XCZU11EG-2FFVF1517I - Zynq UltraScale+ MPSoC EG | AMD
部品番号: XCZU11EG-2FFVF1517I ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
XCZU11EG-2FFVF1517I 概要
A System-on-Chip FPGA (SoC FPGA) combines a hard processor subsystem (PS) with programmable logic (PL) on a single die. This architecture enables designers to implement custom hardware accelerators, high-speed I/O interfaces, and real-time control functions in the PL while running an operating system such as Linux or VxWorks on the ARM cores in the PS. The Zynq UltraScale+ family sits at the high end of this hierarchy, offering advanced DSP engines, high-bandwidth DDR memory interfaces, and multi-gigabit transceivers that go beyond conventional FPGA or microcontroller solutions.
Key features of XCZU11EG-2FFVF1517I include 653,100 programmable logic cells, 597,120 FPGA registers, and 22,124,954 bits of block RAM. The PS supports a 1.3 GHz maximum ARM Cortex-A53 clock, a 600 MHz Cortex-R5 clock, and a 533 MHz Mali-400 MP2 clock. Connectivity interfaces include CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, allowing direct interface to a wide range of peripheral devices and system networks.
The MPSoC is built on TSMC 16nm FinFET technology, enabling high logic density with manageable power dissipation. The -2 speed grade provides balanced timing performance for the programmable fabric, while the industrial temperature grade supports operation in demanding -40°C to +100°C environments. The 1517-ball FCBGA package with 40x40 mm body and 0.8 mm ball pitch enables high-density PCB routing for complex multi-rail power and high-speed serial links.
Typical applications include edge AI inference at industrial sites, 5G/4G baseband processing, radar and electronic warfare systems, broadcast and professional AV equipment, medical imaging, and data center SmartNICs. Designers should note that the device requires multiple power rails (VCCINT, VCCAUX, VCCBRAM, VCCO, PS rails) and careful sequencing; the recommended power-up sequence can be found in PG201 (Zynq UltraScale+ PCB Design). Adequate decoupling capacitors and a solid power delivery network are critical to achieving reliable high-speed operation.
When designing with this MPSoC, ensure that the boot mode pins are correctly configured for the desired QSPI, SD, or JTAG boot source. The PS can offload complex control tasks, while the PL implements latency-sensitive data path acceleration. Thermal management must consider both the PS and PL power consumption, and a heatsink or airflow is recommended for sustained high utilization.
ドロップイン代替品: XCZU11EG-2FFVF1517I — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: XCZU11EG-2FFVF1517I （同一形状・フットプリント） — 相違点: RoHS Status, Speed Grade.
クイック比較ツール — 並列比較する代替部品を選択:
XCZU11EG-1FFVF1517I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XCZU11EG-2FFVF1517E
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
XCZU11EG-L1FFVF1517I
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
XCZU11EG-1FFVF1517E
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
XCZU11EG-2FFVB1517I
⚡ 同一パッケージ ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
XCZU11EG-L1FFVB1517I
⚡ 同一パッケージ📋 参考代替品（カタログ未掲載）
XCZU11EG-2FFVF1517I 最大定格＆電気的特性
| Product Category | Embedded - System On Chip (SoC) |
| Architecture | MCU, FPGA |
| Core Processors | Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARM Cortex-R5 with CoreSight, ARM Mali-400 MP2 |
| FPGA Logic Cells | 653100 Cells |
| FPGA Registers | 597120 Registers |
| Block RAM | 22124954 Bit RAM |
| Max Processor Clock | 1.3 GHz (A53) / 600 MHz (R5) / 533 MHz (Mali) |
| Speed Grade | -2 |
| Temperature Grade | Industrial (I) |
| パッケージ | 1517-FCBGA (40x40 mm) |
| Number of Terminals | 1517 |
| Terminal Form | BALL |
| 実装タイプ | Surface Mount |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| RoHS ステータス | unknown |
| ライフサイクル状態 | Active |
XCZU11EG-2FFVF1517I 1517-fcbga (40x40 mm) ピン配置ガイド
XCZU11EG-2FFVF1517I (1517-fcbga (40x40 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: XCZU11EG-2FFVF1517I.
詳細は データシート をご参照ください。
主な用途
XCZU11EG-2FFVF1517I の用途: 6 件s: Edge AI Vision Acceleration, 5G/4G Wireless Baseband, Radar and Electronic Warfare, Broadcast and Professional AV, Medical Imaging, Data Center SmartNIC.
Edge AI Vision Acceleration
The XCZU11EG-2FFVF1517I delivers 653K logic cells and 22.1 Mbit block RAM, enabling convolutional neural network (CNN) inference at the edge without a server-grade GPU. The PS Cortex-A53 cluster can run the Linux-based AI framework while the PL implements quantized INT8 CNN acceleration using DSP48E2 slices. Industrial temperature support makes it suitable for factory floor machine vision systems. When paired with DDR4 memory like MT40A512M16JY-075E, memory bandwidth supports real-time 1080p or 4K frame processing. Power optimization can be achieved by using the -L1 variant for lower dynamic energy in thermally constrained camera systems.
おすすめ
5G/4G Wireless Baseband
In a remote radio unit (RRU) or small-cell baseband, the XCZU11EG-2FFVF1517I handles PHY-layer processing in the PL, including FFT, channel coding, and MIMO pre-coding, while the dual Cortex-R5 processors manage real-time radio resource control. The Mali-400 MP2 GPU assists in front-haul network encryption or protocol processing. With 1517-ball FCBGA packaging and industrial temperature range, the device fits compact radio cards with constrained airflow. High-speed transceivers connect to RF front-ends and Ethernet backhaul, and the integrated block RAM reduces external memory latency for channel buffers. The -2 speed grade supports the tight timing requirements of 5G NR symbol processing.
