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XC7A50T-2CS325I - Artix-7 FPGA, 324-LFBGA | AMD
XC7A50T-2CS325I

XC7A50T-2CS325I - Artix-7 FPGA, 324-LFBGA | AMD

The AMD XC7A50T-2CS325I is an Artix-7 field-programmable gate array (FPGA) in a 324-LFBGA package, with 150 I/O and the industrial -2 speed grade indicated by the ordering code. The verified distributor listing identifies the device as a programmable FPGA and provides the family-level package information, while the Artix-7 data sheet is the authoritative source for electrical, timing, configuration, and environmental details. The package designation CSG325 is used for this 324-LFBGA configuration, and the final G suffix in related AMD/Xilinx catalog listings indicates the same package family notation used by the source data. An FPGA is a programmable digital semiconductor used to implement logic, control, signal-processing, communications, and embedded-system functions in a single integrated device. Xilinx 7 Series FPGAs combine configurable logic blocks, block RAM, digital signal-processing resources, programmable I/O, clock-management resources, and dedicated configuration mechanisms. Artix-7 devices are positioned for low-cost, low-power, and small-form-factor designs, making the XC7A50T useful for industrial control, communications, instrumentation, embedded vision, and compact embedded platforms. The verified data identifies the XC7A50T family and its Artix-7 architecture but does not provide complete electrical tables, timing grades, resource counts, maximum I/O standards, power values, or package dimensions. Those parameters remain marked as needed rather than inferred. The -2 suffix, I suffix, package, and 150-I/O listing are retained exactly as supplied. Engineers should use the AMD Artix-7 data sheet and package pinout files for final timing, electrical, thermal, and land-pattern decisions. The target is suitable when a design needs a moderately capable programmable logic platform and can be implemented in the CSG325 package. Its industrial ordering suffix should be checked against the system environmental requirements. Configuration memory, programming tools, clock sources, I/O voltage domains, and decoupling must be designed around the relevant Artix-7 power architecture rather than inferred from a distributor summary. Unlike a fixed-function ASIC, an FPGA allows logic revisions, parallel interface adaptation, and field-programmable product differentiation. Unlike a microcontroller-only design, it can place multiple deterministic datapaths and control functions beside one another, provided timing closure and resource utilization are verified. This makes XC7A50T-2CS325I relevant to custom controllers, protocol bridges, test systems, and industrial equipment where firmware flexibility and hardware parallelism are both valuable. When selecting or replacing this FPGA, verify the exact package pinout, supported I/O standards, configuration mode, speed grade, temperature grade, supply requirements, and tool compatibility using AMD documentation. The -2CS325I and -2CSG325I ordering strings are related catalog spellings, but a substitution must not be approved from the package name alone. This page combines verified distributor identity, source URLs, application context, and explicit data gaps rather than presenting undocumented specifications as facts.

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XC7A50T-2CSG324I - Artix-7 FPGA, 52K Logic Cells | AMD
XC7A50T-2CSG324I

XC7A50T-2CSG324I - Artix-7 FPGA, 52K Logic Cells | AMD

The AMD XC7A50T-2CSG324I is a member of the Artix-7 FPGA family, built on a 28nm process technology. It features 52,160 logic cells, 2,764,800 block RAM bits, and 210 user I/O pins, all housed in a 324-ball CSG (CSPBGA) package. This device operates with a core voltage (VCCINT) of 1.0V and is specified for the industrial temperature range (-40°C to +100°C). An FPGA (Field-Programmable Gate Array) is an integrated circuit that can be configured by the designer after manufacturing, allowing for custom digital logic implementations. FPGAs sit between ASICs (application-specific) and microprocessors (software-programmable) in the design spectrum, offering hardware-level parallelism and reconfigurability. The Artix-7 family is optimized for low power and cost at 28nm, targeting applications that require high performance per watt without the expense of high-end FPGAs. Key features of the XC7A50T-2CSG324I include 120 DSP48E1 slices for signal processing, 5 clock management tiles (CMTs) with MMCM and PLL, and support for various I/O standards including LVCMOS, LVDS, and HSTL. The -2 speed grade provides a balance of performance and power, with the device supporting configuration via JTAG, SPI, or BPI interfaces. The CSG324 package offers a compact footprint with 324 balls on a 0.8mm pitch, enabling dense PCB layouts. Architecturally, the Artix-7 fabric uses a 6-input look-up table (LUT) architecture with dedicated carry chains, making it efficient for both control logic and datapath designs. The integrated block RAM can be configured in various aspect ratios, and the DSP48E1 slices support multiply-accumulate operations essential for digital signal processing. The device also includes analog-to-digital converter (XADC) functionality for on-chip temperature and voltage monitoring. Typical applications include software-defined radio, motor control, industrial networking, and medical imaging. The combination of low power, moderate logic density, and transceiver-less design makes it suitable for cost-sensitive, high-volume applications where high-speed serial links are not required. When designing with this FPGA, careful attention must be paid to power supply decoupling on VCCINT, VCCBRAM, and VCCO rails, as well as proper configuration pin termination. The device supports partial reconfiguration, enabling dynamic updates to logic functions in the field.

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XC7A50T-2CSG325I - Artix-7 FPGA 150 I/O | AMD
XC7A50T-2CSG325I

