XC6SLX75-3FG676I - 74,637-Cell Spartan-6 FPGA | AMD
部品番号: XC6SLX75-3FG676I ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $67.1347 | $67.13 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
XC6SLX75-3FG676I 概要
An FPGA is a programmable semiconductor in the broader logic and semiconductor hierarchy. Instead of fixing Boolean logic at fabrication, its configurable lookup tables, routing networks, block RAM, DSP resources, and I/O blocks can be programmed after manufacture. The Spartan-6 LX family is designed for high-volume systems requiring broad programmable logic integration at relatively low cost.
The XC6SLX75-3FG676I provides 74,637 logic cells organized as 5,831 CLBs and exposes 408 I/O. Its verified maximum frequency is 862 MHz, although achievable user logic frequency depends on the selected clocking, routing, device resources, and timing constraints. The industrial suffix denotes industrial temperature grading, while the -3 code identifies the high-performance speed grade. The 676-ball, 1 mm-pitch package supports dense board integration but requires advanced PCB layout and assembly capability.
Its architecture fits parallel data acquisition, control, signal generation, protocol bridging, image processing, and embedded system integration. The available logic, memory, and I/O resources can consolidate functions that otherwise require multiple programmable or fixed-function devices. Engineers must still verify the exact RAM, DSP, transceiver, clock, and I/O capability required by each design against the AMD family documentation.
The target is supplied in a 676-ball FCBGA package reported as 27 mm by 27 mm with a 1 mm pitch. BGA assembly requires board escape routing, via-in-pad or fanout strategy, appropriate solder-mask and paste design, X-ray inspection capability, and controlled reflow. Although the package supports high I/O density, routing to its 676 balls is materially more demanding than leaded-package assembly.
Design planning should begin with the AMD Spartan-6 package pinout files and the device-specific timing, power, and configuration guidance. Confirm the exact bill of materials, pin mapping, supported I/O standards, clocking resources, configuration interface, decoupling requirements, and thermal assumptions before release. Vendor snippets conflict on frequency and package details, so this page treats the direct DigiKey, Mouser, LCSC, and FindIC records as separate evidence sources rather than merging contradictory fields.
This page consolidates verified distributor availability, package and resource comparisons, procurement context, and practical BGA implementation guidance. It also distinguishes device-grade variants from unqualified replacements so engineers can evaluate alternatives without assuming that a similar FPGA name guarantees timing, temperature, or pin compatibility.
ドロップイン代替品: XC6SLX75-3FG676I — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: XC6SLX75-3FG676I （同一形状・フットプリント） — 相違点: Device Type, Ball Pitch, Operating Temperature, Package.
クイック比較ツール — 並列比較する代替部品を選択:
この製品に利用可能なドロップイン代替品はありません。
代替品をリクエストXC6SLX75-3FG676I 最大定格＆電気的特性
| Device Type | Field Programmable Gate Array (FPGA) |
| FPGA Family | Spartan-6 LX |
| Logic Cells | 74,637 cells |
| Configurable Logic Blocks | 5,831 CLBs |
| Maximum Frequency | 862 MHz |
| I/O Count | 408 I/O |
| Process Technology | 45 nm CMOS |
| パッケージ | 676-ball FCBGA |
| Package Body Size | 27 mm x 27 mm |
| Ball Pitch | 1 mm |
| Terminal Count | 676 terminals |
| Temperature Grade | Industrial |
| Speed Grade | -3 |
| Surface-Mount Type | Ball Grid Array (BGA) |
| Verified Distributor Price | USD 67.1347 per unit |
| LCSC Availability | In stock |
XC6SLX75-3FG676I 27 mm x 27 mm ピン配置ガイド
XC6SLX75-3FG676I (27 mm x 27 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: XC6SLX75-3FG676I.
詳細は データシート をご参照ください。
主な用途
XC6SLX75-3FG676I の用途: 6 件s: Industrial Automation Control, Parallel Data Acquisition, Industrial Networking Gateway, Video and Image Processing, Test and Measurement, Motor and Motion Control.
Industrial Automation Control
The XC6SLX75-3FG676I fits industrial automation control when a machine requires substantial parallel logic, deterministic control, and numerous external connections. Its verified 74,637 logic cells, 5,831 CLBs, and 408 I/O provide capacity for sequencing, state machines, interlocks, motion-command logic, and peripheral coordination. The -3 grade's listed 862 MHz maximum frequency supplies performance headroom for timing-critical control paths. The principal trade-off is board complexity: the 676-ball, 1 mm-pitch BGA needs careful escape routing and an assembly process capable of fine-pitch inspection.
おすすめ
Parallel Data Acquisition
The FPGA's 408 I/O and programmable logic fabric make the XC6SLX75-3FG676I suitable for coordinating parallel ADC, DAC, digital sensor, or test-instrument interfaces. Engineers can implement capture control, data alignment, buffering, threshold logic, and format conversion in programmable logic instead of relying solely on a microcontroller. The verified 862 MHz -3 performance figure can support demanding parallel pipelines, although real user frequency must be established through AMD timing analysis. Signal integrity and simultaneous-switching-noise checks remain essential when many I/O change state together.
