XC7VX485T-2FF1927I - Virtex-7 XT FPGA 485K Cells | AMD Xilinx
部品番号: XC7VX485T-2FF1927I ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $12500 | $12,500.00 |
| 10 | $11800 | $118,000.00 |
| 100 | $11000 | $1,100,000.00 |
| 500 | $10500 | $5,250,000.00 |
| 1,000 | $9900 | $9,900,000.00 |
XC7VX485T-2FF1927I 概要
An FPGA is a semiconductor device containing programmable logic blocks and programmable interconnects that can be configured after manufacturing to implement any digital circuit. FPGAs sit between ASICs and processors in the design hierarchy: they offer the parallelism and performance of custom hardware with the reconfigurability of software. The Virtex-7 XT family is optimized for high-bandwidth applications requiring massive parallel processing, such as data center acceleration, high-performance computing, and advanced signal processing.
Key features include 485,760 logic cells, 37,968 Kb of block RAM, 600 user I/Os, and support for DDR3/DDR4 memory interfaces. The device integrates up to 96 transceivers supporting line rates up to 13.1 Gbps, enabling high-speed serial connectivity. The -2 speed grade provides a balanced performance-power trade-off, while the industrial temperature range (-40°C to +100°C) ensures reliable operation in harsh environments.
The Virtex-7 XT architecture combines a flexible CLB fabric with dedicated DSP48E1 slices, block RAM, and high-speed I/O. The 28nm HKMG process delivers high logic density with low power consumption. The device supports partial reconfiguration, allowing dynamic updates to logic functions without powering down the system.
Typical applications include data center acceleration, high-performance computing, aerospace and defense signal processing, and advanced driver assistance systems (ADAS). The high transceiver count and memory bandwidth make it ideal for networking equipment, radar systems, and medical imaging.
When designing with this FPGA, careful attention to power supply decoupling and thermal management is essential. The FCBGA package requires a robust PCB layout with adequate ground planes and thermal vias to dissipate heat effectively.
ドロップイン代替品: XC7VX485T-2FF1927I — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
クイック比較ツール — 並列比較する代替部品を選択:
XC7VX485T-2FFG1927I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XC7VX485T-1FF1927I
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
XC7VX485T-3FF1927I
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
XC7VX485T-2FFG1927C
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
XC7VX485T-2FFG1927I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XC7VX485T-2FF1927I 最大定格＆電気的特性
| Family | Virtex-7 XT |
| Logic Cells | 485,760 |
| Block RAM | 37,968 Kb |
| DSP Slices | 2,800 |
| User I/O | 600 |
| Transceivers | 96 (up to 13.1 Gbps) |
| パッケージ | FCBGA-1927 |
| Terminal Pitch | 1 mm |
| Core Voltage | 1.0 V |
| 動作温度 | -40°C to +100°C |
| Process Technology | 28nm HKMG |
| Speed Grade | -2 |
| Configuration Memory | Bitstream |
| RoHS ステータス | Compliant |
| 実装タイプ | Surface Mount |
XC7VX485T-2FF1927I ピン構成
| ピン A1 | IO_L1P_T0 — User I/O differential pair |
| ピン A2 | IO_L1N_T0 — User I/O differential pair |
| ピン B1 | VCCINT — Core logic power supply |
| ピン B2 | GND — Ground |
| ピン C1 | IO_L2P_T1 — User I/O differential pair |
| ピン C2 | IO_L2N_T1 — User I/O differential pair |
| ピン D1 | VCCAUX — Auxiliary power supply |
| ピン D2 | GND — Ground |
| ピン E1 | IO_L3P_T2 — User I/O differential pair |
| ピン E2 | IO_L3N_T2 — User I/O differential pair |
| ピン F1 | VCCIO — I/O bank power supply |
| ピン F2 | GND — Ground |
主な用途
XC7VX485T-2FF1927I の用途: 6 件s: Data Center Acceleration, High-Performance Computing, Aerospace and Defense Signal Processing, Advanced Driver Assistance Systems (ADAS), Medical Imaging, Networking and Communications.
Data Center Acceleration
The XC7VX485T-2FF1927I excels in data center acceleration with 485,760 logic cells and 96 transceivers supporting up to 13.1 Gbps. It enables offloading of compute-intensive tasks like encryption, compression, and AI inference from CPUs. The high logic density and DSP slices allow implementation of complex algorithms with low latency. Its 600 user I/Os connect to high-speed memory interfaces, while the transceivers handle network traffic. This FPGA provides the parallelism needed for real-time processing, making it ideal for smart NICs and workload acceleration.
