XC7A200T-3FB676E - 215K Logic Cell Artix-7 FPGA | AMD
部品番号: XC7A200T-3FB676E ✓ 生産中XC7A200T-3FB676E 概要
An FPGA is a programmable semiconductor containing configurable logic blocks, block RAM, programmable input/output resources, and dedicated digital signal processing slices. The Artix-7 family balances logic density, embedded memory, signal processing capability, and power efficiency for cost-sensitive systems. Within the FPGA hierarchy, the XC7A200T-3FB676E provides substantially more parallel processing resources than small Artix-7 devices while retaining lower power characteristics than larger scalable device families.
Key resources include 215,360 logic cells organized in 16,825 logic blocks, 13,455,360 bits of block RAM, and as many as 400 user I/O. These figures allow parallel video processing, protocol bridging, hardware acceleration, embedded control, and high-speed interface aggregation without using several smaller programmable devices. The device also includes dedicated DSP resources for filtering, transform, and fixed-point arithmetic operations.
Artix-7 devices combine programmable logic with dedicated block RAM and DSP slices in a single silicon implementation. Designers can distribute independent pipelines across multiple clock regions, exploit dedicated RAM for buffering and lookup functions, and use the high logic density for wide datapaths. The -3 speed grade is selected when design timing must be evaluated against the faster performance class rather than the -1 or -2 grades.
Typical applications include industrial control systems, machine vision, network interface equipment, test and measurement platforms, broadcast infrastructure, embedded signal processing, and high-speed storage or connectivity controllers. The 676-ball package requires careful ball-grid layout planning, multilayer PCB construction, controlled impedance routing, and attention to power delivery across the full device.
The most important design consideration is package-level complexity. A 676-ball FBGA requires via-in-pad or via-under-bump access, dense escape routing, multiple power planes, and thermal paths through the PCB rather than a simple two-row perimeter layout. Use the AMD package pinout files and Artix-7 data sheet to assign every ball, power supply, configuration pin, and decoupling connection before layout release.
This page consolidates the device family resources, package constraints, speed-grade substitution options, and practical implementation guidance into an engineering-focused reference. It complements the manufacturer data sheet with decision-oriented information for FPGA design, sourcing, and PCB planning teams.
ドロップイン代替品: XC7A200T-3FB676E — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
XC7A200T-2FB676E
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
XC7A200T-1FB676E
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
XC7A200T-3FBG676E
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XC7A200T-2FBG676E
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
XC7A200T-3FB676I
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
XC7A200T-3FB676E 最大定格＆電気的特性
| Product Type | Artix-7 Field Programmable Gate Array (FPGA) |
| Logic Cells | 215,360 cells |
| Logic Blocks | 16,825 LABs/CLBs |
| Block RAM | 13,455,360 bits |
| Maximum User I/O | 400 I/O |
| Performance Speed Grade | -3 speed grade |
| Temperature Grade | Extended commercial (E suffix) |
| パッケージ | 676-ball FBGA |
| Package Type | 676-BBGA, FCBGA |
| Programmable Logic Resources | 215,360 logic cells |
| Embedded Memory Resources | 13,455,360 RAM bits |
| 実装タイプ | Surface Mount |
XC7A200T-3FB676E 676-bbga, fcbga ピン配置ガイド
XC7A200T-3FB676E (676-bbga, fcbga パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: XC7A200T-3FB676E.
詳細は データシート をご参照ください。
主な用途
XC7A200T-3FB676E の用途: 6 件s: Industrial Control and Automation, Machine Vision and Image Processing, Network Interface and Protocol Bridging, Test and Measurement Instrumentation, Storage and Data Processing Controllers, Communications and Broadcast Infrastructure.
Industrial Control and Automation
The XC7A200T-3FB676E fits industrial controllers that combine deterministic logic, multiple communication ports, and data acquisition. Its 215,360 logic cells can host motion-control state machines, safety interlocks, protocol bridges, and supervisory logic in parallel, while 13,455,360 block RAM bits support packet buffering and trace storage. The 400-I/O capability allows the controller to consolidate discrete sensors, actuator drives, and high-speed differential interfaces that would otherwise require several supporting devices. Place separate clock regions around processor, I/O, and acceleration logic, constrain the design against the -3 timing tables, and validate power dissipation with the final utilization report rather than a worst-case assumption.
おすすめ
Machine Vision and Image Processing
The XC7A200T-3FB676E is appropriate for machine-vision pipelines requiring parallel pixel transport, frame buffering, and fixed-point arithmetic. A large portion of the 215,360 available logic cells can implement thresholding, morphology, color conversion, and feature extraction, while block RAM can hold multiple scan-line and frame stages. The device's high I/O count supports parallel sensors and high-speed capture interfaces without external logic. A practical design separates image acquisition, processing, and transmission into independent clock domains with controlled clocks for deterministic latency. The -3 grade provides additional timing margin for demanding pixel-clock paths, but final timing closure must be verified in the FPGA implementation tool for the actual device speed grade.
おすすめ
Network Interface and Protocol Bridging
The XC7A200T-3FB676E supports network equipment that must terminate or translate multiple packet streams under FPGA control. Its 215,360 logic cells allow header parsing, lookup, buffering, and checksum processing to run concurrently, and 13,455,360 block RAM bits can provide packet queues and descriptor storage. Up to 400 user I/O provides substantial bandwidth for parallel Ethernet, serial network interfaces, and backplane traffic. Partition the fabric into receive, processing, and transmit pipelines, use block RAM for elasticity buffering, and place the physical-layer interface on its own clock domain. Keep timing-constrained paths in the -3 device tables and verify packet throughput under sustained traffic rather than only with small test frames.
