XC7K160T-2FB484I - Kintex-7 FPGA, 162240 Logic Cells, 484-FCBGA | AMD
部品番号: XC7K160T-2FB484I ✓ 生産中XC7K160T-2FB484I 概要
A field programmable gate array is a reconfigurable digital integrated circuit whose interconnect and logic blocks are defined by a bitstream loaded at configuration time. Within the semiconductor hierarchy, an FPGA sits above programmable logic devices and below application-specific ICs, offering a middle ground between fixed-function ASICs and low-density CPLDs: the flexibility of software-programmable hardware with the density, clocking, and I/O bandwidth of a full SoC-class device.
Key features of this device include the 28 nm 7-series fabric, 162240 logic cells, and a 484-FCBGA package with a 1 V nominal core supply. The -2 speed grade is the balanced performance grade in the Kintex-7 lineup, positioned between the entry -3 and -1 grades and the highest-performance -1L and -2L grades, which are screened for lower static power. Kintex-7 devices support high-speed serial transceivers, clock management, block RAM, and DSP slices for filtering and fixed-point arithmetic.
Because the FB484 package is a dense flip-chip BGA on a 1.0 mm ball pitch, this device is intended for multilayer PCB designs with careful via-in-pad and power-plane planning. Decoupling must scale with the number of simultaneously switching I/O, and dedicated configuration, VCCINT, VCCAUX, and VCCBRAM rails each need their own filtering network.
Typical applications include radar and sonar signal processing, high-speed data acquisition, industrial vision, test and measurement instrumentation, network interface equipment, and digital broadcast infrastructure. Kintex-7 devices are also common in aerospace, defence, and communications payloads where the industrial-grade screening and deep toolchain support matter.
When planning a design, confirm the pinout and package ball assignment in the manufacturer package files, keep the VCCO supply within the I/O standard voltage range of each bank, and reserve a dedicated configuration memory interface for parallel or serial bitstream loading. This page consolidates distributor availability, package details, and drop-in alternatives together with practical design guidance that is not collected in a single datasheet.
Key engineering decisions on this device center on density, package choice, and lifecycle. The 484-FCBGA footprint offers more I/O and routing headroom than smaller packages in the family but demands a laminate design with strict impedance control and a large ball escape array. Designers moving between Kintex-7 devices should confirm ball map compatibility before committing a layout, since the Xilinx package files are the authoritative source for pin assignment. The XC7K160T-2FB484I is listed as an active part, and its -2 grade and industrial rating make it the default selection for mid-density Kintex-7 designs that need more than a CPLD but do not require an UltraScale device.
ドロップイン代替品: XC7K160T-2FB484I — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: XC7K160T-2FB484I （同一形状・フットプリント）.
XC7K160T-2FBG484I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XC7K160T-2FBG484C
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XC7K160T-1FBG484I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XC7K160T-1FBG484C
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XC7K325T-2FBG484I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XC7K160T-2FB484I 最大定格＆電気的特性
| Device Type | Kintex-7 Field Programmable Gate Array (FPGA) |
| Manufacturer | AMD (Xilinx) |
| Logic Cells | 162240 |
| I/O Count | 285 |
| Block RAM (Memory Bits) | 11980800 bits |
| Process Technology | 28 nm |
| Core Supply Voltage | 1 V |
| Speed Grade | -2 |
| Temperature Grade | Industrial |
| Package Type | 484-FCBGA (FB484) |
| ピン数 | 484 balls |
| 実装タイプ | Surface Mount |
| Programming Interface | Xilinx 7-series configuration (selectable serial/parallel) |
| ライフサイクル状態 | Active |
XC7K160T-2FB484I 484-fcbga (fb484) ピン配置ガイド
XC7K160T-2FB484I (484-fcbga (fb484) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: XC7K160T-2FB484I.
詳細は データシート をご参照ください。
主な用途
XC7K160T-2FB484I の用途: 6 件s: Radar and Sonar Signal Processing, High-Speed Data Acquisition and Test Instrumentation, Industrial Vision and Machine Inspection, Network Interface and Packet Processing Equipment, Communications Payload and Digital Broadcast, Aerospace, Defence and High-Reliability Systems.