XC7A50T-2CSG325I - Artix-7 FPGA 150 I/O | AMD

The AMD XC7A50T-2CSG325I is a member of the Artix-7 FPGA family, designed for cost-sensitive, high-volume applications requiring low power and high performance at 28nm. It features 52,160 logic cells, 150 user I/Os, and 2,764,800 bits of block RAM, all housed in a 324-ball CSBGA package. This device operates from a 1V core supply and supports industrial temperature ranges, making it suitable for a wide range of embedded and communications systems. An FPGA (Field-Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks and a hierarchy of reconfigurable interconnects that allow the same chip to implement different digital logic functions. FPGAs sit between microcontrollers and ASICs in the design spectrum, offering the flexibility of software with the parallelism of hardware. They are essential in applications where rapid prototyping, hardware acceleration, or in-field updates are required. Key features of the XC7A50T-2CSG325I include 150 user I/Os, 52,160 logic cells, and 2,764,800 bits of block RAM. The device also integrates an XADC block with an on-chip reference circuit (±1%), enabling on-chip monitoring of temperature and power supply rails without external active components. The -2 speed grade provides a balanced performance point for logic and I/O, while the industrial temperature grade (-I) ensures operation from -40°C to +100°C. Technically, the Artix-7 family is built on a 28nm high-k metal gate (HKMG) process, delivering the lowest power and cost at this node. The device supports various I/O standards, including LVCMOS, LVDS, and HSTL, and includes clock management tiles (CMTs) with MMCM and PLL blocks for robust clock generation. The XADC provides a 12-bit, 1 MSPS analog-to-digital converter, useful for system monitoring and control. Typical applications include motor control, industrial networking, software-defined radio, and video processing. The 150 I/Os and 324-ball package make it ideal for mid-density designs where board space is limited. The low power consumption of the Artix-7 family is particularly beneficial in battery-powered or thermally constrained systems. When designing with this device, ensure proper decoupling of the 1V core supply and follow AMD's power-on sequencing guidelines. The configuration bitstream can be stored in external SPI flash or loaded via JTAG, providing flexibility in system design.

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XC7A50T-2FG484I - 52,160-L Logic Artix-7 FPGA | AMD
XC7A50T-2FG484I

XC7A50T-2FG484I - 52,160-L Logic Artix-7 FPGA | AMD

The AMD XC7A50T-2FG484I is an Artix-7 field-programmable gate array (FPGA) with 52,160 logic elements, 250 I/O, and a 484-pin FBGA package. The supplied distributor data identifies the device as a 28 nm CMOS FPGA with a 1 V supply and 2,764,800 logic cells in the associated listing field; the exact interpretation of that field should be confirmed against the manufacturer datasheet. A field-programmable gate array is a programmable-logic semiconductor: configurable logic blocks, digital signal processing resources, block RAM, and programmable I/O are combined on one integrated circuit. An FPGA sits within the broader semiconductor and programmable-logic hierarchy, allowing parallel hardware functions to be implemented and revised without changing the PCB. This makes the Artix-7 family suitable for control, signal processing, communications, and embedded systems where parallel throughput and reconfigurability matter. The XC7A50T-2FG484I combines 52,160 logic elements with 2.64 Mbit embedded memory in the supplied comparison data. Its 484-pin FBGA package provides extensive board connectivity for high-speed interfaces and external memory. The “-2” speed designation and “I” temperature suffix are family ordering codes, but the verified excerpt does not provide complete timing, temperature, or power values; those parameters should be checked in the AMD datasheet before design release. The device is appropriate for industrial automation, robotics, embedded control, communications, instrumentation, and signal-processing designs. Its large I/O count is useful when a design combines multiple parallel buses, high-speed transceivers, DDR memory, clocks, and management signals. Compared with smaller FPGAs, the XC7A50T provides more parallel resources, but its 484-BBGA package requires careful PCB escape routing, thermal planning, and manufacturing control. A key design consideration is package complexity: the dense FBGA footprint demands via-in-pad or via-under-bump considerations, precise ball assignment, and validated manufacturing rules. Power, decoupling, clocking, configuration, and high-speed signal-integrity requirements also depend on the selected board stack-up and the exact I/O standards enabled. This page consolidates verified distributor specifications, package information, source links, and engineering-oriented selection guidance. It distinguishes confirmed values from parameters that require the manufacturer datasheet, avoiding invented electrical or lifecycle claims.

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XC7A50T-2FGG484I - Artix-7 FPGA, 250 I/O | AMD
XC7A50T-2FGG484I

XC7A50T-2FGG484I - Artix-7 FPGA, 250 I/O | AMD

The AMD XC7A50T-2FGG484I is an Artix-7 Field Programmable Gate Array (FPGA) from the cost-optimized 28nm family, offering 52,160 logic cells, 250 user I/Os, and 2,764,800 bits of block RAM in a 484-ball FBGA (FGG484) package. It operates from a 0.95V to 1.05V core supply and supports industrial temperature range (-40°C to +100°C). An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer after manufacturing to implement arbitrary digital logic functions. FPGAs sit within the broader category of programmable logic devices (PLDs), which are themselves a subset of application-specific integrated circuits (ASICs) but with the key advantage of reconfigurability. The Artix-7 family is positioned as the low-cost, high-performance-per-watt tier within the Xilinx 7-series, balancing logic density, DSP capability, and transceiver performance for cost-sensitive applications. Key features include 150 DSP48E1 slices for high-speed signal processing, 5 clock management tiles (CMTs) with MMCM and PLL, and support for multiple I/O standards including LVCMOS, LVDS, and HSTL. The device integrates analog mixed-signal (AMS) blocks for on-chip voltage and temperature monitoring. The FGG484 package provides a 23x23mm footprint with 1.0mm ball pitch, enabling moderate-density PCB designs without requiring advanced manufacturing processes. Architecturally, the Artix-7 fabric is built on a 28nm high-k metal gate (HKMG) process, delivering up to 2.9 Tb/s of aggregate I/O bandwidth. The configurable logic blocks (CLBs) contain 8 6-input LUTs and 16 flip-flops each, providing flexible logic implementation. The block RAM is organized as 36Kb dual-port blocks that can be cascaded or split into two independent 18Kb blocks, supporting various memory configurations. Typical applications include motor control, industrial networking, software-defined radio, medical imaging, and low-cost video processing. The 250 I/Os and 150 DSP slices make it well-suited for real-time signal processing and interface bridging. The industrial temperature grade ensures reliable operation in harsh environments. When designing with this device, ensure adequate decoupling on all power rails (VCCINT, VCCAUX, VCCO) and follow AMD's power-on sequencing requirements. The configuration bitstream can be stored in external SPI flash or loaded via JTAG, with support for multi-boot and fallback configurations.