おすすめ
Radar and Electronic Warfare
The XCZU11EG-2FFVF1517I is ideal for radar pulse compression, beamforming, and electronic warfare (EW) signal processing. Its 597,120 registers and dense DSP fabric support fast data streaming and parallel FFT pipelines. The industrial temperature grade ensures operation in avionics and ground-based radar shelters from -40°C to +100°C. The integrated PCIe and multi-gigabit transceivers allow direct connection to RF sampling ADCs and high-speed data recorders. Security features in Zynq UltraScale+ protect encryption keys and boot images, which is critical for defense applications. FPGA configuration time is short enough for frequency-hopping EW systems.
おすすめ
Broadcast and Professional AV
For broadcast video switchers, H.264/H.265 encoders, and pro AV distribution, the XCZU11EG-2FFVF1517I provides ample logic cells for video processing algorithms like scaling, color space conversion, and frame rate conversion. The Mali-400 MP2 GPU can generate graphics overlays, while the PL handles SDI, HDMI, and DisplayPort interfaces using high-speed transceivers. The PS runs media control software, and the Linux environment simplifies integration with streaming protocols. With 22.1 Mbit of block RAM, line buffers can be cached to reduce DDR bandwidth pressure. This MPSoC is a cost-effective alternative to separate FPGA and application processor chips in broadcast equipment.
おすすめ
Medical Imaging
The XCZU11EG-2FFVF1517I suits ultrasound, CT, and MRI digital signal chains that need deterministic parallel processing. The Quad Cortex-A53 can run the host interface and image reconstruction algorithms, while the PL implements real-time beamforming and filtering. The -2 speed grade provides sufficient fabric clock margin for high-throughput sensor data. Power consumption is manageable for cart-based systems, and the industrial temperature range still covers typical hospital environments. The integrated security for IP protection helps medical device manufacturers safeguard proprietary algorithms. Companion DDR4 devices such as MT40A512M16JY-075E deliver the memory bandwidth required for large image datasets.
おすすめ
Data Center SmartNIC
In a SmartNIC for data centers, the XCZU11EG-2FFVF1517I offloads packet processing, TCP segmentation, and virtualization functions from the host CPU. The programmable logic implements high-throughput parser/match/action pipelines, while the PS manages configuration and control planes. The 1517-ball package supports multiple 100G Ethernet ports via the integrated high-speed transceivers. Using block RAM and external DDR4 like K4A8G085WB-BIWE minimizes latency per packet. The -2 speed grade is well suited for line-rate processing at 100G. The device supports standards such as PCIe Gen3 and flexible I/O for NVMe-over-fabric accelerators, making it a strong platform for custom network appliances.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: XCZU11EG-2FFVF1517I — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | XCZU11EG-1FFVF1517I | XCZU11EG-2FFVF1517E | XCZU11EG-L1FFVF1517I |
|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD |
| Package | 1517-FCBGA (40x40) | 1517-FCBGA (40x40) - same | 1517-FCBGA (40x40) - same | 1517-FCBGA (40x40) - same |
| Speed Grade | -2 | -1 | -2 | -L1 |
| Temperature Grade | Industrial (I) | Industrial (I) | Extended (E) | Industrial (I) |
| Logic Cells | 653100 | 653100 | 653100 | 653100 |
| Block RAM (bits) | 22124954 | 22124954 | 22124954 | 22124954 |
| Max A53 Frequency | 1.3 GHz | 1.2 GHz (typical) | 1.3 GHz | 1.2 GHz (typical) |
| Connectivity | CANbus, Ethernet, I2C, SD, SPI, UART, USB OTG | Same PS connectivity | Same PS connectivity | Same PS connectivity |
主な差別化要因
- Higher speed grade -2 compared to -1 （vs XCZU11EG-1FFVF1517I)
- Industrial temperature range vs extended （vs XCZU11EG-2FFVF1517E)
- Balanced logic-to-processor ratio （vs XCZU11EG-L1FFVF1517I)
設計ノート
The Zynq UltraScale+ MPSoC uses multiple power rails: VCCINT, VCCAUX, VCCBRAM, and PS rails (VCC_PSINTLP, VCC_PSINTFP, VCC_PSAUX, etc.). Power-up sequencing must follow the requirements in AMD PG201 (Zynq UltraScale+ Device PCB Design). Use PMICs or sequencing controllers to ensure VCCINT ramps before I/O rails. Place 4.7uF bulk capacitors near each rail and 100nF ceramics close to each ball, with a solid power plane return path.
At high utilization, XCZU11EG-2FFVF1517I can dissipate 10-20W depending on logic density and transceiver count. The 40x40 mm FCBGA package requires a thermal solution such as a heatsink with forced airflow or a heat spreader. The industrial temperature grade allows junction temperature up to 100°C, but the maximum power derating curve in the datasheet must be respected. Use the AMD power estimator tool to calculate actual dissipation for your design.
Use a minimum of 8-10 layers with at least three ground planes and dedicated power planes. The high-speed multi-gigabit transceivers demand controlled impedance differential routing (typically 100 ohm differential) and clock source placement close to the transceiver pins. For DDR4 interfaces, follow the AMD DDR board design guidelines, matching trace lengths and tuning within the specified skew. Block RAM in the PL can be used to reduce off-chip memory, but external DDR4 is still necessary for PS memory access.
コンプライアンス情報
Compliance data not present in the verified web data snapshot. Contact AMD for current RoHS/REACH declarations.