XPC8255ZUIFBC - PowerPC G2 MPU, 200MHz, 480-TBGA | NXP
部品番号: XPC8255ZUIFBC ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $88 | $880.00 |
| 100 | $79.5 | $7,950.00 |
| 250 | $74 | $18,500.00 |
| 500 | $70 | $35,000.00 |
XPC8255ZUIFBC 概要
What is a PowerQUICC II processor? PowerQUICC II is NXP's second-generation integrated communications processor architecture combining a high-performance PowerPC 603e core with an independent on-chip RISC-based CPM. The CPM offloads serial, networking, and DMA tasks from the main core, allowing concurrent protocol processing without burdening the host CPU. This division of labor - a control-plane 603e core plus a dedicated communications engine - is the defining value proposition of PowerQUICC II in telecom, routing, and embedded networking equipment.
Key features include a 16 KB instruction / 16 KB data L1 cache, 200 MHz core/CPM frequency, dual 10/100 Mbps Ethernet MACs, support for up to 16 SCC (Serial Communication Channels), PCI bridge, memory controller for SDRAM/Flash, and a generous DMA engine. The integrated architecture eliminates external MAC, PCI bridge, and serial glue logic, reducing board area and BOM.
Technical depth: the device uses a 1.8V core supply and 3.3V I/O, with extensive bus snooping and an MMU for full virtual memory. The CPM runs its own microcode store, allowing user-loadable protocol handlers (HDLC, Ethernet bridges, ATM, etc.). The 480-TBGA provides ample signal headroom for parallel SDRAM, 64-bit PCI, and multiple SCC interfaces simultaneously active.
Typical applications include wired routers and switches, DSLAM line cards, ISDN/ATM/PSTN infrastructure, industrial serial servers, protocol converters, and embedded telecom control planes. Compared to pure host CPUs, PowerQUICC II wins in systems where raw channelized serial throughput offloaded to dedicated hardware is more valuable than peak single-thread CPU speed.
When designing with this device, pay close attention to power sequencing (core-before-I/O 1.8V/3.3V ramp) and ensure all TBGA balls are properly reflowed; the large ball pitch makes head-in-pillow defects more common than fine-pitch QFN. Pinout, BSDL, and IBIS models are available from NXP for the TBGA-480 package.
ドロップイン代替品: XPC8255ZUIFBC — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
クイック比較ツール — 並列比較する代替部品を選択:
MPC8255ACVRIHBC
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8260ACVRIHBC
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8272CVRPIHB
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8250ACVRIHBC
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC8280CZQIULA
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XPC8255ZUIFBC 最大定格＆電気的特性
| Manufacturer | NXP USA Inc. (formerly Freescale Semiconductor) |
| Part Family | PowerQUICC II MPC82xx |
| Core Architecture | PowerPC G2 (603e core) |
| Core Count | 1 |
| データバス幅 | 32-bit |
| Core Frequency | 200 MHz |
| CPM Frequency | 200 MHz |
| L1 Instruction Cache | 16 KB |
| L1 Data Cache | 16 KB |
| Package Type | TBGA-480 |
| Package Code (per JEDEC) | LBGA |
| Package Dimensions | 37.5 x 37.5 mm |
| 実装タイプ | Surface Mount |
| Operating Temperature Grade | Commercial |
| Core Supply Voltage | 1.8 V |
| I/O Supply Voltage | 3.3 V |
| RoHS ステータス | unknown |
| ライフサイクル状態 | Obsolete (legacy / NRND) |
XPC8255ZUIFBC 37.5 x 37.5 mm ピン配置ガイド
XPC8255ZUIFBC (37.5 x 37.5 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: XPC8255ZUIFBC.
詳細は データシート をご参照ください。
主な用途
XPC8255ZUIFBC の用途: 7 件s: Wired Router / Switch Control Plane, DSLAM Line Card / Central Office Equipment, Industrial Serial Server / Protocol Converter, Embedded Telecom Control Card, Networked Print / Imaging Controller, Aerospace / Defense Avionics Databus Concentrator, Software-Defined Radio Control Host.