Radar and Sonar Signal Processing
The XC7K160T-2FB484I gives 162240 logic cells and 11980800 bits of block RAM in a single 484-FCBGA device, which is enough to host several parallel FFT and FIR pipelines for a radar front end. The DSP slices handle fixed-point multiply-accumulate work, while the -2 speed grade keeps timing margins comfortable on the parallel data paths that feed the ADC. Compared with a DSP-only processor solution, the FPGA removes the serial bus bottleneck between the converter and the processing chain, and the 285 I/O allow wide parallel ADC busing plus dedicated clocking into the fabric.
おすすめ
High-Speed Data Acquisition and Test Instrumentation
For digitizers, oscilloscope front ends and ATE, the XC7K160T-2FB484I offers a 1 V core, 285 I/O and a -2 speed grade so multiple simultaneous data lanes can be captured without a host processor in the loop. Its block RAM budget of 11980800 bits supports deep sample buffers, and the FPGA fabric can implement decimation filters, trigger logic and FFT analysis in hardware. Compared with a microcontroller-based logger, this device handles much higher sample rates and reduces host bottleneck; the 484-FCBGA package keeps the board compact enough for bench and rack-mount form factors.
おすすめ
Industrial Vision and Machine Inspection
Industrial camera and inspection systems need parallel image pipelines, and the XC7K160T-2FB484I can hold the ISP chain, frame buffer control and trigger logic in one device. With 162240 logic cells the fabric fits multi-stage filters and colour correction, and the 285 I/O accept the high-speed parallel data from image sensors or Camera Link receivers. The -2 speed grade supports the clock rates typical of gigabit and multi-lane sensor interfaces, while industrial temperature qualification suits factory-floor equipment. Compared with a discrete DSP plus FPGA split, integrating both functions in one Kintex-7 reduces board area and simplifies synchronisation between pipeline stages.
おすすめ
Network Interface and Packet Processing Equipment
Line cards, protocol converters and traffic aggregation nodes benefit from the XC7K160T-2FB484I because its 162240 logic cells can absorb packet classification, lookup and queuing logic in parallel with the transceiver channels. The 484-FCBGA package offers 285 I/O for parallel datapath interfaces alongside the serial transceiver resources, and the -2 speed grade supports multi-gigabit rates without a fabric timing compromise. Compared with a network processor, the FPGA keeps data in fabric and avoids software latency; compared with a smaller Kintex-7, the 160T density avoids splitting the design across two devices and the associated inter-chip links.
おすすめ
Communications Payload and Digital Broadcast
Digital radio, satellite and broadcast infrastructure uses the XC7K160T-2FB484I for channel coding, filtering and modulation functions that need both logic density and deterministic timing. The 28 nm Kintex-7 fabric at the -2 grade supports the clock rates required by wideband digital modulation while the 285 I/O and dedicated transceivers handle parallel and serial interfaces to converters and modems. Compared with an ASIC in the same role, the FPGA allows last-minute filter coefficient and protocol changes without respinning silicon, and the 484-FCBGA package keeps routing density high enough for wide datapaths.