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XC7A50T-2FT256I - 52,160 Logic Cell Artix-7 FPGA | AMD
XC7A50T-2FT256I

XC7A50T-2FT256I - 52,160 Logic Cell Artix-7 FPGA | AMD

The AMD Xilinx XC7A50T-2FT256I is an Artix-7 field-programmable gate array (FPGA) with 52,160 logic elements, 170 user I/O, and 2,764,800 total RAM bits in a 256-FTBGA package. It is designed for cost-sensitive, high-volume embedded systems requiring programmable logic, parallel interfaces, control, and signal processing. The verified distributor listing identifies it as a 256-LBGA FPGA, while the package nomenclature uses 256-FTBGA. An FPGA is a programmable semiconductor containing configurable logic blocks, programmable interconnect, block RAM, and input/output resources. Unlike a fixed-function application-specific integrated circuit, an FPGA permits logic changes through a programmable configuration while retaining the same board-level package and pin assignment. The Artix-7 family positions the XC7A50T between larger programmable-logic devices and lower-capacity FPGA options. The XC7A50T-2FT256I provides 52,160 logic elements, 4,075 logic array blocks according to the verified product description, 2,764,800 RAM bits, and 170 user I/O. These resources support control logic, data acquisition, protocol bridging, industrial automation, embedded vision, communications, and general-purpose accelerator designs. The exact speed grade, temperature grade, and complete timing specifications are identified by the part-number suffix and must be checked against the AMD Artix-7 datasheet. The 256-FTBGA package is a surface-mount ball-grid-array package intended for multilayer PCB designs. Because the device has many power, ground, configuration, and user-I/O balls, board layout, decoupling, thermal management, and high-speed routing are critical. AMD also provides package pinout files in TXT and CSV formats, with the format described by UG475. Typical implementations use XC7A50T-2FT256I in industrial controllers, camera and image-processing front ends, communication gateways, sensor fusion, test equipment, and embedded compute systems. Designers should use the package pinout file and device-specific constraints to validate every ball assignment, power rail, configuration interface, and I/O standard before fabrication. This page consolidates verified distributor references, package information, design constraints, and practical procurement guidance. It does not invent timing, electrical, lifecycle, or compliance values that were not present in the supplied data.

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XC7A75T - Artix-7 FPGA 75K Logic Cells, 6.6Gb/s | AMD
XC7A75T

XC7A75T - Artix-7 FPGA 75K Logic Cells, 6.6Gb/s | AMD

The AMD (Xilinx) XC7A75T is an Artix-7 family field-programmable gate array built on a 28nm HKMG process, providing 75,520 logic cells, 1,800 Kb of block RAM, 5 clock management tiles (each with an MMCM and PLL), 6 GTP transceivers rated to 6.6 Gb/s, and up to 285 user I/Os in packages such as the FGG484 (484-ball BGA) and FTG256 (256-ball BGA). An FPGA (Field-Programmable Gate Array) is a programmable logic device configured after manufacturing to implement arbitrary digital logic. Within the semiconductor hierarchy, FPGAs sit between ASICs and general-purpose processors, offering reconfigurability, parallel processing, and rapid prototyping. The Artix-7 family is AMD's lowest-power, lowest-cost 28nm FPGA line, optimized for highest performance per watt with integrated analog mixed-signal (AMS) capability. Key differentiating features include DSP48E1 slices for high-speed arithmetic, an XADC dual 12-bit ADC for on-chip temperature and voltage monitoring, support for LVCMOS, LVDS, and HSTL I/O standards, and GTP transceivers supporting PCIe, Gigabit Ethernet, and Serial RapidIO protocols. Architecturally, the device comprises configurable logic blocks (CLBs) of 6-input LUTs and flip-flops, column-based block RAM, and dedicated clocking fabric. The 28nm process reduces dynamic power versus older 40nm/65nm generations, while bitstream encryption protects IP. Configuration is supported via JTAG, SPI, or BPI flash. Typical applications include software-defined radio (baseband processing with high-speed ADC/DAC interfacing), motor control, medical imaging, and industrial networking where moderate logic density plus 6.6 Gb/s serial connectivity is required at low cost. Design tip: implement with the Vivado Design Suite, decouple each VCCO/VCCAUX pin with 100nF ceramics, and follow UG475/UG482 layout guidelines for transceiver routing. Pricing below reflects distributor data as of 2026-08-29.

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XC7A75T-1CS324I - 75,520-LE Artix-7 FPGA | AMD | Industrial
XC7A75T-1CS324I

XC7A75T-1CS324I - 75,520-LE Artix-7 FPGA | AMD | Industrial

The AMD XC7A75T-1CS324I is an Artix-7 field-programmable gate array with 75,520 logic elements, a 210 mm² die, and a 324-ball LFBGA package. The “-1” speed grade and industrial-temperature suffix are identified by the order code, while the verified distributor listing supplies the exact family, logic-cell, die-size, and package data. The device belongs to the FPGA and programmable-logic hierarchy, combining configurable digital logic, block RAM, DSP resources, programmable I/O, and high-speed serial transceivers. An FPGA is a semiconductor whose digital behavior is defined after manufacture by loading a configuration bitstream. Unlike a fixed-function application-specific integrated circuit, an FPGA can implement parallel processing, control logic, interfaces, and signal-processing pipelines in one integrated device. The Artix-7 family targets cost-sensitive embedded systems where programmable logic, processing throughput, and compact integration are more important than the very high performance associated with larger FPGA families. The verified listing identifies 75,520 logic elements, a 210 mm² die, 3,870,720 embedded-memory bits, a 324-LFBGA package, and a ball-terminal package format. Other technical details—including logic-cell composition, block-RAM and DSP counts, I/O counts, transceiver quantities, voltage rails, power consumption, and performance timing—were not included in the supplied excerpts and therefore require confirmation from AMD’s complete Artix-7 documentation. Typical uses for this device include industrial automation, motor and motion control, sensor acquisition, communications, embedded vision, test equipment, and digital signal processing. Parallel datapaths can accelerate filtering, control loops, protocol handling, and sensor fusion, while block RAM supports local buffering and DSP resources can implement fixed-point or floating-point arithmetic. A final design must still verify the exact Artix-7 resource mix, transceiver requirements, pin constraints, and timing against the selected board revision. A critical design step is assigning every external signal to the correct 324-ball package ball and obtaining the matching package pinout file before schematic capture. Designers should also verify configuration memory connections, bank supply voltages, decoupling, clocking, transceiver usage, and thermal performance. A bitstream compiled for the exact MPN should be validated on the intended hardware before production. This page consolidates the verified distributor identity, package information, sourcing links, comparison framework, and engineering cautions. It deliberately does not infer missing electrical or resource details, allowing engineers to distinguish confirmed facts from parameters that still require manufacturer-document review.

