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AMD Ryzen AI 7 HX 455 leak signals a cut-back HX 470 with Z2 Extreme-class Radeon 890M iGPU

A Weibo leak surfaces an 8-core Ryzen AI 7 HX 455 APU with 16 CU Radeon graphics matching the Radeon 890M and 24 MB of L3 cache, pointing at a thinner HX 470 sibling.

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TL;DR — tiga ayat

  • A Weibo leak cited by TechPowerUp points to an AMD Ryzen AI 7 HX 455 with 8 cores/16 threads and a 16 CU iGPU. (S1)
  • The 16 CU iGPU is reportedly identical to the Radeon 890M used in the Ryzen Z2 Extreme. (S1)
  • The HX 455 is described by the source as a cut-back Ryzen AI HX 470, with 24 MB L3 versus the Z2 Extreme's 16 MB. (S1)

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AMD Ryzen AI 7 HX 455 leak signals a cut-back HX 470 with Z2 Extreme-class Radeon 890M iGPU — Semiconductor News news briefEditorial cover for a Semiconductor News brief. Chip motif; headline "AMD Ryzen AI 7 HX 455 leak signals a cut-back HX 470 with Z2 Extreme-class Radeon 890M iGPU". No reported key numbers on this brief, so no number strip is drawn. 1 cited source. A one-time entrance animation stops under reduced motion.SEMICONDUCTOR NEWS · NEWS BRIEFAMD Ryzen AI 7 HX 455 leak signals acut-back HX 470 with Z2 Extreme-classRadeon 890M iGPUXAIPART
Cover image generated from data already shown on this page: the category motif, the headline, and reported key numbers. No decorative illustration; no third-party image.

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Reported by TechPowerUp on . Summarized and analyzed by XAIPART Editorial.

What happened

According to a Weibo post by Golden Pig Upgrade cited by TechPowerUp, AMD is preparing a new mobile APU branded Ryzen AI 7 HX 455 that closely resembles the existing Ryzen Z2 Extreme.S1 The leak states the new CPU would launch with eight cores and sixteen threads and a 16 CU integrated GPU, with the iGPU reportedly identical to the Radeon 890M found on the Ryzen AI Z2 Extreme.S1

The exact core breakdown is unknown, but the leaker indicated, in response to a question about CCD layout, that the configuration would resemble the Z2 Extreme, which carries three Zen 5 cores and five Zen 5c cores spread across two CCDs.S1 The new APU reportedly ships with a larger 24 MB L3 cache than the Z2 Extreme's 16 MB, which the source reads as a sign that the HX 455 is a cut-back version of the Ryzen AI HX 470, an APU that pairs four Zen 5 cores with eight Zen 5c cores.S1

Key numbers
MetricReported valueSource
CPU cores / threads8 / 16[S1]
iGPU configuration16 CU, reportedly identical to Radeon 890M[S1]
L3 cache24 MB (vs. 16 MB on Z2 Extreme)[S1]
Reference core layout3x Zen 5 + 5x Zen 5c across two CCDs (Z2 Extreme)[S1]
TDP / power envelopeNot disclosed—
Launch date / pricingNot disclosed—

Background timeline

  1. - Golden Pig Upgrade leaks the Ryzen AI 7 HX 455 on Weibo, citing 8 cores/16 threads, a 16 CU iGPU and 24 MB of L3 cache.[S1]
  2. Date not disclosed - Ryzen Z2 Extreme launches with 3 Zen 5 + 5 Zen 5c cores across two CCDs, 16 MB L3 and Radeon 890M graphics.[S1]
  3. Date not disclosed - Ryzen AI HX 470 launches with 4 Zen 5 + 8 Zen 5c cores; the HX 455 is described by the source as a cut-back variant of this part.[S1]

XAIPART take

Technical impact

For design teams, the HX 455 reads as a mid-tier Strix-class refresh: 8 cores/16 threads with a likely 3+5 Zen 5/Zen 5c split, but with the same 16 CU RDNA iGPU that already drives handheld gaming on the Z2 Extreme.S1 The 24 MB L3 bump over the Z2 Extreme is the most board-relevant signal here, because it implies a different CCD topology or a fused-down HX 470 die rather than a direct Z2 Extreme bin, which can shift memory-bandwidth and latency behavior on thin-and-light designs.XAIPART analysis