Wired Router / Switch Control Plane
The XPC8255ZUIFBC's 200 MHz PowerPC 603e host core paired with a separate 200 MHz CPM is purpose-built for routing and switching control-plane cards in wired infrastructure. The CPM's multi-channel SCCs and dual 10/100 Ethernet MACs let the chip terminate WAN-side serial links (T1/E1, HDLC, frame relay) without external MAC silicon, while the host core runs the routing stack, CLI, and forwarding tables. Compared with a generic host CPU plus an external PCI bridge, the PowerQUICC II approach typically cuts board area by one to two square inches and reduces BOM cost by 15-25% in mid-range routers.
おすすめ
DSLAM Line Card / Central Office Equipment
In DSLAM line cards and other central-office equipment, the XPC8255ZUIFBC aggregates multiple subscriber-facing serial channels into an upstream Ethernet or ATM trunk. The CPM's per-channel microcode engines allow simultaneous HDLC, PPP, ATM AAL2, and Ethernet bridging without burdening the host core, which is reserved for management, QoS, and SNMP tasks. Designers typically pair the chip with 64 MB to 256 MB of SDRAM and a small flash boot device; the integrated PCI bridge interfaces to upstream ASICs without glue logic.
おすすめ
Industrial Serial Server / Protocol Converter
The PowerQUICC II architecture fits industrial serial servers and protocol-conversion gateways because its many SCCs can each run a different protocol (RS-232/485, Modbus, Profibus, HDLC) simultaneously. The XPC8255ZUIFBC handles dozens of channels running at once while the host core maintains the IP-based management plane. With commercial temperature grade (0 to +70 C, per the manufacturer datasheet), designers can deploy the device in protected industrial cabinets or push to industrial temp variants for harsher environments. Drop-in same-family upgrades like the MPC8272 extend longevity.
おすすめ
Embedded Telecom Control Card
Telecom control cards in legacy base-station controllers, softswitches, and PBX systems take advantage of the XPC8255ZUIFBC's deterministic CPM offload of HDLC and SS7 traffic. The 32-bit PowerPC core runs the host-side control software (call processing, signaling, OAM) while the CPM sustains hundreds of channels at line rate. Compared with a server-class CPU + NIC approach, this integrated solution consumes far less power (typically 3-5W vs 25W+) and fits in a single VME or cPCI slot.
おすすめ
Networked Print / Imaging Controller
Production printers and imaging controllers benefit from the XPC8255ZUIFBC's PCI bridge plus dual Ethernet MACs, which expose a high-speed path to the RIP engine while serving embedded management and PDL parsing. The CPM offloads job accounting and remote-status updates to dedicated serial channels. Designers usually expand the host peripheral bus via the on-chip PCI, attaching ASICs for print engine control and scanner interfaces, freeing the 200 MHz core to focus on rendering throughput.
おすすめ
Aerospace / Defense Avionics Databus Concentrator
Because the XPC8255ZUIFBC integrates multiple MIL-STD-1553-equivalent and HDLC-capable SCCs in a deterministic engine, it has been used as an avionics/databus concentrator, gateway, and protocol translator in legacy aerospace and defense subsystems. The commercial temp grade covers protected avionics bays; field-deployed platforms can substitute the industrial-temp MPC8255 siblings. Drop-in higher-frequency options (MPC8255ACVRIHBC at 250 MHz) provide headroom for programs needing extended support life without board rework.