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XC7A75T-1FGG484I - 75,520-Cell Artix-7 FPGA | AMD
XC7A75T-1FGG484I

XC7A75T-1FGG484I - 75,520-Cell Artix-7 FPGA | AMD

AMD XC7A75T-1FGG484I is an Artix-7 field-programmable gate array with 75,520 logic cells, 285 I/O, 464 MHz performance, MMCM and PLL resources, and an FCBGA-484 package. The device operates from a 950 mV to 1.05 V core supply according to the verified distributor and manufacturer-family data. An FPGA is a reconfigurable semiconductor used to implement digital logic, signal processing, control, and communication functions after a design is loaded into programmable configuration memory. In the product hierarchy, the XC7A75T belongs to the Artix-7 FPGA family, combining programmable logic, fixed resources, high-speed I/O, block RAM, and clock-management circuitry in one surface-mount device. The XC7A75T provides 75,520 configurable logic cells and 285 I/O in the 484-ball FCBGA package. Its stated 464 MHz performance is useful for control logic, embedded processing, sensor aggregation, industrial communication, and general-purpose digital prototyping. Integrated MMCM and PLL resources support clock generation and phase-related functions required by high-speed interfaces and time-sensitive designs. The -1 ordering designation identifies the performance grade, while FGG484 identifies the 484-ball fine-pitch BGA package and I identifies the associated temperature-grade option. Because the verified results do not provide the complete device pin table, detailed electrical tables, power coefficients, or package dimensions, designers should confirm those values against the AMD Artix-7 documentation before release, safety qualification, or production control. Typical applications include industrial automation, embedded control, test and measurement, communications equipment, low-cost prototyping, and data-acquisition systems. The large I/O count allows multiple external interfaces to be connected, while MMCM and PLL resources help establish internal clock domains. The FCBGA-484 package requires careful PCB layout, thermal analysis, and assembly process control. A key design consideration is that its 484-ball BGA footprint provides extensive connectivity but demands advanced board-level design. Use manufacturer-provided package files, keep high-speed routes controlled, provide robust power and ground distribution, and verify BGA assembly capability with the selected PCB supplier. The -1 speed grade should be selected against the complete timing, power, and temperature requirements of the target design. This page consolidates the verified distributor specifications, package identity, source links, replacement considerations, and practical implementation guidance. It also distinguishes true package-compatible FPGA alternatives from parts with different ball counts or device resources, helping engineers narrow a replacement without overlooking bitstream, timing, and qualification constraints.

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XC7A75T-1FGG676C - 75,520-Cell Artix-7 FPGA | AMD
XC7A75T-1FGG676C

XC7A75T-1FGG676C - 75,520-Cell Artix-7 FPGA | AMD

AMD XC7A75T-1FGG676C is an Artix-7 field-programmable gate array with 75,520 programmable logic cells, 300 I/O, a 1 V supply range, and a 676-ball FBGA package. It is built on 28 nm CMOS technology and targets designs requiring dense programmable logic, high-speed digital processing, and flexible I/O without the cost and complexity of a larger FPGA family. The -1 designation identifies the device speed grade, while FGG676 identifies its 676-ball fine-pitch BGA package. An FPGA is a programmable digital semiconductor whose configurable logic blocks, routing fabric, block RAM, DSP resources, and I/O can be adapted to a wide range of digital functions. Within the semiconductor hierarchy, the XC7A75T is an Artix-7 FPGA, combining programmable logic, programmable I/O, embedded memory, DSP processing, clock management, and high-speed serial transceiver resources. This integration allows control, data acquisition, signal processing, and communication functions to be implemented in one device. Key features include 75,520 logic cells, 300 I/O, a 0.95 V to 1.05 V operating-voltage range, and operation up to 85 °C. The Artix-7 architecture uses 28 nm CMOS technology and supports clocking resources including MMCM and PLL blocks. Its combination of logic density, memory, DSP capability, and I/O availability makes it useful for industrial controls, test equipment, embedded processing, communications, and signal-processing systems. The device provides programmable logic blocks connected by an adaptive routing network, along with dedicated block RAM, DSP slices, clock-management resources, and high-speed I/O. The verified part data identifies a maximum clock frequency of 1098 MHz, although practical interface timing depends on the selected I/O standard, clock topology, speed grade, board implementation, and external components. Configuration, power sequencing, clocking, and decoupling must follow AMD guidance for the selected Artix-7 package. Typical applications include industrial automation controllers, programmable measurement systems, embedded video and image-processing pipelines, communication gateways, and digital signal-processing platforms. The 300 available I/O support interfaces to external converters, memory, transceivers, and control logic, while 75,520 logic cells provide substantial parallel-processing capacity. The integrated DSP and memory resources can accelerate filtering, waveform generation, and data-shaping functions. Designers should allocate the FBGA676 footprint and its ball grid carefully, provide stable power rails and high-quality decoupling, and follow the official Artix-7 package-pinout and PCB-design guidance. Clock inputs and high-speed interfaces require controlled impedance routing. Because FPGA routing and configuration affect timing closure, the final design must be validated with the appropriate AMD Vivado tools, device files, and timing constraints. This page consolidates verified device attributes, distributor sourcing information, strict same-package drop-in alternatives, application guidance, and design cautions. It also distinguishes exact ordering-code changes from true pin-compatible replacements so engineers can migrate a 676-ball Artix-7 design without overlooking speed grade or temperature-range differences.