Market impact

If AMD slots the HX 455 into the HX 470's socket and power envelope, OEMs get a cheaper path to Radeon 890M-class iGPU performance in mainstream notebooks, putting pressure on Intel's integrated graphics SKUs in the same 28-45 W class.S1 Sourcing teams should expect the part to compete directly with mid-range HX 370/370-class inventory already on allocation; lead-time visibility will depend on whether AMD routes HX 455 through the same supply chain as the HX 470.XAIPART analysis

Action

Validate the HX 455 against the existing Ryzen AI HX 470 reference platform before re-spinning any 16 CU iGPU board, since both parts share the same iGPU silicon and similar cache topology.S1 For procurement, hold a buffer of HX 470 stock as a second source until AMD confirms HX 455 socket compatibility, TDP and NDA dates, all of which the source does not disclose.XAIPART analysis

XAIPART Forecast

XAIPART expects AMD to officially confirm the Ryzen AI 7 HX 455 with a published TDP and at least one OEM design win by Q1 2027; if no TDP figure or OEM notebook listing appears by 2027-03-31, this forecast is wrong. The threshold that buyers should track is whether announced HX 455 notebooks ship with at least 16 GB of LPDDR5x memory, which is the configuration that lets the 16 CU iGPU match Radeon 890M handheld-class frame rates.XAIPART analysis

Facts are as reported by the cited source. The design-in, sourcing and forward-looking statements above are XAIPART's analysis, not the source's claims. Uncertainty: every specification beyond 8 cores/16 threads, 16 CU iGPU and 24 MB L3 - including exact core split, CCD count, TDP, socket and launch date - comes from a single Weibo post and has not been confirmed by AMD or any second publication.

Corrections: none at publication. This brief will be updated with a timestamp if the source corrects its report.

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XAIPART expects AMD to officially confirm the Ryzen AI 7 HX 455 with a published TDP and at least one OEM design win by Q1 2027 no TDP figure or OEM notebook listing appears by 2027-03-31 Pending

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Dimana ini berada dalam cerita

Event chain · as of 2026-10-20T09:30:38+08:00 · showing 6 of 8 briefs · nodes link to published articles on this site.
Event chain — amd+semiconductor-newsChain nodes: 2026-10-07 AMD publishes 1Ku pricing for all 31 Zen 6 EPYC 9006 SKUs. SP7 ships Q4 2026, SP8 follows H1 2027, with Default CPU Power replacing TDP.; 2026-10-09 Astera Labs adds retimers, redrivers, cable modules, optical drivers and TAs to its Aries 7 portfolio, with sampling due in Q4 2026 ahead of OCP Global Summit demos.; 2026-10-10 AMD disclosed a Zen 6 hardware sampler aimed at CXL tiered-memory hot-page tracking; benchmark deltas are mixed and patches remain in development.; 2026-10-10 AMD has raised GPU vendor pricing in China by up to $104 on the RX 9070, citing memory and manufacturing costs. International increases are expected to follow.; 2026-10-10 iBUYPOWER is shipping a Ryzen AI Max+ PRO 495-based mini workstation from $3999 in Q4 2026. Read what changes for design-in and procurement.; 2026-10-20 A Weibo leak surfaces an 8-core Ryzen AI 7 HX 455 APU with 16 CU Radeon graphics matching the Radeon 890M and 24 MB of L3 cache, pointing at a thinner HX 470 sibling.. As of 2026-10-20T09:30:38+08:00. Open forecast: AMD publishes 1Ku pricing for all 31 Zen 6 EPYC 9006 SKUs. SP7 ships Q4 — pending Open forecast: Astera Labs adds retimers, redrivers, cable modules, optical drivers and — pending.2026-10-07AMD publishes 1Ku our brief ↗2026-10-09Astera Labs adds rour brief ↗2026-10-10AMD disclosed a Zeour brief ↗2026-10-10AMD has raised GPUour brief ↗2026-10-10iBUYPOWER is shippour brief ↗2026-10-20A Weibo leak surfaour brief ↗this briefOpen forecast: AMD publishes 1Ku pricing for all 31 Zen 6 EPYC 9006 SKUs. SP7 ships Q4 — pendingOpen forecast: Astera Labs adds retimers, redrivers, cable modules, optical drivers and — pending
  1. amd-epyc-9006-venice-700-8-core-to-14-904-256-core-what-sp7-sp8-buyers-need2026-10-07
  2. astera-labs-broadens-aries-7-pcie-7-connectivity-line-for-multi-rack-ai-clusters2026-10-09 · product launch
  3. what-amd-s-zen-6-ibs-memory-profiler-means-for-cxl-tiered-memory-server-designs2026-10-10
  4. amd-gpu-price-hikes-of-up-to-104-hit-china-first-international-board-partners-already-notified2026-10-10 · price change
  5. ibuypower-s-amd-ai-halo-mini-pc-what-the-ryzen-ai-max-pro-495-means-for-compact-workstation-sourcing2026-10-10 · product launch
  6. amd-ryzen-ai-7-hx-455-leak-signals-a-cut-back-hx-470-with-z2-extreme-class-radeon-890m-igpu2026-10-20
  1. AMD publishes 1Ku pricing for all 31 Zen 6 EPYC 9006 SKUs. SP7 ships Q4 2026, SP8 follows H1 2027, with Default CPU Power replacing TDP. trade
  2. Astera Labs adds retimers, redrivers, cable modules, optical drivers and TAs to its Aries 7 portfolio, with sampling due in Q4 2026 ahead of OCP Global Summit demos. product launch trade
  3. AMD disclosed a Zen 6 hardware sampler aimed at CXL tiered-memory hot-page tracking; benchmark deltas are mixed and patches remain in development. trade
  4. AMD has raised GPU vendor pricing in China by up to $104 on the RX 9070, citing memory and manufacturing costs. International increases are expected to follow. price change trade
  5. iBUYPOWER is shipping a Ryzen AI Max+ PRO 495-based mini workstation from $3999 in Q4 2026. Read what changes for design-in and procurement. product launch trade
  6. A Weibo leak surfaces an 8-core Ryzen AI 7 HX 455 APU with 16 CU Radeon graphics matching the Radeon 890M and 24 MB of L3 cache, pointing at a thinner HX 470 sibling. trade
  7. Colorful's E-ATX X870E Ultra-S V14 AM5 board ships in China at 1,899 CNY with 16+2+1 80 A VRMs, five M.2 slots and Wi-Fi 7. product launch trade
  8. A leaked OpenBenchmarking entry for an AMD Gainsborough engineering sample shows 6 cores, 24 GB LPDDR5 at 9600 MT/s, and Furmark parity with today's Steam Deck at lower resolution. trade

