256-ball FTBGA, 17 x 17 mm, 1.0 mm pitch · 45 nm CMOS · 1.2 V

価格はお問い合わせください

データシートを見る →

XC6SLX16-N3FT256I

✅ ドロップイン
AMD
📦 256-pin FTBGA
Spartan-6 LX field-programmable gate array (FPGA) · 14,579 cells · 186 I/O · 45 nm · 1.2 V · 256-LBGA · 256 balls · Spartan-6 LX

価格はお問い合わせください

データシートを見る →

XC6SLX16-L1FT256I 最大定格&電気的特性

Device Type Spartan-6 LX Field Programmable Gate Array (FPGA)
Logic Cell Count 14,579 cells
Configurable Logic Block Count 1,139 CLBs
Process Technology 45 nm CMOS
電源電圧 1 V
パッケージ 256-pin FTBGA
Package Dimensions 17 mm x 17 mm
Ball Pitch 1 mm
Terminal Type Ball
Number of Terminals 256 terminals
Temperature Grade Industrial
Speed Grade L1
Programmable Logic Type FPGA
Device Family Spartan-6 LX
Lead-Free Status Lead free
Package Mounting Style Surface mount

XC6SLX16-L1FT256I surface mount ピン配置ガイド

XC6SLX16-L1FT256I (surface mount パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。

XC6SLX16-L1FT256I の surface mount パッケージピン配置図

詳細なピン配置データはありません: XC6SLX16-L1FT256I.

詳細は データシート をご参照ください。

主な用途

XC6SLX16-L1FT256I の用途: 6 件s: Industrial Control Systems, Communications Interface Modules, Embedded Data Acquisition, Test and Measurement Equipment, Video and Image Processing, Programmable Embedded Control.

🏭

Industrial Control Systems

The XC6SLX16-L1FT256I suits compact industrial controllers that combine deterministic logic, communications, and peripheral coordination. Its 14,579 logic cells and 1,139 CLBs provide capacity for sequencing, interlocks, data acquisition control, and communication-interface logic, while the industrial I temperature designation aligns with the target device class. In an industrial controller, the FPGA can collect sensor signals, validate incoming commands, and coordinate outputs without relying on several small support devices. The 256-pin FTBGA also offers a dense ball arrangement for multilayer boards, although power integrity and thermal performance depend on the final layer stack and operating environment.

🌐

Communications Interface Modules

The XC6SLX16-L1FT256I can implement programmable communication bridges, protocol converters, and test-interface logic when a fixed ASIC would be too inflexible. The 14,579-cell Spartan-6 LX resource count is suitable for parallel datapaths, framing logic, status registers, and clock-domain coordination, while the 45 nm CMOS implementation belongs to the Spartan-6 low-voltage programmable-logic family. Designers can use the FPGA to adapt protocols during product revisions or support multiple interfaces on one board. Timing closure, however, depends on the selected -L1 speed grade and external I/O standards, so interface timing and signal integrity must be verified before configuration is released.

📟

Embedded Data Acquisition

The XC6SLX16-L1FT256I is appropriate for embedded data-acquisition modules that must combine sampling control, digital filtering, buffering, and host communication. Its 1,139 CLBs and 14,579 logic cells can support parallel pipelines, control state machines, and data-format conversion, while its 1 V supply class supports integration with modern low-voltage digital systems. In a compact instrument, the FPGA can act as a real-time processing engine between sensors and a processor or communications link. The exact number and type of usable I/O must be established from the package file, and the analog front end remains independent of the FPGA's digital performance.

🖥️

Test and Measurement Equipment

The XC6SLX16-L1FT256I fits programmable test equipment where multiple timing patterns, acquisition channels, and protocol formats must be changed without redesigning fixed hardware. The Spartan-6 LX architecture provides 14,579 logic cells and 1,139 CLBs for control sequencing, pattern generation, and result processing, and the 256-pin FTBGA supports dense board-level interconnect. A laboratory instrument can use this device for automated stimulus generation or protocol-aware measurement logic. For high-speed analog and mixed-signal tests, engineers still need separate converters, clock sources, and carefully controlled analog layouts; FPGA timing qualification alone does not establish end-to-end measurement accuracy.

📺

Video and Image Processing

The XC6SLX16-L1FT256I can serve as a programmable image- or video-processing element in compact embedded systems that need adaptable pixel pipelines and interface timing. Its 14,579-cell Spartan-6 LX configuration provides enough parallel logic for pipeline control, format conversion, thresholding, and auxiliary data paths, subject to the device's exact RAM and DSP resource limits. The device is most useful when product variants require different pixel formats or when firmware-level reconfiguration can replace multiple fixed implementations. Video interface rates, color depth, frame-buffer capacity, and clocking must be evaluated independently because those parameters determine whether the available logic and memory resources support the target resolution.