おすすめ
Software-Defined Radio Control Host
Software-defined radio and signal-intelligence platforms use the XPC8255ZUIFBC as a control host that bridges high-speed data converters and DSP farms. The integrated PCI bridge links ADC/DAC ASICs to the host while the host runs the radio-control GUI, waveform configuration, and audit logging. Although the 200 MHz core is not used for heavy DSP (which is offloaded to dedicated processors), its deterministic response and rich peripheral set make it ideal as a stable controller in multi-board SDR chassis.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: XPC8255ZUIFBC — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MPC8255ACVRIHBC | MPC8260ACVRIHBC | MPC8272CVRPIHB | MPC8250ACVRIHBC | MPC8280CZQIULA |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | TBGA-480 (37.5x37.5 mm) | TBGA-480 (37.5x37.5 mm) | TBGA-480 (37.5x37.5 mm) | TBGA-480 (37.5x37.5 mm) | TBGA-480 (37.5x37.5 mm) | TBGA-480 (37.5x37.5 mm) |
| Core Frequency | 200 MHz | 250 MHz | 200 MHz (HiP4) | 266 MHz | 150 MHz | 300 MHz |
| CPM Frequency | 200 MHz | 250 MHz | 200 MHz | 266 MHz | 150 MHz | 300 MHz |
| Core Architecture | PowerPC 603e (G2) | PowerPC 603e | PowerPC 603e | PowerPC 603e | PowerPC 603e | PowerPC 603e |
| L1 Cache (I/D) | 16 KB / 16 KB | 16 KB / 16 KB | 16 KB / 16 KB | 16 KB / 16 KB | 16 KB / 16 KB | 16 KB / 16 KB |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Lifecycle | Obsolete / NRND | NRND | NRND | NRND | Obsolete | NRND |
主な差別化要因
- Speed upgrade available in identical footprint （vs MPC8255ACVRIHBC)
- Higher peripheral count available in same footprint （vs MPC8260ACVRIHBC)
- Drop-in alternative at lower clock for cost-sensitive apps （vs MPC8250ACVRIHBC)
- Long-term continuity via authorized supplier （vs MPC8280CZQIULA)
- Integrated CPM reduces external peripheral silicon （vs MPC8272CVRPIHB)
設計ノート
Estimated: At VDD_core = 1.8 V and VDD_IO = 3.3 V, the XPC8255ZUIFBC typically draws ~1.2 A core + ~0.4 A I/O under full load, giving roughly 3.4 W total. Designers should sequence the 1.8 V core supply before or simultaneously with the 3.3 V I/O rail to avoid I/O latch-up; the typical reference design uses a power-good handshake from the 1.8 V regulator to the chip's HRESET pin. Decoupling must include 100 nF X7R caps on every power pin plus four bulk 22 uF tantalums per rail, placed within 5 mm of the TBGA balls.
Estimated: with a 3-4 W typical dissipation and TBGA-480 package thermal resistance around 12-15 C/W on a well-designed 4-layer PCB, expected junction temperature rise is roughly 40-60 C above ambient at 70 C ambient. Designers should ensure a continuous copper ground plane beneath the TBGA and at least 8 thermal vias in the central ball grid for heat extraction. Designers in sealed enclosures should thermally characterize the production chassis before committing to commercial-temp grade.
TBGA-480 demands tight manufacturing discipline. Recommended stack-up uses 1 oz copper on outer layers and 0.5 oz on inner layers with a build-up that places the PBGA escape directly above a via-in-pad array. Escape routing should use 0.1 mm/0.125 mm traces with microvia stitching into the inner BGA fan-out. After reflow, run X-ray inspection on all 480 balls - head-in-pillow and partial-wetting defects are common on large TBGAs and visual inspection alone misses them.
The 64-bit SDRAM interface runs at the same 100 MHz as the ECC memory controller and must be length-matched to within 0.5 mm on byte lanes, 1 mm on chip-select lanes; otherwise the DDR-edge timing will fail on first silicon. The PCI bus needs 30-ohm series termination on CLK lines near the XPC8255 and clock-length matched within 2.5 mm of all PCI devices. JTAG should be brought out to a 0.05 in. pitch ribbon header for boundary-scan bring-up; BSDL files exist in the manufacturer hardware specification package.
Avoid leaving unused SCC pins floating - the CPM pad cells require external pull-downs via 10 kohm resistors to prevent mid-level oscillation that can draw tens of milliamps and couple noise into adjacent channels. Boot configuration words sampled at HRESET release are easy to flip on prototype re-spins; document the BCSR/RESET_CONFIG values on the schematic so rework does not silently break the boot. Finally, do not overlook CPM microcode revision: the same silicon behaves differently across microcode versions, and field stock may ship with stale firmware.
コンプライアンス情報
RoHS, REACH, lead-free, halogen-free and conflict-mineral statuses are not explicitly stated in the public distributor and datasheet snippets consulted. Customers should request a Material Declaration directly from NXP or Rochester Electronics for any regulatory documentation before EU/Japan export. AEC-Q100 is not applicable - this is a general-purpose communications processor, not an automotive AEC-Q100 grade device.
