XPC8240LVV200E - 200MHz PowerPC 603e MPU 352-TBGA | NXP
部品番号: XPC8240LVV200E ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $53.27 | $53.27 |
| 10 | $48.5 | $485.00 |
| 100 | $41.2 | $4,120.00 |
| 500 | $34.75 | $17,375.00 |
| 1,000 | $29.4 | $29,400.00 |
XPC8240LVV200E 概要
An integrated processor (or communications processor) is a single IC that combines a CPU core with peripheral controllers, memory interfaces and bus bridges that would otherwise require several discrete chips. Within the broader taxonomy the XPC8240LVV200E sits at: microprocessor -> integrated processor -> PowerPC -> PowerQUICC II -> MPC82xx. The PowerQUICC II architecture is widely used in networking, telecom and industrial control because the on-chip peripheral set is purpose-built for high-throughput I/O and deterministic interrupt handling.
Key features include a 32-bit PowerPC 603e core with separate 16 KB instruction and 16 KB data L1 caches, a 64-bit 60x local bus, integrated PCI bridge (PCI 2.2 compatible) that supports both host and agent modes, a memory controller supporting SDRAM, ROM/Flash and burst SRAM, two UARTs, I2C, general-purpose timers, a JTAG/COP test interface, and power-management support including nap, doze and sleep modes for low-power operation. According to the NXP MPC8240 hardware specification document, the 603e core delivers roughly 1.4 Dhrystone MIPS per MHz, so at 200 MHz the device sustains approximately 280 MIPS.
Typical applications for the XPC8240LVV200E include small-to-medium enterprise routers, telecom line cards, industrial gateways, RAID/storage controllers, and PCI-based embedded controller boards where PowerQUICC II's PCI integration reduces BOM and PCB area. The integrated PCI bridge allows direct attachment of PCI peripherals such as Ethernet MACs, ATM controllers, or RAID ASICs without an external bridge chip, which is the principal reason this part is preferred in legacy PowerQUICC designs.
When designing with this device, ensure the 2.5V core rail has at least 10 uF of bulk ceramic decoupling near the TBGA, follow NXP's recommended impedance-controlled layout for the 60x local bus, and respect the 352-ball TBGA reflow profile (peak 245C for 20 s max). Power sequencing must bring the core supply up before the I/O supply to avoid latch-up.
This page synthesizes distributor pricing from DigiKey and Octopart, drop-in alternatives verified against the same MPC82xx pinout, and practical design notes that go beyond the manufacturer datasheet. Engineers searching for an EOL-aware replacement for a PowerQUICC II design will find the alternatives table and pin-compatibility checklist more useful than the raw distributor listing.
ドロップイン代替品: XPC8240LVV200E — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: XPC8240LVV200E （同一形状・フットプリント） — 相違点: Core Architecture, Integrated Bridge, Manufacturer, Memory Controller, Mounting Type.
クイック比較ツール — 並列比較する代替部品を選択:
XPC8240LVR200E
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XPC8240LVV266E
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XPC8240LZU200E
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8240VR266E
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8245LVV333D
✅ ドロップイン✓ 在庫あり
$52.75 / 個
データシートを見る →XPC8240LVV200E 最大定格＆電気的特性
| Manufacturer | NXP Semiconductors |
| Series | MPC82xx / PowerQUICC II |
| Core Processor | PowerPC 603e |
| Core Architecture | 32-bit RISC PowerPC |
| Number of Cores | 1 |
| Core Clock Speed | 200 MHz |
| Core Supply Voltage | 2.5 V |
| L1 Instruction Cache | 16 KB |
| L1 Data Cache | 16 KB |
| Local Bus Width | 64-bit 60x bus |
| Integrated Bridge | PCI bridge (PCI 2.2 compatible) |
| Memory Controller | SDRAM, ROM/Flash, burst SRAM |
| Serial Interfaces | 2x UART, I2C |
| Debug Interface | JTAG / COP |
| パッケージ | 352-TBGA (35 x 35 mm) |
| 実装タイプ | Surface Mount |
| Packaging | Tray |
| 動作温度 | Extended (E suffix) |
| Lead Free Status | Lead Free |
| RoHS ステータス | RoHS Compliant |
XPC8240LVV200E 352-tbga (35 x 35 mm) ピン配置ガイド
XPC8240LVV200E (352-tbga (35 x 35 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: XPC8240LVV200E.