🧩

Programmable Embedded Control

The XC6SLX16-L1FT256I works well as a companion logic device in embedded products that need fast peripheral control, deterministic sequencing, or hardware-assisted data handling. The 45 nm CMOS Spartan-6 LX device combines 14,579 logic cells with the flexibility to implement custom interfaces and control functions, allowing a system designer to avoid several dedicated controllers. In an embedded system, the FPGA can manage sensor timing, actuator sequencing, or data-stream formatting while the main processor handles higher-level software. Production designs should reserve configuration and debug resources, verify startup behavior, and test every programmed image under the expected voltage, temperature, and clock conditions.

おすすめ製品の概要

XC6SLX16-L1FTG256I Related Spartan-6 LX package option 使用用途: Industrial Control Systems, Communications Interface Modules, Test and Measurement Equipment, Video and Image Processing XC6SLX16-2FTG256I AMD 使用用途: Industrial Control Systems, Test and Measurement Equipment, Programmable Embedded Control XC6SLX16-3FTG256I AMD 使用用途: Communications Interface Modules, Video and Image Processing XC6SLX16-L1FT256C Commercial-temperature package-family candidate 使用用途: Embedded Data Acquisition, Programmable Embedded Control XC6SLX16-N3FT256I AMD 使用用途: Embedded Data Acquisition
What is the XC6SLX16-L1FT256I?
The XC6SLX16-L1FT256I is an AMD Spartan-6 LX FPGA containing 14,579 logic cells and 1,139 configurable logic blocks in a 256-pin FTBGA package. According to the AMD Spartan-6 LX datasheet, the device uses 45 nm CMOS technology and is associated with a 1 V supply class. The L1 code denotes the speed grade, while the final I code identifies the industrial temperature grade. It is intended for programmable control, communications, embedded processing, and other medium-complexity digital systems.
What are the key specifications of XC6SLX16-L1FT256I that engineers should know?
The key engineering specifications are 14,579 logic cells, 1,139 CLBs, a 45 nm CMOS process, a 1 V supply class, and a 256-pin FTBGA package measuring 17 mm by 17 mm with 1 mm ball pitch. According to the AMD Spartan-6 LX datasheet and product listings, the ordered part combines the L1 speed grade with the industrial-temperature designation. Designers should additionally verify memory, DSP, I/O, configuration, and timing requirements against the device documentation for the exact package.
Where can I download the XC6SLX16-L1FT256I datasheet PDF?
The XC6SLX16-L1FT256I datasheet PDF is available from the LCSC product-datasheet link listed on this page, while the AMD Spartan-6 package pinout files provide the authoritative package-ball information. According to AMD's package-device resources, the package files are distributed in ASCII TXT format. Use the datasheet for electrical limits and device resources, and use the package files when assigning power, configuration, clock, and user I/O connections.
Where can I find the XC6SLX16-L1FT256I pinout and package ball assignments?
The XC6SLX16-L1FT256I pinout is identified through AMD's Spartan-6 Package Device Pinout Files resource, which publishes package assignments in ASCII TXT format. According to AMD's package documentation, the target is a 256-pin FTBGA measuring 17 mm by 17 mm with a 1 mm ball pitch. Confirm power and ground balls, configuration pins, clock-capable pins, and user I/O directly against the package file before finalizing the PCB design.
What is the difference between XC6SLX16-L1FT256I and XC6SLX16-L1FTG256I?
The XC6SLX16-L1FT256I and XC6SLX16-L1FTG256I both identify Spartan-6 LX devices with 14,579 cells, 186 internal product identifiers, a 45 nm process, and a 256-ball package listing. The visible part-number difference is the presence of G in FTG256I. According to the AMD and distributor product records, the listed core resources are identical, but engineers must confirm the package drawing, ball map, and ordering code before treating one as a drop-in replacement.
Can XC6SLX16-L1FTG256I replace XC6SLX16-L1FT256I?
The XC6SLX16-L1FTG256I is a closely related Spartan-6 LX device with the same listed 14,579-cell count and 256-ball package class. According to AMD's product listings and the available comparison records, its core resource figures match the XC6SLX16-L1FT256I. A PCB-level substitution still requires checking the FT256 and FTG256 package drawings, speed and temperature identifiers, configuration behavior, and the exact I/O map using AMD's package files.
When should I choose XC6SLX16-L1FT256I over a faster XC6SLX16 variant?
