XC6SLX9-N3FT256C - Spartan-6 LX FPGA, 9152 LUTs | AMD
部品番号: XC6SLX9-N3FT256C ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
XC6SLX9-N3FT256C 概要
A field-programmable gate array is a semiconductor device whose digital logic and interconnect resources are configured after manufacture. An FPGA belongs to the broader category of programmable logic devices, alongside complex programmable logic devices and application-specific integrated circuits. Its architecture combines configurable logic blocks, block RAM, programmable I/O, dedicated clocking resources, and digital signal processing blocks. This allows hardware functions to be adapted to different protocols, control algorithms, or product revisions without changing the underlying PCB in the same way a fixed-function ASIC would require.
The Spartan-6 LX family is positioned for cost-sensitive, high-volume embedded applications. The XC6SLX9-N3FT256C combines 9,152 logic cells with 589,824 RAM bits and 186 I/O in a 17 x 17 mm-class 256-FTBGA package, according to the provided component data. The N3 speed-grade designation is reported by the distributor search, but timing, power, temperature, and absolute maximum ratings are not supplied in the verified excerpt; those values must be confirmed in the manufacturer documentation before design release.
Typical implementation paths include parallel data acquisition, sensor conditioning, motor and motion control, industrial communication bridges, embedded display control, and low-cost instrumentation. The 256-FTBGA package favors designs with dense routing and high I/O counts, but it requires careful ball-grid layout, via-in-pad or escape-routing planning, and assembly-process control. The 186 I/O count is particularly relevant when a system needs substantial parallel connectivity without adding a separate large package.
For a new design, first verify the exact pinout, bank voltages, supported I/O standards, configuration interface, clock requirements, and decoupling recommendations in the official AMD Spartan-6 documentation. Do not infer pin function or board-level electrical limits from distributor listings alone. If an existing XC6SLX9 design is being replicated, compare the exact device speed grade and package variant before substitution, because FTG and FT package suffix differences can affect sourcing or ordering interpretation.
This page consolidates verified distributor specifications, package identity, sourcing links, and practical FPGA integration guidance. It deliberately separates confirmed facts from parameters that remain unavailable in the supplied search evidence, helping engineers identify procurement and design-validation tasks before committing a Spartan-6 LX board to production.
ドロップイン代替品: XC6SLX9-N3FT256C — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: XC6SLX9-N3FT256C （同一形状・フットプリント） — 相違点: Speed Grade, Mounting Type, Device Type, Package, Package Type.
クイック比較ツール — 並列比較する代替部品を選択:
XC6SLX9-N3FTG256C
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XC6SLX9-3FT256C
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XC6SLX9-3FTG256C
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XC6SLX9-2FT256C
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →XC6SLX9-2FTG256C
✅ ドロップイン✓ 在庫あり
$27.85 / 個
データシートを見る →XC6SLX9-N3FT256C 最大定格＆電気的特性
| Device Type | Spartan-6 LX FPGA |
| Programmable Logic Cells | 9,152 cells |
| RAM Bits | 589,824 bits |
| I/O Count | 186 I/O |
| Technology | 45 nm |
| Nominal Supply Voltage | 1.2 V |
| パッケージ | 256-FTBGA, 17 x 17 mm class |
| Package Type | LBGA |
| Number of Terminals | 256 balls |
| 実装タイプ | Surface mount |
| Junction Temperature Range | 0°C to 85°C |
| Supply Voltage Range | 1.14 V to 1.26 V |
| Speed Grade | N3 |
| Manufacturer Product Family | Spartan-6 LX |
| Device Category | Field-programmable gate array |
| ピン数 | 256 pins/balls |
| RoHS ステータス | unknown |
| REACH Status | unknown |
| AEC-Q100 Qualification | not_applicable |
XC6SLX9-N3FT256C lbga ピン配置ガイド
XC6SLX9-N3FT256C (lbga パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: XC6SLX9-N3FT256C.
詳細は データシート をご参照ください。
主な用途
XC6SLX9-N3FT256C の用途: 6 件s: Embedded Industrial Control, Data Acquisition and Signal Conditioning, Communications Interface Bridging, Motor and Motion Control, Video and Imaging Interfaces, Programmable Instrumentation.
Embedded Industrial Control
The XC6SLX9-N3FT256C fits embedded industrial control when a design needs programmable sequencing, state-machine logic, data capture, and extensive parallel I/O in one device. Its verified 9,152 logic cells provide room for control algorithms and interface glue, while 186 I/O support connections to sensors, actuators, counters, and digital peripherals. A typical implementation would place the FPGA beside a controller and use internal block RAM for command history or diagnostic data. The device is not automatically the best choice for every plant: the 256-FTBGA layout requires careful routing, and the 0°C to 85°C junction range and other environmental requirements must be checked against the enclosure, ambient temperature, and reliability target.
おすすめ
Data Acquisition and Signal Conditioning
The XC6SLX9-N3FT256C can implement parallel data acquisition, digital filtering, trigger logic, and buffer management when the data path must be deterministic and reconfigurable. Its 589,824 RAM bits can hold captured samples or intermediate processing data, and its 186 I/O can expose parallel sensor, ADC, and digital-control connections. In a typical design, the FPGA accepts sampled data from one or more converters, applies filtering or calibration, and transfers results to a processor or memory. The supplied evidence does not specify maximum clock frequency, DSP resources, or supported I/O standards, so interface timing and throughput must be calculated from the official AMD documentation rather than assumed.