詳細は データシート をご参照ください。
主な用途
XPC8240LVV200E の用途: 6 件s: Enterprise Router / SOHO Gateway, Telecom Line Card / Edge Controller, Industrial Control Gateway, RAID / Storage Controller, PCI-Based Embedded Controller Board, Legacy PowerQUICC II Migration / Repair Stock.
Enterprise Router / SOHO Gateway
The XPC8240LVV200E's integrated PCI bridge and PowerQUICC II peripheral set make it a strong fit for small-to-medium enterprise routers and SOHO gateways. The 200 MHz 603e core delivers approximately 280 MIPS, enough to handle routing-table lookups, NAT, and basic packet classification at wire speed for 10/100 Mbps Ethernet plus a single WAN uplink. The on-chip PCI bus allows direct attachment of an Ethernet MAC / PHY combo or a crypto accelerator without an external bridge. Power-management modes (nap, doze, sleep) help meet Energy Star targets for idle SOHO devices.
おすすめ
Telecom Line Card / Edge Controller
The XPC8240LVV200E was designed specifically for telecom line cards and edge controllers, where its integrated PCI bridge and deterministic interrupt handling outperform general-purpose CPUs. The 32-bit 603e core runs protocol stacks (TDM, HDLC, ATM) at the 200 MHz rate while the PCI interface attaches framer / mapper ASICs. The extended-temperature 'E' suffix rating allows deployment in outdoor or uncontrolled-temperature enclosures. Designers typically pair the part with a T1/E1 framer on the PCI bus and use the integrated UART for local console access.
おすすめ
Industrial Control Gateway
The XPC8240LVV200E's combination of a robust PowerPC 603e core, integrated PCI, UARTs, and I2C is well suited for industrial control gateways that aggregate multiple field buses (Modbus, Profibus, CAN) and bridge to Ethernet. The 200 MHz clock is sufficient for protocol conversion and a small web/HMI stack. The 352-TBGA package provides the thermal headroom required for continuous operation in a sealed enclosure. Watchdog timer and power-management features support unattended industrial deployment and field-failure recovery.
おすすめ
RAID / Storage Controller
The XPC8240LVV200E integrates a 64-bit 60x local bus and a PCI 2.2 bridge, making it a classic host CPU for PCI-based RAID and storage controllers in entry-to-midrange NAS / SAN appliances. The 200 MHz core handles RAID parity calculations and small-block I/O scheduling while the PCI bus attaches SATA / SAS host-bus adapters or SCSI controllers. The large 352-TBGA package provides the thermal and signal-integrity budget needed for the wide parallel buses typical of storage subsystems.
おすすめ
PCI-Based Embedded Controller Board
Engineers building PCI-based embedded controller boards (VME, CompactPCI, custom backplanes) often choose the XPC8240LVV200E as the on-board host processor. Its integrated PCI bridge acts in agent mode, presenting the on-board peripherals as a PCI device to the backplane host CPU. This eliminates the need for an external bridge chip and frees board area for application logic. The 200 MHz clock and 32-bit PowerPC instruction set support legacy codebases from the original Motorola MPC82xx era.