おすすめ
Industrial Networking Gateway
A programmable FPGA can consolidate multiple data-processing and interface functions in an industrial communications gateway. The XC6SLX75 offers 74,637 logic cells for framing, packet filtering, buffering, protocol conversion, and control-plane logic, with 408 I/O available for external transceivers and parallel buses. Its high-performance -3 grade may benefit timing-heavy paths, but compliance depends on the selected Ethernet or fieldbus PHY and the completed board design. The target should be paired with verified transceivers, isolation, magnetics, and connector implementations rather than treated as a complete network interface.
おすすめ
Video and Image Processing
The XC6SLX75-3FG676I can support parallel image pipelines, timing generation, pixel formatting, and sensor-interface control because its fabric combines extensive programmable resources with 408 I/O. A machine-vision controller can use logic blocks for fixed-function data movement without loading a separate CPU with every pixel operation. The listed 862 MHz device frequency is a maximum device metric rather than guaranteed video-clock performance; timing closure depends on the selected resources and clocking scheme. Video designs also need verified memory interfaces, external RAM compatibility, and careful impedance-controlled PCB routing.
おすすめ
Test and Measurement
The Spartan-6 LX device is suitable for programmable test logic, timing generation, pattern sequencing, and instrument-control functions because 74,637 logic cells can host parallel channels and 408 I/O can connect to external converters or fixtures. The -3 speed grade is attractive when setup or capture timing is restrictive, while the 676-ball package integrates many interface assignments into one programmable device. Engineers must derive achievable timing from the actual clock tree and routed paths, and should include boundary-scan, configuration, and fault-handling requirements in the design specification.
おすすめ
Motor and Motion Control
The XC6SLX75-3FG676I can implement deterministic digital motion control, encoder decoding, pulse generation, and multi-axis sequencing in programmable logic. Its 5,831 CLBs provide substantial parallel capacity, while the industrial temperature code supports designs intended for an industrial environmental class. The target's listed 862 MHz maximum frequency is useful for high-rate timing loops, but closed-loop performance depends on I/O timing, interrupt latency, and external driver behavior. Power conversion stages and motor drivers must be selected and validated independently of the FPGA.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: XC6SLX75-3FG676I — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | XC6SLX75-2FG676I | XC6SLX75-3FGG676C | XC6SLX75T-3FGG676C | XC6SLX75-2FG676C |
|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD |
| Package | 676-FCBGA, 27 mm x 27 mm, 1 mm pitch | 676-BGA | FGG676 | FGG676 | 676-BGA |
| Speed Grade | -3 high-performance grade | -2 | -3 | -3 | -2 |
| Temperature Suffix | I - industrial | I - industrial | C - commercial suffix | C - commercial suffix | C - commercial suffix |
主な差別化要因
- Higher verified maximum frequency than the -2 Spartan-6 LX comparison （vs XC6SLX75-2FG676I)
- Industrial temperature suffix retained in the direct -2 industrial comparison （vs XC6SLX75-2FG676C)
- More verified I/O than the T-prefix FGG676 comparison （vs XC6SLX75T-3FGG676C)
設計ノート
Use AMD's official Spartan-6 FG676 package file as the layout authority rather than deriving ball assignments from marketplace listings. The verified package is 27 mm by 27 mm with a 1 mm ball pitch, so power, ground, decoupling, and high-speed escape routing must be planned before placement. Controlled-impedance routing, adequate reference planes, and assembly-rule checks are essential for 676-ball BGA implementation.
Do not select power rails or decoupling values from the distributor snippets alone. The verified records do not supply the complete XC6SLX75-3FG676I power-up, current, voltage, and decoupling tables. Obtain the device documentation and current AMD power-tool guidance, then budget rail tolerance, startup current, inrush, and local capacitor effective capacitance against the selected FPGA configuration and I/O load.
Reserve the configuration interface, clock inputs, reset behavior, and programming or debug access before committing board area. The 676-ball footprint leaves no room for late changes, and clock or configuration signals routed across noisy or split power regions can impair startup. Check every assignment against the exact package file and preserve technician access for boundary scan and board-level diagnostics.
Do not treat XC6SLX75-2FG676I as an exact -3 substitute merely because its 676-BGA package name looks similar. The verified comparison gives 667 MHz for the -2 part versus 862 MHz for the target, and the I-versus-C suffix also changes temperature class. Likewise, FGG676 variants require exact ball-map and footprint verification. A purchasing substitution must preserve the required speed, temperature, package, and timing behavior.
コンプライアンス情報
The verified sources do not explicitly provide RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals declarations. The I suffix is treated as an industrial temperature code only; it is not treated as proof of AEC-Q100 qualification.