おすすめ
Communications Interface Bridging
The Spartan-6 LX FPGA is suitable for protocol conversion and communications buffering when fixed interfaces must be bridged without a large ASIC development effort. The 186 I/O provide substantial parallel connectivity, while 9,152 logic cells can implement framing, checksums, FIFOs, state machines, and timing constraints. A practical design could receive data from a parallel sensor or processor bus, convert it into a serial interface, or combine multiple low-speed channels into a higher-level data stream. The verified material does not establish transceiver support, maximum I/O standards, or packet-processing throughput. Those limits must be checked against the selected Spartan-6 LX documentation and the external PHY or transceiver used in the design.
おすすめ
Motor and Motion Control
The XC6SLX9-N3FT256C can support motor-control and motion-control functions by combining deterministic timing, parallel I/O, and programmable control logic. It may handle encoder decoding, pulse generation, fault latching, sequencing, and supervisory logic while an external power stage or dedicated controller supplies analog and power functions. The verified device data does not state PWM resolution, maximum operating frequency, or motor-specific safety certification, so those requirements must be verified independently. The 256-FTBGA package offers many balls for routing but demands advanced manufacturing and inspection. A practical design should place FPGA power, ground, clock, and high-speed interface connections according to the official reference design and package guidelines.
おすすめ
Video and Imaging Interfaces
The XC6SLX9-N3FT256C can be evaluated for low-to-medium complexity imaging and display-interface tasks when the design needs parallel data movement, pixel timing, control logic, and programmable buffering. Its 186 I/O can connect to image sensors, display timing circuits, or memory interfaces, while the 589,824 RAM bits can support line buffers, frame metadata, or test patterns. Actual video resolution and frame rate depend on pin assignment, memory bandwidth, clocking, timing closure, and the external interface standard; none of those limits is specified in the supplied web evidence. For a new design, prototype the critical timing paths and verify the selected AMD package and device documentation before committing to a production board.
おすすめ
Programmable Instrumentation
The XC6SLX9-N3FT256C is useful for programmable test and measurement front ends where timing, pattern generation, calibration, and data logging must be adjusted across products. Logic cells can implement sequencers and measurement algorithms, RAM can buffer samples or records, and the 186 I/O can connect to sensors, switches, DACs, and communication transceivers. This flexibility allows one board architecture to cover multiple test functions without redesigning fixed hardware. The verified specifications do not include timing resolution, maximum clock rate, or analog interface limits, so those values must be derived from the official device documentation and the selected external components. The BGA package also requires assembly capability and careful ball-escape planning.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: XC6SLX9-N3FT256C — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | XC6SLX9-N3FTG256C | XC6SLX9-3FT256C | XC6SLX9-3FTG256C | XC6SLX9-2FT256C | XC6SLX9-2FTG256C |
|---|---|---|---|---|---|---|
| Package | 256-FTBGA | 256-FTBGA | 256-FTBGA | 256-FTBGA | 256-FTBGA | 256-FTBGA |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Speed-Grade Suffix | N3 | N3 with FTG suffix | 3 | 3 with FTG suffix | 2 | 2 with FTG suffix |
主な差別化要因
- Resource balance for embedded control designs （vs XC6SLX9-2FT256C)
- Identical package family for candidate sourcing variants （vs XC6SLX9-N3FTG256C)
- Dense ball-grid integration （vs XC6SLX9-3FTG256C)
設計ノート
Use the official AMD package drawing and Spartan-6 package-pinout file before placing the 256-FTBGA footprint. Confirm every ball location, power ball grouping, exposed thermal behavior, and manufacturing allowance rather than relying on a generic LBGA symbol. The package is identified as 256-FTBGA and 17 x 17 mm class in the supplied data; a mismatch in ball mapping can prevent programming, damage I/O banks, or invalidate the PCB assembly process.
Plan the 1.2 V core rail and any required I/O-bank supplies from the verified 1.14 V to 1.26 V range, then confirm sequencing and decoupling in the official AMD device documentation. Place required bulk and high-frequency decoupling close to the appropriate power balls, provide a low-impedance return path, and keep noisy switching circuitry away from sensitive FPGA inputs. The verified excerpt does not provide current consumption or power coefficients, so those values must not be estimated from generic FPGA data.
The 186 I/O and 256-ball package make routing density and bank planning central to implementation. Assign pins early according to voltage, timing, and interface requirements, then reserve clock and configuration resources before placing external components. Keep clock traces short and controlled, route high-speed differential or parallel interfaces with matched topology, and use the AMD reference design and package guidelines for escape routing. Verify the exact device variant because the supplied data distinguishes FT and FTG suffix forms.
Do not treat the N3 speed-grade or the FT versus FTG suffix as cosmetic ordering text. Speed grade can change timing margins, and package or suffix differences can affect procurement interpretation even when the family name and ball count look similar. Before migration or substitution, compare the official ordering table, package drawing, temperature grade, I/O standards, and timing data. The available web results identify candidate family variants but do not prove drop-in electrical equivalence for every replacement.
コンプライアンス情報
The supplied verified snippets do not provide verified RoHS, REACH, lead-free, halogen-free, conflict-minerals, or automotive qualification statements for this exact MPN. AEC-Q100 is not applicable based on the supplied component category and no automotive qualification claim.