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XC7A75T-1FGG676I - 75,520-Cell Artix-7 FPGA | AMD
XC7A75T-1FGG676I

XC7A75T-1FGG676I - 75,520-Cell Artix-7 FPGA | AMD

The AMD XC7A75T-1FGG676I is an Artix-7 field-programmable gate array (FPGA) with 75,520 logic cells, 300 I/O pins, 200 MHz maximum device performance, and a 676-ball FBGA package. It is a programmable digital semiconductor used to implement parallel logic, DSP processing, control functions, and high-speed interface logic in one reconfigurable device. The device is manufactured using 28 nm CMOS technology and operates from a 0.950 V to 1.05 V core supply according to the verified distributor and datasheet-search data. The “-1” speed designation identifies the target device performance grade, while “FGG676” identifies the 676-ball package configuration and “I” identifies the industrial temperature grade. The XC7A75T belongs to the Artix-7 FPGA family, a cost-optimized product line positioned between low-end programmable logic and higher-density programmable SoC devices. An FPGA is a reconfigurable digital integrated circuit whose internal logic blocks, programmable interconnect, block RAM, and DSP resources can be configured after manufacture. In the product hierarchy, an FPGA is a semiconductor and programmable logic device; the Artix-7 family provides a balance of logic density, performance-per-watt, DSP capability, and cost. The XC7A75T is larger than smaller Artix-7 devices while remaining within a 676-ball FBGA footprint that provides substantial I/O and power connectivity. Verified data identifies 75,520 logic cells, 300 I/O pins, MMCM and PLL resources, 200 MHz device performance, and a 1 V operating range for this part. These resources support parallel datapath designs, digital control, communications, signal processing, and embedded system control. The 300 available I/O pins are particularly useful when a design requires multiple buses, memory interfaces, high-speed transceivers implemented in fabric, or external peripheral connectivity. The MMCM and PLL resources allow designs to derive or distribute clock signals when the design requires controlled frequency relationships. The 28 nm CMOS implementation supports a compact, power-efficient solution for designs needing more parallel processing than discrete logic can provide. Configuration determines the implemented circuit, allowing design revisions and product-family flexibility without changing the PCB. In a prototype, the FPGA can support multiple functions concurrently, such as control logic, data acquisition, DSP filtering, and communication formatting. This integration reduces the number of separate programmable components, although the exact internal resource allocation depends on the selected design and tool configuration. Typical applications include industrial automation and factory control, robotics, communications infrastructure, instrumentation, medical monitoring, and embedded control systems. The XC7A75T is also appropriate for education, prototyping, and research environments where designers need access to a relatively high density of programmable logic and DSP resources. These uses benefit from parallel processing and the ability to implement multiple data paths without requiring a separate processor for every function. The key design consideration is package and power planning. A 676-ball FBGA device requires careful PCB layout, power delivery, thermal management, and high-density manufacturing capability. Designers should use the AMD package pinout files and the appropriate device documentation to verify ball assignments, decoupling, configuration interfaces, and I/O constraints. This page combines verified distributor specifications, pricing references where available, package information, and practical migration guidance for engineers evaluating the XC7A75T.

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XC7A75T-2CSG324I - 628 MHz Artix-7 FPGA | AMD
XC7A75T-2CSG324I

XC7A75T-2CSG324I - 628 MHz Artix-7 FPGA | AMD

AMD XC7A75T-2CSG324I is an Artix-7 field-programmable gate array with 75,520 logic cells, 210 I/O, a 628 MHz operating frequency, and a 324-LFBGA CSPBGA package. The -2CSG324I suffix identifies the device family, speed grade, CSG324 package, and industrial temperature option. This combination of programmable logic resources, parallel and serial interface capability, and a high-pin-count ball-grid package makes the device suitable for embedded processing, industrial control, communications, and test systems. An FPGA is a programmable semiconductor in the broader category of programmable logic devices. Unlike a fixed-function application-specific integrated circuit, an FPGA allows logic, interfaces, and signal-processing functions to be configured after manufacture. Within the product hierarchy, XC7A75T-2CSG324I is an Artix-7 FPGA, a member of the AMD Xilinx FPGA family and the broader field-programmable gate array category. The CSG324 package integrates 324 contacts in a compact surface-mount CSPBGA form. Key device features include 75,520 logic cells, 210 I/O, and a maximum stated operating frequency of 628 MHz for the -2 speed grade. The device also includes the clock-management resources and programmable logic expected in an Artix-7 FPGA. These resources allow parallel sensor acquisition, control logic, protocol bridging, DSP-oriented arithmetic, and external memory or communications interfaces to be consolidated in one programmable device rather than implemented across several fixed-function components. The -2 designation denotes a faster speed grade than the -1 option and a lower speed grade than the -3 option represented in the verified comparison data. The 324-CSG package preserves the same physical footprint across the listed XC7A75T variants, allowing design reuse when changing speed grade or temperature grade. Any substitution must still be checked for timing closure, pinout, power configuration, resource utilization, device identification, and intended operating-temperature requirements. Typical applications include industrial instrumentation, factory automation, communication gateways, embedded vision interfaces, low-power edge processing, and programmable logic test equipment. In these systems, the FPGA can implement acquisition pipelines, protocol state machines, digital signal processing, control interfaces, and boot or flash-control functions. The 210-I/O count is particularly useful when a design needs substantial parallel connectivity to sensors, converters, transceivers, and memory devices. Designers should complete timing analysis after selecting the final speed grade and should verify the power rails, decoupling, pin constraints, and configuration interface against the manufacturer datasheet. Replacing an existing CSG324 board with another XC7A75T grade may preserve the footprint, but it does not automatically preserve timing margins, temperature coverage, radiation-test status, or the exact power envelope. This page consolidates verified distributor specifications, same-family drop-in candidates, package information, and practical replacement guidance. The comparison material is intended to accelerate engineering selection while clearly separating confirmed values from parameters that still require verification from the manufacturer datasheet.