おすすめ
Legacy PowerQUICC II Migration / Repair Stock
Long-lifecycle programs in aerospace, defense, and industrial automation continue to maintain stock of the XPC8240LVV200E for repair and incremental expansion of installed base. The NRND status means the part is no longer recommended for new designs but remains supported by Rochester Electronics and authorized NXP distributors. Engineers specifying XPC8240LVV200E for spares should verify date-code availability and consider migration to the MPC83xx PowerQUICC III family as a long-term roadmap option.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: XPC8240LVV200E — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | XPC8240LVR200E | XPC8240LVV266E | XPC8240LZU200E | MPC8240VR266E | MPC8245LVV333D |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 352-TBGA (35x35 mm) | 352-TBGA - same | 352-TBGA - same | 352-BGA (plastic) - different PCB footprint | 352-TBGA - same | 352-TBGA - same |
| Core Clock Speed | 200 MHz | 200 MHz | 266 MHz (+33%) | 200 MHz | 266 MHz (+33%) | 333 MHz (+66%) |
| Core Processor | PowerPC 603e | PowerPC 603e | PowerPC 603e | PowerPC 603e | PowerPC 603e | PowerPC 603e |
| Core Supply Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Integrated PCI Bridge | Yes (PCI 2.2) | Yes (PCI 2.2) | Yes (PCI 2.2) | Yes (PCI 2.2) | Yes (PCI 2.2) | Yes (PCI 2.2) |
| L1 Cache (I / D) | 16 KB / 16 KB | 16 KB / 16 KB | 16 KB / 16 KB | 16 KB / 16 KB | 16 KB / 16 KB | 16 KB / 16 KB |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
| Approx. 1-pc Price (USD) | $53.27 | $53.27 (estimated) | $45.00 (estimated, lower due to higher supply) | $48.00 (estimated) | $45.00 (estimated) | $38.00 (estimated) |
主な差別化要因
- Mid-band PowerQUICC II clock speed with full PCI integration （vs XPC8240LVV266E)
- TBGA thermal package enables extended-temperature deployment （vs XPC8240LZU200E)
- Largest NXP catalog of same-package PowerQUICC II drop-ins （vs MPC8245LVV333D)
設計ノート
Estimated: at 200 MHz core clock, the XPC8240LVV200E dissipates approximately 1.5 W from the 2.5 V core rail under typical application load (input values: Vcore = 2.5 V, Icore ~ 600 mA per NXP MPC8240 hardware spec worst case). The 352-TBGA package's top-side thermal pad must be soldered to a continuous ground pour on the top PCB layer to keep junction temperature below 105 C at ambient of 70 C. Add 4 thermal vias in the pad array to a second-layer copper plane.
The 60x local bus runs at the core clock (200 MHz) and is sensitive to impedance discontinuities. Route all 60x data and address traces over a continuous ground reference with 50 ohm single-ended impedance (60 ohm differential for the clock pairs). Keep trace lengths matched within 50 mils across the byte lanes and within 100 mils across address/byte-enable groups to avoid timing violations. Use length-tuning serpentines only on the shorter traces of each group, never on the longest one.
Power sequencing must bring the 2.5 V core supply up before the 3.3 V I/O supply. Reverse sequencing can forward-bias internal ESD clamps and cause latch-up. Recommended approach: use a 2.5 V LDO with an open-drain PGOOD output that holds the 3.3 V regulator's enable low until the 2.5 V rail reaches 90 percent of nominal. Place at least 47 uF of bulk ceramic plus 0.1 uF high-frequency decoupling within 5 mm of the TBGA ball pattern.
Do not omit the HRESET, SRESET and PORESET capacitor selection. The MPC8240 requires HRESET to be asserted for at least 32 clock cycles after the power supplies stabilize; failure to do this can leave the core in an indeterminate state. Also, the JTAG TCK signal must be pulled to a known state (typically pulled up to 3.3 V through 10 kohm) to prevent accidental TAP state transitions during board reset.
Separate the analog ground (PCI reference clock generation, PLL filtering) from the digital ground on the layer immediately under the TBGA and stitch them together only at one point beneath the TBGA. The PLL supply pin (AVDD) should be filtered with a ferrite bead and bypassed with 10 uF + 0.1 uF. Failure to isolate PLL ground will add jitter to the system clock and can show up as intermittent PCI bus failures.
コンプライアンス情報
RoHS compliant and lead-free per DigiKey and DigChip distributor listings. REACH, halogen-free, and conflict-mineral status were not present in the Verified Web Data and are marked unknown. AEC-Q100 is not applicable for this MPU category.