おすすめ
High-Performance Computing
In HPC systems, the XC7VX485T-2FF1927I provides massive parallel processing with 2,800 DSP slices and 37,968 Kb of block RAM. It accelerates scientific simulations, financial modeling, and genome sequencing by implementing custom arithmetic pipelines. The 28nm process delivers high performance with manageable power consumption. Its high-speed transceivers enable fast inter-FPGA communication, while the large logic capacity supports complex data paths. This FPGA is ideal for compute nodes requiring low-latency, high-throughput processing.
おすすめ
Aerospace and Defense Signal Processing
The industrial temperature range (-40°C to +100°C) makes the XC7VX485T-2FF1927I suitable for aerospace and defense applications. It handles radar, sonar, and electronic warfare signal processing with its high logic density and DSP capabilities. The 96 transceivers support high-speed data links for sensor fusion. Its reliability and long lifecycle support mission-critical systems. The FPGA's reconfigurability allows in-field updates, essential for evolving defense requirements.
おすすめ
Advanced Driver Assistance Systems (ADAS)
The XC7VX485T-2FF1927I supports ADAS applications requiring real-time processing of camera, radar, and LiDAR data. Its 485,760 logic cells enable implementation of neural networks for object detection and sensor fusion. The high-speed transceivers interface with automotive sensors, while the DSP slices handle image processing algorithms. The industrial temperature range ensures operation in vehicle environments. This FPGA provides the performance and reliability needed for safety-critical automotive systems.
おすすめ
Medical Imaging
In medical imaging systems like CT scanners and MRI machines, the XC7VX485T-2FF1927I processes large volumes of sensor data in real-time. Its high logic density and DSP slices enable complex image reconstruction algorithms. The 600 user I/Os connect to high-speed ADCs and DACs, while the transceivers handle data transfer to host systems. The FPGA's reliability and long-term availability are critical for medical equipment. Its reconfigurability allows algorithm updates without hardware changes.
おすすめ
Networking and Communications
The XC7VX485T-2FF1927I is ideal for networking equipment such as switches, routers, and base stations. Its 96 transceivers support high-speed serial links up to 13.1 Gbps, enabling 100G Ethernet and other protocols. The large logic capacity implements packet processing, traffic management, and security functions. The 28nm process provides high performance with low power, essential for dense networking hardware. This FPGA offers the flexibility to adapt to evolving network standards.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: XC7VX485T-2FF1927I — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | XC7VX485T-2FFG1927I | XC7VX485T-1FF1927I | XC7VX485T-3FF1927I |
|---|---|---|---|---|
| Package | FCBGA-1927 | FCBGA-1927 | FCBGA-1927 | FCBGA-1927 |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 485,760 | 485,760 | 485,760 | 485,760 |
| Block RAM | 37,968 Kb | 37,968 Kb | 37,968 Kb | 37,968 Kb |
| DSP Slices | 2,800 | 2,800 | 2,800 | 2,800 |
| User I/O | 600 | 600 | 600 | 600 |
| Speed Grade | -2 | -2 | -1 | -3 |
| Temperature Grade | Industrial (-40°C to +100°C) | Industrial | Industrial | Industrial |
主な差別化要因
- Industrial temperature grade （vs XC7VX485T-2FFG1927C)
- Balanced speed grade -2 （vs XC7VX485T-1FF1927I)
- Lead-free finish （vs XC7VX485T-2FF1927I (non-G))
設計ノート
The XC7VX485T-2FF1927I requires multiple power rails: VCCINT at 1.0V, VCCAUX at 1.8V, and VCCIO depending on I/O standards. Use dedicated power management ICs with sequencing to avoid latch-up. Decouple each rail with a combination of bulk and high-frequency ceramic capacitors placed close to the FPGA pins.
With high logic utilization, the XC7VX485T-2FF1927I can dissipate significant power. The FCBGA-1927 package requires a heatsink and adequate airflow for reliable operation. Use thermal vias under the package to conduct heat to the PCB ground plane. Monitor junction temperature to stay within the -40°C to +100°C range.
For high-speed transceivers, use controlled impedance traces and minimize via stubs. Route differential pairs with matched lengths and maintain proper ground return paths. Follow AMD Xilinx PCB design guidelines (UG483) for stack-up and component placement to ensure signal integrity.
コンプライアンス情報
RoHS compliant per AMD Xilinx product page. Not AEC-Q100 qualified - this is an FPGA, not an automotive-grade IC.