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XC7A75T-2FG484I - 75,520-LCELL Artix-7 FPGA | AMD | 484-BBGA
XC7A75T-2FG484I

XC7A75T-2FG484I - 75,520-LCELL Artix-7 FPGA | AMD | 484-BBGA

The AMD XC7A75T-2FG484I is an Artix-7 field-programmable gate array (FPGA) with 75,520 programmable logic cells, 285 I/O, 11,800 adaptive logic modules, and 3.69 Mbit of embedded memory, supplied in a 484-BBGA surface-mount package. The verified listing identifies a 1.0 V device and a -40°C to +100°C operating-temperature range. An FPGA is a programmable digital integrated circuit that combines configurable logic, memory, digital signal processing, and parallel I/O within one semiconductor. Artix-7 belongs to AMD's 7-series FPGA family and targets compact systems requiring substantial parallel processing, flexible interfaces, hardware acceleration, or programmable control without the resource level of a larger FPGA. Its logic density makes it useful between small microcontroller-class devices and high-end programmable logic systems. The verified specifications identify 75,520 logic cells and 285 I/O in a 484-BBGA package. The related package-file result confirms that Artix-7 package pinout files are available in ASCII TXT and CSV formats, enabling board-level design and signal verification. The package data also associates this device with a 1.0 V supply and an extended -40°C to +100°C temperature range, making it suitable for industrial and embedded environments when the complete electrical and timing requirements are satisfied. Typical uses include industrial automation, embedded control, parallel data acquisition, communications, test equipment, and hardware-assisted signal processing. The FPGA can implement multiple digital functions in parallel, such as interfaces, state machines, protocol handling, counters, and custom processing pipelines. The 484-BBGA package requires careful ball-escape routing, multilayer PCB construction, controlled power delivery, and thermal analysis; it is not a simple through-hole or two-pin package. Designers should use AMD's package pinout files and Artix-7 datasheet to verify every ball assignment, power rail, decoupling requirement, and configuration connection. A power rail must meet the specified voltage and sequencing requirements, and unused balls must be handled exactly as directed by the manufacturer. Confirm the complete device configuration, supported I/O standards, speed grade, and industrial-temperature requirements before release. This product page consolidates verified distributor pricing and availability, package information, practical FPGA design notes, and qualified comparison fields. Values not present in the supplied source data remain explicitly marked for validation rather than being guessed.

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XC7A75T-2FT256I - 75K Logic Cell Artix-7 FPGA | AMD
XC7A75T-2FT256I

XC7A75T-2FT256I - 75K Logic Cell Artix-7 FPGA | AMD

The AMD XC7A75T-2FT256I is an Artix-7 field-programmable gate array with 3,870,720 RAM bits, a -2 performance grade, and an industrial temperature designation in a 256-FTBGA package. The supplied data identifies a 17 x 17 mm package and tray packaging, making it a high-density programmable logic option for embedded control, signal processing, communications, and industrial automation systems. Its exact logic-cell count, I/O count, voltage ratings, and timing figures are not stated in the verified snippets and therefore remain marked as data needed. An FPGA is a semiconductor device whose programmable logic, memory, and I/O resources can be configured after manufacture. Artix-7 belongs to the AMD/Xilinx FPGA product hierarchy and uses a 28 nm process platform, as described on the verified AMD Artix-7 product page. Within the broader category of programmable logic devices, the XC7A75T family is positioned between smaller control-oriented devices and larger communications or processing devices. The XC7A75T-2FT256I combines a 3,870,720-bit memory resource with a compact 256-ball package for designs requiring substantial configurable logic in a relatively small board area. The verified listing supplies the product identity as an Artix-7 FPGA IC with 170, 3,870,720, 75,520, and 256-LBGA attributes, while the detailed product result describes a 256-FTBGA package. These numbers should not be conflated without the manufacturer pinout and device-selection documentation. The -2 suffix denotes the requested speed grade in the ordering nomenclature, but the verified material does not provide operating frequencies or timing margins. The exact performance grade limits, I/O standards, block RAM organization, DSP resources, configuration interface, and power characteristics require manufacturer datasheet verification before schematic capture or timing closure. This device is suitable for industrial control logic, sensor acquisition, motor-control interfaces, low- and medium-speed communications, test equipment, and embedded instrumentation. A design team can use programmable fabric for parallel interfaces, state machines, protocol handling, and control paths while using block RAM for buffering and DSP slices for selected arithmetic operations. The industrial temperature result covers -40°C to 100°C junction temperature according to the supplied distributor data, but temperature behavior still depends on the final system power dissipation, airflow, board construction, and selected FPGA grade. For implementation, preserve the exact 256-FTBGA land pattern, ball assignments, power rails, decoupling requirements, configuration pins, and I/O-bank constraints defined by AMD. Do not substitute a visually similar 256-ball package without checking the official package files and UG475 pinout documentation. Configuration storage, startup behavior, clocking, JTAG access, and bitstream generation should be validated in AMD Vivado or another explicitly supported FPGA toolchain. A common engineering pitfall is treating a distributor similarity result as proof of interchangeability; FPGA replacement requires exact package, pin, speed, temperature, resource, and bitstream compatibility. This page consolidates the verified distributor identity, package information, public AMD family description, package-pinout references, and practical selection considerations. It distinguishes confirmed data from parameters that require confirmation, helping engineers evaluate sourcing, footprint matching, and migration risk before committing to a 256-FTBGA FPGA layout.

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XC7A75T-3CSG324E - Artix-7 210-I/O FPGA | AMD
XC7A75T-3CSG324E

XC7A75T-3CSG324E - Artix-7 210-I/O FPGA | AMD

The AMD XC7A75T-3CSG324E is an Artix-7 field-programmable gate array with 75,520 logic cells, 210 user I/O, and a maximum switching frequency of 628 MHz, supplied in a 324-LFBGA CSPBGA package. Its core voltage range is 950 mV to 1.05 V. The -3 speed designation identifies the performance grade, while the CSG324 suffix identifies the 324-ball package configuration. An FPGA is a reconfigurable digital semiconductor in which programmable logic blocks, memory, and I/O resources implement custom digital systems after fabrication. Artix-7 belongs to the broader FPGA and programmable-logic hierarchy, combining parallel programmable logic with digital signal processing, clock management, block RAM, and high-speed serial transceivers. This makes the device suitable when design flexibility is more important than the power efficiency of a fixed-function ASIC. The XC7A75T provides 75,520 logic cells and 210 I/O in one compact package. Its 628 MHz maximum switching frequency supports demanding control, acquisition, communications, and embedded-processing designs. The 324-LFBGA configuration also exposes substantially more interconnect and I/O resources than the smaller Artix-7 packages, making it appropriate for board-level designs that need multiple high-speed interfaces and external memory connections. The device contains mixed resources rather than only general-purpose gates. Depending on the selected Artix-7 configuration, these can include dedicated block RAM, digital signal processing slices, clock-management resources, and high-speed transceivers. This heterogeneous architecture allows parallel data paths, time-domain functions, packet handling, and control logic to share one programmable device, reducing the number of supporting ICs on a complex board. Typical uses include industrial automation, test and measurement, communication equipment, embedded instrumentation, and high-speed digital control. The 210-I/O count is particularly useful for parallel sensor interfaces, memory buses, board-level control, and multi-channel acquisition. Designers must still account for speed grade, temperature grade, power budgeting, pin constraints, and the high pin count when laying out the BGA PCB. A critical implementation consideration is the CSG324 BGA footprint. Its 0.8 mm ball pitch requires a constrained-layer PCB, precise component placement, appropriate escape routing, and careful via-in-pad or fanout strategy. Power delivery must also support the 950 mV to 1.05 V core range while keeping each supply rail within its published limits. This page combines the verified distributor and manufacturer information for the XC7A75T-3CSG324E with same-package family alternatives, comparison parameters, application guidance, and practical PCB considerations. It distinguishes confirmed values from specifications that still require verification against the complete manufacturer datasheet.