Choose the XC6SLX16-L1FT256I when its L1 timing grade satisfies the design while industrial-temperature operation is required. According to AMD's Spartan-6 ordering information, the -L1 suffix is distinct from the -2 and -3 speed grades and the -N3 performance designation. A faster grade may reduce timing slack, but it does not remove the need to verify operating temperature, configuration compatibility, and the exact 256-ball package assignment.
Is XC6SLX16-L1FT256I suitable for industrial control equipment?
The XC6SLX16-L1FT256I is suitable for industrial control equipment when the required operating temperature is covered by its industrial-temperature grade. According to AMD's Spartan-6 product documentation, the device provides 14,579 logic cells, 1,139 CLBs, and 45 nm CMOS implementation in a 256-pin FTBGA. Industrial suitability still depends on the board power design, environmental requirements, timing closure, and the availability of all required peripherals and interfaces.
What is the best drop-in replacement for XC6SLX16-L1FT256I?
The XC6SLX16-L1FTG256I is the closest same-family replacement candidate because it retains the listed 14,579-cell Spartan-6 LX configuration and 256-ball package class. According to AMD and distributor records, its visible difference is the G character in the package code. Before treating it as a true drop-in replacement, verify the package drawings, pin maps, configuration pins, electrical limits, and ordering information because a shared family or ball count alone does not prove interchangeability.
Is there an AMD competitor equivalent for XC6SLX16-L1FT256I?
No verified cross-brand, pin-compatible equivalent was identified for the XC6SLX16-L1FT256I. According to AMD's device documentation, the Spartan-6 LX architecture, package assignment, configuration method, and IP ecosystem are device-specific, so another manufacturer's FPGA cannot be assumed to be interchangeable. The most defensible replacement path is an orderable XC6SLX16 variant with the required speed, temperature, package, and pin compatibility, followed by timing and configuration validation.
What can replace the XC6SLX16-L1FT256I?
The XC6SLX16-L1FTG256I, XC6SLX16-L1FT256C, XC6SLX16-2FTG256I, XC6SLX16-3FTG256I, and XC6SLX16-N3FT256I are related same-family candidates for engineering review. According to AMD's Spartan-6 ordering information, these codes differ in package designation, speed grade, temperature grade, or performance option. Select one only after comparing the exact package files, temperature requirements, timing targets, configuration compatibility, and lifecycle objectives.
Is XC6SLX16-L1FT256I the same as XC6SLX16-2FTG256I?
No, the XC6SLX16-L1FT256I and XC6SLX16-2FTG256I are not identical orderable devices. Both belong to the Spartan-6 LX family and are associated with the 256-ball package class, but their suffix codes identify different speed grades and package designations. According to AMD's Spartan-6 documentation, L1 and -2 are distinct timing grades, so a replacement can change achievable clock performance even when the PCB land pattern appears similar.
What design checks are required for XC6SLX16-L1FT256I power and decoupling?
The XC6SLX16-L1FT256I power design must follow the pin-specific requirements in the AMD Spartan-6 LX datasheet and package files. According to AMD's device documentation, the target operates in the 1 V supply class. Separate clean supplies may be required for core and I/O domains, and every specified decoupling and bulk capacitor should be placed close to its associated power and ground balls. Confirm capacitor voltage ratings, DC bias behavior, and return-current paths in the final board design.
How should XC6SLX16-L1FT256I configuration storage be designed?
The XC6SLX16-L1FT256I configuration design must support the startup method, configuration pins, and clocking scheme selected in the AMD Spartan-6 LX documentation. According to AMD's configuration guidance, the package pinout identifies the pins that determine configuration behavior. Engineers should review the exact FT256 ball map, include the required pull components, account for configuration duration, and implement a safe boot path that remains predictable if the external configuration source is absent or invalid.
Where to buy XC6SLX16-L1FT256I online and what is its lead time?
Use the Request a Quote form on this page to ask for XC6SLX16-L1FT256I availability, lead time, and an order quotation. The part is an AMD Spartan-6 LX FPGA in a 256-pin FTBGA package, and the exact order code includes L1 speed and industrial-temperature identifiers. Because availability and delivery schedules can change, request current lot, date-code, and sourcing details directly through the quote form before committing a production build.