おすすめ
Test and Measurement Instrumentation
The XC7A200T-3FB676E suits multi-channel test equipment requiring simultaneous acquisition, pattern generation, and real-time analysis. Dedicated DSP resources can accelerate filtering and transform operations, while the FPGA logic fabric supports timing measurement, sequencers, and protocol-specific analysis. The 13,455,360 block RAM bits provide local storage for capture windows, correlation, and calibration tables, and the large I/O count simplifies multi-channel architecture. Use a pin-compatible clock source for accurate interval measurement and isolate sensitive analog-adjacent digital paths on the PCB. Because instrument accuracy depends on calibration, skew, and jitter control, verify those parameters separately from digital timing closure.
おすすめ
Storage and Data Processing Controllers
The XC7A200T-3FB676E can serve as the control plane for storage controllers, data movers, and accelerator interfaces. The available logic supports flash translation, command queuing, error management, and DMA scheduling, while block RAM accommodates descriptors and short data pipelines. A 400-I/O device supports multiple narrow data buses, but a small number of wide interfaces usually offers better timing closure and power efficiency. Constrain memory-controller and data-path interfaces to their actual interface clock periods, then run post-route timing analysis with realistic placement constraints. Use Vivado implementation reports to identify congestion around the dense BGA escape region and to evaluate whether the -3 grade is needed for the selected memory interface.
おすすめ
Communications and Broadcast Infrastructure
The XC7A200T-3FB676E fits modular communications equipment where parallel datapaths, packet processing, and high-speed external interfaces must coexist. Its large logic inventory can accommodate channelizers, FEC engines, protocol converters, and monitoring logic, while the RAM total supports symbol buffering and packet queues. The 676-ball package offers high interconnect density but requires multilayer routing and careful power-plane partitioning. Separate transmit, receive, and DSP clock regions to limit coupling, then reserve pin locations for configuration and clocking before committing to board routing. Verify the final -3 timing margin with production-parity constraints and perform hardware testing across the intended voltage and temperature corners.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: XC7A200T-3FB676E — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | XC7A200T-2FB676E | XC7A200T-1FB676E | XC7A200T-3FBG676E | XC7A200T-2FBG676E | XC7A200T-3FB676I |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 676-ball FBGA | 676-ball FBGA - same | 676-ball FBGA - same | 676-ball FBGA - same | 676-ball FBGA - same | 676-ball FBGA - same |
| FPGA Family | Artix-7 | Artix-7 | Artix-7 | Artix-7 | Artix-7 | Artix-7 |
| Logic Cells | 215,360 cells | 215,360 cells | 215,360 cells | 215,360 cells | 215,360 cells | 215,360 cells |
| Logic Blocks | 16,825 LABs/CLBs | 16,825 LABs/CLBs | 16,825 LABs/CLBs | 16,825 LABs/CLBs | 16,825 LABs/CLBs | 16,825 LABs/CLBs |
| Block RAM | 13,455,360 bits | 13,455,360 bits | 13,455,360 bits | 13,455,360 bits | 13,455,360 bits | 13,455,360 bits |
| Maximum User I/O | 400 I/O | 400 I/O | 400 I/O | 400 I/O | 400 I/O | 400 I/O |
| Speed Grade | -3 | -2 | -1 | -3 | -2 | -3 |
| Ordering Suffix | E temperature suffix | E temperature suffix | E temperature suffix | G lead-free designation with E temperature suffix | G lead-free designation with E temperature suffix | I temperature suffix |
主な差別化要因
- Highest performance option within the listed same-package XC7A200T alternatives （vs XC7A200T-2FB676E)
- Lead-free ordering option with unchanged resource and speed configuration （vs XC7A200T-3FB676E)
- Industrial temperature ordering option on the same package （vs XC7A200T-3FB676I)
設計ノート
Design the 676-ball FBGA escape routing before finalizing the board stack-up. Use the AMD package pinout files as the assignment authority, place decoupling capacitance close to the relevant power and ground balls, and distribute multiple supply and ground planes across the inner layers. Confirm the package-specific via-in-pad or via-under-bump structure against the assembly process, because solder wicking, voiding, and thermal cycling reliability depend on the complete pad and via geometry.
Do not size cooling from logic-cell count alone. Utilization of the DSP slices, block RAM, high-speed I/O, clocking, and the -3 performance grade determines dynamic power, while the 676-ball package determines the available heat-spreading paths. Use the manufacturer power report for the selected Vivado configuration, estimate junction temperature with the actual board construction, and validate it at the highest expected ambient temperature. Consider a heat spreader or heatsink when the thermal report exceeds the design margin.
Treat a speed-grade substitution as a timing decision rather than a simple BOM change. The -1, -2, and -3 XC7A200T versions share the package and core resources, but internal timing limits differ. Re-run post-route timing, preserve the configuration and constraint differences in the build record, and test the critical interfaces on hardware. Also verify the lead-free G ordering option and temperature suffix against the assembly requirements before releasing a production order.
コンプライアンス情報
The XC7A200T-3FBG676E lead-free ordering designation is visible in the part-number data, but no explicit RoHS, REACH, halogen-free, or conflict-minerals declarations are listed for the target device. The XAIP200T-3FBG676E lead-free ordering designation is visible in the part-number data, but no explicit RoHS, REACH, halogen-free, or conflict-minerals declarations are listed for the target device.