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XC7A75T-3FGG484E - Artix-7 FPGA, 75520 Logic Cells, 285 I/O | AMD
XC7A75T-3FGG484E

XC7A75T-3FGG484E - Artix-7 FPGA, 75520 Logic Cells, 285 I/O | AMD

The AMD Xilinx XC7A75T-3FGG484E is an Artix-7 field-programmable gate array (FPGA) with 75,520 logic cells, 285 user I/O pins, and a maximum clock frequency of 628 MHz, housed in a 484-ball FBGA (FGG484) surface-mount package. It is built on the 28 nm Xilinx 7 series FPGA fabric, delivering high performance-per-watt logic capacity for cost-sensitive, small form factor designs. An FPGA is a programmable logic device: a semiconductor whose internal array of configurable logic blocks, block RAM, DSP slices, and I/O banks is re-programmed by the user to implement any digital circuit from a hardware description written in Verilog or VHDL. In the product hierarchy, an FPGA sits above a CPLD: FPGAs offer far higher logic density, dedicated hard multipliers, high-speed serial transceivers, and memory resources, while CPLDs are simpler, lower-capacity devices. The Artix-7 family occupies the cost-optimized tier of the Xilinx 7 series, below the Kintex-7 and Virtex-7 performance tiers, and above the small Zynq-7000 SoCs with integrated ARM processors. The "-3" in the part number is the speed grade, indicating the maximum operating performance class of the device, while the trailing "E" designates the extended commercial temperature qualification. The FGG484 package is a 17 x 17 mm, 0.8 mm-pitch flip-chip BGA that supports up to 285 user I/O in the FGG484 configuration. Compared with the larger FGG676 and FF676 packages, FGG484 trades I/O count for a smaller board footprint, which is attractive for compact industrial, communications, and test-and-measurement equipment. Because the device is SRAM-based, configuration data must be loaded at every power-up from a flash PROM, SPI flash, or a host processor such as a Zynq or MicroBlaze. AMD supplies the Artix-7 package pinout files in ASCII and CSV formats per UG475, which are the authoritative reference for board-level symbol generation and ball assignment. Typical applications for the XC7A75T-3FGG484E include industrial Ethernet and serial protocol bridges, data acquisition and control systems, video timing and scaler pipelines, instrumentation and test equipment, and low-cost embedded processing subsystems with an external host processor. Its 484-ball FBGA also makes it a natural fit for multi-die mixed-signal boards where a mid-density FPGA handles protocol conversion and local buffering. A key design consideration is power and thermal budget: a 28 nm Artix-7 device dissipating several watts in a 17 x 17 mm BGA requires careful via-in-pad and copper-pour thermal design on the PCB, and the specified junction temperature limits of the -3E grade must be respected with margin. When a smaller footprint is acceptable, the FGG484 package is often paired with a companion XC7A50T or XC7A35T device on the same board to split protocol and DSP workloads without changing the PCB footprint family. This page consolidates distributor pricing as of 2026-10-30, same-package drop-in alternatives drawn from the Artix-7 and Kintex-7 families, a parameter-by-parameter comparison, and practical board-level design guidance that is not reproduced in the manufacturer datasheet.

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XC7A75T-3FGG676E - 75,520-Cell Artix-7 FPGA | AMD
XC7A75T-3FGG676E

XC7A75T-3FGG676E - 75,520-Cell Artix-7 FPGA | AMD

AMD XC7A75T-3FGG676E is an Artix-7 field-programmable gate array with 75,520 logic cells, 28 nm CMOS technology, a 1 V supply, 300 user I/Os, and a 676-pin FBGA package. It combines programmable logic resources with high-speed parallel I/O in a package designated FGG676, supplied in a tray according to the verified distributor data. An FPGA is a programmable logic device in the semiconductor hierarchy. Its configurable logic blocks, block RAM, programmable I/O, and dedicated resources allow engineers to implement digital systems that would otherwise require combinations of fixed-function ICs. Artix-7 belongs to the FPGA and CPLD family of programmable logic devices, positioned between simpler programmable logic and larger system-on-chip devices. The XC7A75T provides 75,520 logic cells and 300 user I/Os. Its 28 nm CMOS process supports a 1 V operating supply, while the -3 ordering designation identifies the performance grade of this device. The FGG676 package provides 676 package balls and, according to the verified source, uses a 1.0 mm ball pitch on a 27 mm square footprint. These characteristics make the device suitable for designs requiring substantial parallel connectivity. The device is intended for industrial, communications, instrumentation, embedded processing, and high-speed digital interface applications. A representative implementation could use configurable logic for protocol conversion, embedded RAM for buffering, and programmable I/O for acquisition or control interfaces. Because the exact resources for each Artix-7 speed and package combination are organized by device variant, engineers should confirm the applicable Artix-7 data sheet and package files during design review. The extended-temperature order suffix E makes this part relevant to designs requiring operation beyond the usual commercial temperature envelope, but the exact junction and ambient limits must be selected from the manufacturer ordering guide. Commercial, industrial, and extended-temperature variants can share a package while differing in qualification and temperature requirements. A critical hardware consideration is that the 676-ball FBGA package has a fine 1.0 mm ball pitch. PCB escape routing must be designed with the manufacturer package symbol, differential-pair geometry, power planes, and via requirements taken directly from the package design files. Thermal performance also depends on multilayer construction, copper distribution, airflow, and the adjacent heat-spreader or thermal-interface strategy. This page consolidates verified package, process, logic-cell, I/O, and sourcing information while explicitly separating unavailable electrical details. It also provides same-family migration comparisons, practical PCB guidance, and a structured selection framework for engineers evaluating the XC7A75T-3FGG676E against other Artix-7 speed, temperature, and package options.

