MCF54454AVR266
MCF54454AVR266 - 266MHz 32-bit MPU | NXP | 360-BGA
The NXP Semiconductors MCF54454AVR266 is a 266 MHz, 32-bit RISC microprocessor in a 360-terminal TEPBGA package measuring 23 x 23 mm. Verified listing data identifies one CPU core, a 32-bit data bus, surface mounting, commercial temperature grade, and operation from 1.8 V, 2.5 V, or 3.3 V. The part belongs to the MCF5445x embedded-processing family and is positioned for complex control, networking, and industrial applications.
An embedded microprocessor is a system-on-chip designed to execute firmware and control peripherals in a dedicated product. Unlike a general-purpose desktop CPU, it integrates memory interfaces, communications, timers, and other I/O resources into one package. This reduces system size and component count while requiring careful power, clock, memory, and PCB design around a high-pin-count ball-grid package.
The principal verified characteristics are a 266 MHz operating frequency, 32-bit architecture, one CPU core, a 32-bit data-bus width, and compatibility with 1.8 V, 2.5 V, and 3.3 V rails. Its 360 TEPBGA package offers extensive connectivity for embedded systems, but every pin assignment, signal-routing requirement, and thermal condition must be checked against the official MCF54454 datasheet before layout or firmware deployment.
MCF54454AVR266 can suit industrial controllers, networked equipment, automation systems, communications equipment, and real-time embedded control platforms. Its 32-bit processing architecture is appropriate for firmware combining peripheral control, protocol handling, data acquisition, and supervisory logic. The exact memory capacity, peripheral set, clocking requirements, and electrical limits are not available in the supplied verified results and must not be inferred from the MPN.
The critical design consideration is package-level implementation. A 23 x 23 mm, 360-terminal TEPBGA requires multilayer PCB routing, exact land-pattern compliance, controlled escape routing, and careful via placement. Confirm the manufacturer pinout, recommended PCB stack-up, decoupling network, exposed thermal strategy, and manufacturing tolerances before releasing artwork.
This page consolidates verified package and processor listings, source links, sourcing limitations, and engineering context beyond a distributor search result. Current price, inventory, lifecycle status, and pin-level data were not supplied, so buyers should request a quotation and review the official datasheet before committing to production.
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