エンジニアリング参考データ: XC6SLX16-L1FT256I — 比較、設計ガイダンス、コンプライアンス情報。

選定ガイド

Choose the XC6SLX16-L1FT256I when a design specifically calls for the L1 speed grade, industrial-temperature designation, and 256-pin FTBGA configuration. Review XC6SLX16-L1FTG256I first when procurement needs a closely related package-family option, but verify its package drawing and ball map because the suffix differs. XC6SLX16-L1FT256C is appropriate only when commercial-temperature operation is acceptable. Use XC6SLX16-2FTG256I when its different timing grade provides a justified timing benefit, and review XC6SLX16-3FTG256I or XC6SLX16-N3FT256I when speed, power, or sourcing requirements differ. No verified cross-brand drop-in equivalent was identified. In every case, confirm the AMD package files, timing closure, configuration startup, electrical limits, and environmental requirements before releasing a substitution.

代替品との比較

パラメータ この製品 XC6SLX16-L1FTG256I XC6SLX16-L1FT256C XC6SLX16-2FTG256I XC6SLX16-3FTG256I XC6SLX16-N3FT256I
Brand AMD AMD AMD AMD AMD AMD
Process Technology 45 nm CMOS 45 nm CMOS 45 nm CMOS 45 nm CMOS 45 nm CMOS 45 nm CMOS
Supply Voltage Class 1 V 1 V 1 V 1 V 1 V 1 V
Temperature Grade Industrial Industrial Commercial Industrial Industrial Industrial
Speed or Performance Code L1 L1 L1 -2 -3 N3
Special Ordering Feature L1 speed grade and industrial-temperature grade L1 speed grade and industrial-temperature grade L1 speed grade and commercial-temperature grade -2 speed grade and industrial-temperature grade -3 speed grade and industrial-temperature grade N3 performance option and industrial-temperature grade

主な差別化要因

  • Industrial-temperature ordering option (vs XC6SLX16-L1FT256C)
  • Closest package-suffix comparison (vs XC6SLX16-L1FTG256I)
  • Timing-grade choice remains explicit (vs XC6SLX16-2FTG256I)

設計ノート

Use the AMD Spartan-6 package pinout files as the controlling source for every FT256 ball assignment. A 256-ball package does not by itself establish compatibility with another suffix. Confirm power, ground, configuration, clock-capable, and user I/O balls against the exact order code before routing. Place decoupling capacitors close to their designated supply and ground balls, provide low-impedance return paths, and review the escape routing for the 1 mm pitch before releasing the PCB layout.

Follow the AMD datasheet power tree rather than treating all supply connections as a single rail. The listed 1 V supply class may encompass separate core and I/O requirements, and their permitted operating ranges must be respected. Use the manufacturer-prescribed bypass and bulk-capacitor values, maintain placement close to the relevant balls, and verify DC bias, ripple, startup, and power sequencing in simulation. Changes to capacitors or regulator stability components should be checked against the latest recommended design checklist.

Keep configuration and clock inputs away from high-slew-rate switching nodes, and preserve clean return paths beneath clocks and sensitive interfaces. The 17 mm by 17 mm, 1 mm-pitch FTBGA demands multilayer escape routing with well-controlled impedance and via symmetry. Review differential-pair geometry against the selected board stack-up and endpoint requirements. After layout, run signal-integrity and timing sign-off using the actual tool settings and complete pin assignments rather than relying on device-level performance alone.

Do not substitute an XC6SLX16 variant solely because it has the same cell count and 256-ball package class. The L1, -2, -3, and N3 codes identify different timing or power-performance choices, while C and I identify different temperature grades. A valid replacement also requires compatible configuration startup, pin behavior, electrical limits, and timing. Record the original device, proposed alternative, package-file comparison, timing result, and configuration review before authorizing a drop-in change.

コンプライアンス情報

RoHS
Unknown
REACH
Unknown
AEC-Q100
Unknown
鉛フリー
Yes
ハロゲンフリー
Unknown
紛争鉱物
Unknown

The device listing identifies the XC6SLX16-L1FT256I as lead free. RoHS, REACH, AEC-Q100, halogen-free, and conflict-minerals status require confirmation from the applicable AMD environmental or product-compliance documentation.

関連検索

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関連部品&用語

AMD Xilinx XC6SLX16-L1FT256I XC6SLX16-L1FTG256I XC6SLX16-L1FT256C XC6SLX16-2FTG256I XC6SLX16-3FTG256I XC6SLX16-N3FT256I Spartan-6 LX FPGA field-programmable gate array programmable logic device logic cell configurable logic block CLB 45 nm CMOS 1 V supply class FTBGA-256 BGA package surface-mount package industrial temperature grade L1 speed grade AMD Spartan-6 package pinout files industrial control communications interface embedded data acquisition
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