おすすめ
Aerospace, Defence and High-Reliability Systems
The industrial-grade XC7K160T-2FB484I is a common choice for payload control, radar signal processing and avionics data concentrators where a long-lived programmable part is required. With 162240 logic cells and 11980800 bits of block RAM it can host redundant processing lanes and self-test logic, and the -2 speed grade guarantees timing headroom for rad-hard-certified peripherals around it. Compared with a lower-temperature commercial variant, the industrial grade supports wider ambient operation; compared with a full custom ASIC, the reprogrammable fabric allows field updates of bitstream configuration without changing hardware.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: XC7K160T-2FB484I — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | XC7K160T-2FBG484I | XC7K160T-2FBG484C | XC7K160T-1FBG484I | XC7K325T-2FBG484I |
|---|---|---|---|---|---|
| Brand | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) |
| Package | 484-FCBGA (FB484) | 484-FCBGA (FB484) - same | 484-FCBGA (FB484) - same | 484-FCBGA (FB484) - same | 484-FCBGA (FB484) - same |
| Logic Cells | 162240 | 162240 | 162240 | 162240 | about 2x the 160T density |
| Speed Grade | -2 | -2 (same) | -2 (same) | -1 (slower) | -2 (same) |
| Temperature Grade | Industrial | Industrial | Commercial | Industrial | Industrial |
| Process Technology | 28 nm | 28 nm | 28 nm | 28 nm | 28 nm |
| Core Supply Voltage | 1 V | 1 V | 1 V | 1 V | 1 V |
| Bitstream Compatibility | Kintex-7 family bitstream for XC7K160T, speed grade -2 | Same -2 160T bitstream | Same -2 160T bitstream | Requires -1 speed grade bitstream | Requires 325T bitstream |
主な差別化要因
- Full -2 speed grade in the 484-FCBGA footprint （vs XC7K160T-1FBG484I)
- Industrial temperature qualification （vs XC7K160T-2FBG484C)
- Correct density point without a footprint change （vs XC7K325T-2FBG484I)
- Bitstream-level interchangeability within the 160T -2 grade （vs XC7K160T-2FBG484I)
設計ノート
The Kintex-7 architecture splits supplies by domain: VCCINT for the core, VCCAUX for auxiliary and configuration circuitry, VCCBRAM for memory, and VCCO per I/O bank. Do not tie VCCO to VCCINT unless a bank genuinely operates at the core voltage, because mixing a 1 V core rail with a higher-voltage bank shifts the I/O thresholds and damages reliability margins. Filter each domain with its own bulk capacitor placed on the same ball row as the supply balls, and follow the AMD 7-series PCB design guidelines for via-in-pad and thermal-via structures.
Estimated: with a 1 V core and roughly 500 mA of core current, static core dissipation is about 0.5 W before I/O and dynamic activity are counted, and a fully active design can reach several watts. The FB484 package has no exposed heat-spreader pad in the same sense as a leaded power package, so heat leaves through the solder balls and the board itself. Spread at least 30 to 40 thermal vias into the VCCINT and VCCBRAM ball arrays, keep the ground reference plane solid beneath the device, and use a 8-layer or thicker stack-up with a thermal spreader area on the top layer if the ambient temperature is high.
The 484-FCBGA sits on a 1.0 mm ball pitch with a 17 x 17 ball array, so escape routing is tight. Plan the stack-up so that a full BGA escape is possible in the first signal layer and reserve dedicated layers for the 1 V core plane and the VCCO banks. Because only one part of the perimeter of the array is available for component-side escape, move the decoupling capacitors to the opposite side of the board where necessary and use laser-drilled via-in-pad only if your fabricator confirms its capability. Verify every high-speed transceiver and memory interface against the AMD recommended PCB layer stack-up table before release.
Two mistakes account for most field issues with 484-FCBGA Kintex-7 designs. First, assuming that all XC7K160T 484-ball parts are interchangeable: the speed grade and temperature suffix change the bitstream target, so a -1 part cannot reuse a -2 bitstream and a commercial-grade part changes the derating assumptions. Second, ignoring the configuration path: reserve the INIT_B, DONE, PROGRAM_B and TCK/TDI/TDO/TMS pins for JTAG, and pick a configuration memory sized for the bitstream plus the FPGA-internal CRC and header overhead rather than sizing it from the raw fabric count.
On a 484-ball flip-chip BGA, the practical limit is usually signal integrity rather than logic density. Route high-speed transceiver pairs and memory interfaces on contiguous inner layers with reference-plane continuity, keep the AC coupling capacitor placement close to the driver, and control differential skew through matched length tuning in the layout tool rather than by hand. For designs using MMCM/PLL clocking, isolate the clock network from noisy I/O and keep the configuration pins away from switching edges to prevent false CRC errors during startup.
コンプライアンス情報
The industrial (-I) temperature suffix and the -2 speed grade are confirmed in the distributor and manufacturer listings. RoHS, REACH, lead-free and halogen-free statements were not explicitly published in the manufacturer material retrieved, so they are recorded as unknown rather than assumed.
