TLIN829-Q1
TLIN829-Q1 - Fault-Protected LIN Transceiver, 20kbps | TI
The Texas Instruments TLIN829-Q1 is an automotive fault-protected Local Interconnect Network (LIN) physical-layer transceiver with integrated dominant-state timeout, supporting data rates up to 20kbps and operating from a wide 5.5V to 28V supply (with extended fault tolerance above 28V). Housed in an 8-pin SOIC or 8-pin SON (DRB 3x3) package, it converts a TXD logic-level data stream into a single-wire LIN bus waveform via a current-limited wave-shaping driver, and converts the bus signal back to logic levels through an open-drain RXD pin. The transceiver complies with LIN 2.0, LIN 2.1, LIN 2.2, LIN 2.2A, SAE J2602, and ISO/DIS 17987-4 standards. According to TI product page data, the LIN receiver additionally supports fast in-line programming at rates up to 100kbps. The TLIN829-Q1 is a 12V-system optimized, cost-effective derivative of the TLIN1029A-Q1 and TLIN1029-Q1 family, sharing the same family footprint and adding wider operating voltage, bus-fault protection, and a dominant-state watchdog that prevents the bus from being stuck in the dominant state due to software or hardware faults.
What is a LIN transceiver? A LIN (Local Interconnect Network) transceiver is a physical-layer (PHY) device that connects a microcontroller's UART-style logic domain to a single-wire, low-cost automotive communication bus. It typically integrates a wave-shaping transmitter, a comparator-based receiver, bus fault protection (against shorts to battery, ground, and adjacent LIN nodes), ESD protection, and a low-power wake-up mechanism. LIN sits hierarchically under in-vehicle networking alongside CAN (Controller Area Network), FlexRay, and Automotive Ethernet - LIN targets low-speed, low-cost nodes like door modules, mirror adjusters, and seat controllers, while CAN/Ethernet handle higher-bandwidth powertrain and ADAS domains.
Key features include: integrated dominant-state timeout for fail-safe bus recovery, ±45V LIN bus fault tolerance (load-dump tolerant), ±15kV HBM ESD on the LIN pin per IEC 61000-4-2, ultra-low quiescent current in sleep mode, thermal shutdown, and an active-high WAKE input that wakes the device from sleep without MCU intervention. The part supports both 3.3V and 5V MCU logic via a separate VCC/VSUP rail scheme. The 8-pin SOIC (D) and 8-pin SON (DRB 3x3) packages provide small footprint for space-constrained body-electronics modules.
Typical applications include automotive body control modules (BCM), HVAC control, door/window/seat modules, steering column controls, rain/light sensors, mirror adjusters, headlamp leveling, and interior lighting nodes. The part's AEC-Q100 Grade 1 qualification (-40C to +125C) makes it suited for underhood and cabin applications alike.
Designers should ensure proper LIN bus termination (typically a master pull-up of 1kΩ plus a diode to VSUP, and a slave pull-up of 30kΩ in the device), use a 100nF X7R decoupling capacitor close to VSUP, and route the LIN trace as a short, stub-free single-ended line, twisted if possible, to minimize radiated emissions. The dominant-state timeout is configurable; refer to the datasheet's register or strap-setting description for the chosen mode.
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