XC6SLX75-N3FG676C - Spartan-6 LX FPGA | AMD | Industrial
部品番号: XC6SLX75-N3FG676C ✓ 生産中XC6SLX75-N3FG676C 概要
A field-programmable gate array, or FPGA, is a programmable semiconductor whose logic, memory, and I/O can be configured after manufacture. An FPGA belongs to the programmable-logic hierarchy, combining configurable logic blocks, block RAM, programmable I/O, clocking resources, and dedicated multipliers in one device. This integration supports parallel processing, high-speed interfaces, and flexible hardware upgrades without changing the printed circuit board.
The Spartan-6 LX family provides 74,637 logic elements organized into 5,831 logic activity blocks or configurable logic blocks, alongside 408 user I/O and 3,170,304 bits of block RAM. The -N3 speed grade and industrial temperature designation make the XC6SLX75-N3FG676C appropriate for embedded systems requiring sustained parallel processing under controlled commercial-industrial conditions.
The 676-ball BGA package supports dense PCB routing and a large pin budget for external memory, high-speed serial links, parallel buses, and control peripherals. The device operates with a 1.14 V to 1.26 V supply. Its 408 user I/O provide substantial connectivity, while the large block-RAM capacity allows local buffering, packet storage, waveform capture, and data-processing pipelines to be implemented inside the FPGA rather than entirely in external memory.
Typical applications include industrial control and acquisition, high-speed networking, video processing, instrumentation, communications infrastructure, and embedded signal-processing systems. The Spartan-6 LX architecture is especially useful when several buses or real-time channels must be processed concurrently, because each configurable logic block and RAM block can operate as a dedicated pipeline stage.
PCB design should follow the AMD Spartan-6 package pinout files and the device power, decoupling, configuration, clocking, and differential-pair guidance. The 676-ball BGA requires careful escape-routing, via-in-pad considerations where applicable, and uninterrupted supply and ground planes. Configuration signals and clock inputs should be protected against ringing and noise during power-up.
This page organizes the device’s principal specifications, verified drop-in options, application guidance, package considerations, and selection trade-offs into a practical engineering reference for designers evaluating the XC6SLX75-N3FG676C.
ドロップイン代替品: XC6SLX75-N3FG676C — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: XC6SLX75-N3FG676C （同一形状・フットプリント） — 相違点: Device Type, Speed Grade.
XC6SLX75-N3FG676I
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
XC6SLX75-N2FG676C
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
XC6SLX75-N1FG676C
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
XC6SLX75-N3FGG676C
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XC6SLX75-2FGG676I
✅ ドロップイン価格はお問い合わせください
データシートを見る →XC6SLX75-N3FG676C 最大定格＆電気的特性
| Device Type | Spartan-6 LX field-programmable gate array |
| Logic Elements | 74,637 |
| Logic Activity Blocks / Configurable Logic Blocks | 5,831 |
| User I/O | 408 |
| Block RAM | 3,170,304 bits |
| Core Supply Voltage | 1.14 V to 1.26 V |
| Junction Temperature Range | 0°C to 85°C |
| Speed Grade | -3 |
| Temperature Grade | Industrial |
| パッケージ | 676-ball BGA |
| Number of Package Balls | 676 |
| Package Family | S-PBGA-B676 |
| 実装タイプ | Surface mount |
| Programmable I/O Count | 408 user I/O |
| Device Configuration | Spartan-6 LX FPGA configuration architecture |
| RoHS Compliance | unknown |
| REACH Compliance | unknown |
| AEC-Q100 Qualification | unknown |
XC6SLX75-N3FG676C s-pbga-b676 ピン配置ガイド
XC6SLX75-N3FG676C (s-pbga-b676 パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: XC6SLX75-N3FG676C.
詳細は データシート をご参照ください。
主な用途
XC6SLX75-N3FG676C の用途: 6 件s: Industrial Control Systems, Data Acquisition and Instrumentation, High-Speed Network Interfaces, Video and Image Processing, Communications Infrastructure, Embedded Signal Processing.
Industrial Control Systems
The XC6SLX75-N3FG676C fits industrial controllers that coordinate sensors, actuators, interlocks, and real-time diagnostics. Its 74,637 logic elements can implement multiple control pipelines in parallel, while 408 user I/O support digital and counter inputs, machine outputs, and communications channels. The 1.14 V to 1.26 V core range and 0°C to 85°C junction specification fit controlled industrial equipment. Designers should preserve clean clocking and grounding, isolate external interfaces, and validate worst-case junction temperature with the complete power budget.
おすすめ
Data Acquisition and Instrumentation
For parallel data-acquisition systems, the XC6SLX75-N3FG676C can combine channel control, digital filtering, buffering, and interface logic in one FPGA. Its 3,170,304 bits of block RAM support local sample storage, while 74,637 logic elements provide configurable signal-processing resources. The 408 user I/O allow concurrent capture and trigger signals to be distributed efficiently. Place critical input paths near their associated BGA balls, use controlled-impedance routing for high-speed signals, and account for acquisition-clock jitter and synchronization across channels.
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High-Speed Network Interfaces
The Spartan-6 LX architecture is suitable for network adapters, protocol converters, and traffic-processing modules that require deterministic parallel logic. The XC6SLX75-N3FG676C supplies 74,637 logic elements and 3,170,304 bits of block RAM for packet classification, buffering, and state machines. Its 408 user I/O support external PHY or transceiver connections. Exact transceiver standards and signal rates must be selected against the FPGA I/O capabilities, while packet interfaces should use matched clock domains, source-synchronous routing, and carefully terminated differential connections.