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Tekanan kos berdasarkan dimensi

Source: FRED · Generated · reference output z and composite are algorithm outputs, not a fetch snapshot

Cost pressure by dimension — composite stateDiverging bars for three dimensions around a zero midpoint. Input Cost has no reading; Supply Demand z -1.4711, notable; Fx Energy z 0.1754, neutral. Composite index -9.7, band neutral.0Input costno readingSupply/demandz −1.4711 · notable46 dFX & energyz +0.1754 · neutral5 dcomposite −9.7 · neutral−100 · −40 · −15 · 0 · +15 · +40 · +100
Underlying values — copyable for verification.
DimensionFRED series IDUnitLagAs of
Input costPCOPPUSDM, PALUMUSDM, PNICKUSDMUSD/mt52 d
Supply/demandPCU334413334413, IPG3344Sindex(1982=100) / index(2017=100)46 d
FX & energyDEXCHUS, DCOILBRENTEU, DHHNGSPrate / USD/bbl / USD/MMBtu5 d

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Jejak pemindaian untuk laporan ini
Source fetched TechPowerUp · www.techpowerup.com · 1,832 chars · fetch status success
Source sanity (S1) ok — passed before any model call (no s1_ block recorded)
Model / prompt MiniMax-M3 · prompt Blog Agent - News Summary (v2.8-final) · 6,443 tokens · 23.3s · run completed
Gate verdict pass · 6/6 applicable checks passed · spec v2.9 · C10 ratio 0.047427 · C10 rounds 0
Time contract 2 <time datetime> values in this brief — 0 violations (+08:00 or date-only)

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Kaedah penukaran skor 6 pemeriksaan yang berlaku, 6passed: 100 Peratus. No hold items or mandatory failures. Gate spec: v2.9 (S0 + S1 + C1–C20) · Source affinity (C20): 0.5714. Pemeriksaan yang berlaku lulus 6 / 6 = 100% · kesimpulan: pass No hold items or mandatory failures Gate spec: v2.9 (S0 + S1 + C1–C20) · Source affinity (C20): 0.5714 Gerbang menentukan penerbitan. Skor audit yang bebas hanya untuk peringatan.

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Sumber

  1. AMD Ryzen AI 7 HX 455 Surfaces with 16 CU Radeon Graphics — https://www.techpowerup.com/353881/amd-ryzen-ai-7-hx-455-surfaces-with-16-cu-radeon-graphics · rss · diakses

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