おすすめ
Video and Image Processing
The XC6SLX75-N3FG676C can implement parallel image pipelines, color conversion, pixel formatting, and timing control where compact programmable logic is preferred over a processor-only approach. Its large logic-element count supports concurrent stages, and 3,170,304 bits of block RAM can hold line buffers or intermediate frames. The -3 speed grade improves timing margin for demanding pipelines. Layout should isolate video-clock domains, keep data buses byte-aligned where practical, and use the AMD pinout files to reserve dedicated configuration and clock resources.
おすすめ
Communications Infrastructure
The XC6SLX75-N3FG676C is suited to line cards, protocol bridges, and embedded communications modules that combine multiple streams with programmable logic. Its 408 user I/O and large block-RAM capacity allow simultaneous channel control, frame buffering, and test-sequence generation. The industrial temperature designation supports equipment intended for controlled communications installations. Designers must budget regulator headroom, keep switching regulators away from sensitive clock routes, validate channel-to-channel skew, and provide a dependable configuration mechanism for field updates.
おすすめ
Embedded Signal Processing
The XC6SLX75-N3FG676C supports fixed-function signal processing through configurable logic blocks and dedicated block RAM. Engineers can implement filters, correlators, fixed-point arithmetic, and decimators as parallel pipelines, using the -3 grade for additional timing margin. The 1.14 V to 1.26 V core supply supports efficient integration with modern mixed-signal systems, while 408 I/O provide broad sensor and actuator connectivity. Validate numerical precision, constrain every clocked path, and check metastability boundaries before crossing asynchronous acquisition or control domains.
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おすすめ製品の概要
エンジニアリング参考データ: XC6SLX75-N3FG676C — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | XC6SLX75-N3FG676I | XC6SLX75-N2FG676C | XC6SLX75-N1FG676C | XC6SLX75-N3FGG676C | XC6SLX75-2FGG676I |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 676-ball BGA | 676-ball BGA | 676-ball BGA | 676-ball BGA | 676-ball BGA | 676-ball BGA |
| Device Type | Spartan-6 LX FPGA | Spartan-6 LX FPGA | Spartan-6 LX FPGA | Spartan-6 LX FPGA | Spartan-6 LX FPGA | Spartan-6 LX FPGA |
| Logic Elements | 74,637 | 74,637 | 74,637 | 74,637 | 74,637 | 74,637 |
| User I/O | 408 | 408 | 408 | 408 | 408 | 408 |
| Block RAM | 3,170,304 bits | 3,170,304 bits | 3,170,304 bits | 3,170,304 bits | 3,170,304 bits | 3,170,304 bits |
| Core Supply Voltage | 1.14 V to 1.26 V | 1.14 V to 1.26 V | 1.14 V to 1.26 V | 1.14 V to 1.26 V | 1.14 V to 1.26 V | 1.14 V to 1.26 V |
| Speed Grade | -3 | -3 | -2 | -1 | -3 | -2 |
主な差別化要因
- Faster -3 performance class in the primary industrial ordering code （vs XC6SLX75-N2FG676C)
- Industrial ordering option with the same core performance as the commercial package variant （vs XC6SLX75-N3FGG676C)
- Higher timing-performance option for designs already proven on a -2 device （vs XC6SLX75-2FGG676I)
設計ノート
Use AMD's Spartan-6 package-device pinout file for the exact XC6SLX75-N3FG676C orderable code and route directly from the 676-ball BGA footprint. Reserve every power, ground, configuration, clock, and user-I/O ball shown in that file. Avoid substituting a generic 676-BGA symbol: FG676 and FGG676 can have different package definitions, so the land pattern and assembly drawing must be checked against the selected device.
Implement separate, well-decoupled supply paths for the 1.14 V to 1.26 V core and applicable I/O banks. Place bulk and high-frequency decoupling capacitors close to their associated power balls, with short ground returns and an uninterrupted reference plane. Verify regulator tolerance, startup sequencing, inrush, and total power dissipation across worst-case clock activity and I/O loading; the core-voltage range alone does not establish a complete power design.
Apply the AMD Spartan-6 layout guidance for clock, configuration, and high-speed I/O routing. Keep clock traces short, provide return paths beneath them, and separate switching or high-current outputs from sensitive clock and configuration nets. Use controlled-impedance routing for external interfaces, include series termination where the device guidance calls for it, and verify timing with post-layout analysis rather than relying only on synthesis estimates.
Estimated: the device's exact dissipation cannot be calculated without utilization, voltage, and I/O data. Review the manufacturer power table for the selected speed grade, estimate average and worst-case internal and I/O power using those operating values, then calculate junction rise with the package thermal model and board copper. Keep the 0°C to 85°C junction limit in view across ambient temperature, enclosure rise, airflow, and local heating from adjacent components.
Do not assume that two Spartan-6 LX devices with 676 balls are automatically interchangeable. Confirm the package code, ball map, speed grade, temperature suffix, configuration interface, and electrical limits before substituting a variant. In particular, the target uses FG676 and the industrial C suffix; changing only the ordering code can alter package geometry or environmental requirements even when the logic-element and I/O counts match.
コンプライアンス情報
The industrial temperature designation identifies the device's intended temperature class but does not establish AEC-Q100, RoHS, REACH, lead-free, halogen-free, or conflict-minerals status. The package contains lead in solder balls, so lead-free status should not be inferred from the absence of a lead-free statement.