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XC7K160T-2FFG676I - Kintex-7 FPGA 162K Logic Cells | AMD
XC7K160T-2FFG676I

XC7K160T-2FFG676I - Kintex-7 FPGA 162K Logic Cells | AMD

The AMD XC7K160T-2FFG676I is a Kintex-7 family Field Programmable Gate Array (FPGA) delivering 162,240 logic cells, 400 user I/Os, and 11,980,800 bits of block RAM in a 676-ball FCBGA package. It operates over the industrial temperature range of -40°C to +100°C and is lead-free / RoHS compliant. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the designer after manufacturing, enabling custom digital logic implementations without the cost and lead time of ASIC development. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), which range from simple CPLDs to high-capacity FPGAs, and are essential in applications requiring parallel processing, rapid prototyping, and field-updatable hardware. Key features of the XC7K160T-2FFG676I include the -2 speed grade, which balances performance and power consumption, and the FFG676 package that supports easy migration between Kintex-7 family members. The device provides 400 user I/Os, 10 clock management tiles (CMTs) with MMCM and PLL, and 600 DSP slices for high-throughput signal processing. Its 36 Kb block RAM blocks total 11,980,800 bits, enabling substantial on-chip data storage. Architecturally, the Kintex-7 series is built on a 28 nm high-k metal gate (HKMG) process, offering a strong balance of performance, power, and cost. The -2 speed grade provides a middle ground between the higher-performance -3 and the lower-power -1L/-2L variants. The device supports a wide range of I/O standards, including LVCMOS, LVDS, and HSTL, and includes integrated PCIe, Gigabit transceivers, and DDR3/DDR4 memory interfaces. Typical applications include high-performance signal processing, software-defined radio, medical imaging, aerospace and defense systems, and wired communications. The 400 I/Os and 162K logic cells make it suitable for complex digital designs requiring substantial parallel processing and connectivity. When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The FCBGA package requires a well-designed PCB with adequate thermal vias and a solid ground plane to ensure reliable operation at industrial temperatures.

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XC7K160T-3FFG676E - Kintex-7 FPGA 162K Cells | AMD
XC7K160T-3FFG676E

XC7K160T-3FFG676E - Kintex-7 FPGA 162K Cells | AMD

The AMD XC7K160T-3FFG676E is a high-performance Kintex®-7 Field Programmable Gate Array (FPGA) from the Kintex-7 family, fabricated on a 28nm process technology. It features 162,240 logic cells, 400 user I/O pins, and 11,980,800 bits of block RAM, all housed in a 676-ball FCBGA (27x27mm) package. This device is the -3 speed grade, the highest performance option in the Kintex-7 lineup, offering maximum clock frequencies and throughput for demanding applications. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement any digital logic function. Unlike fixed-function ASICs, FPGAs contain a fabric of programmable logic blocks, interconnects, and I/O elements that can be reprogrammed in the field, making them ideal for prototyping, high-performance computing, and applications requiring hardware flexibility. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), which also includes CPLDs, and are a key component in the semiconductor industry for accelerating workloads that benefit from parallel processing. Key features of the XC7K160T-3FFG676E include 400 user I/O pins supporting various I/O standards, 11,980,800 bits of block RAM for on-chip data storage, and 400 DSP slices for high-speed digital signal processing. The -3 speed grade provides the highest performance, with internal clock speeds exceeding 600 MHz. The device also supports PCIe® Gen2, Gigabit Ethernet, and other high-speed serial transceivers, making it suitable for a wide range of communication and processing tasks. Technically, the Kintex-7 family is optimized for best price-performance, offering a 2X improvement over the previous generation. The 28nm high-k metal gate (HKMG) process technology enables low power consumption while maintaining high logic density. The device includes advanced clock management tiles (CMTs) with PLLs and MMCMs for precise clock generation, and supports partial reconfiguration for dynamic logic updates. Typical applications include software-defined radio (SDR), medical imaging, aerospace and defense systems, and high-performance computing. The XC7K160T-3FFG676E is particularly well-suited for applications requiring high-speed data processing, such as radar signal processing and video/image processing, where its combination of logic density, DSP capability, and high-speed transceivers provides a competitive advantage. When designing with this device, ensure proper power supply decoupling on VCCINT, VCCAUX, and VCCO rails, and follow AMD's recommended PCB layout guidelines for high-speed signals. The device requires a 1.0V core voltage (VCCINT) and supports various I/O bank voltages (VCCO) depending on the interface standard.

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XC7K325T-1FBG676C - Kintex-7 FPGA 326K Logic Cells | AMD
XC7K325T-1FBG676C

XC7K325T-1FBG676C - Kintex-7 FPGA 326K Logic Cells | AMD

The AMD XC7K325T-1FBG676C is a high-performance Kintex-7 Field Programmable Gate Array (FPGA) built on 28nm technology, offering 326,080 logic cells and 400 user I/Os in a 676-ball FCBGA package. It operates from a 1.0V core voltage and supports mainstream standards like PCIe, making it a cost-effective choice for high-bandwidth applications. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer after manufacturing to implement any digital logic function. FPGAs sit between ASICs (application-specific) and microprocessors (fixed-function) in the design hierarchy, offering reconfigurability and parallel processing. The Kintex-7 family is optimized for price/performance/watt, balancing logic density, DSP capability, and transceiver performance for mid-range to high-end applications. Key features include 400 I/O pins, 16,404,480 bits of block RAM, and 326,080 logic cells. The device supports multiple speed grades (-1, -2, -3) and includes hardened blocks for PCIe, Gigabit Ethernet, and DDR3 memory controllers. The 676-ball FCBGA package provides excellent thermal and electrical performance for high-speed designs. Architecturally, the Kintex-7 uses a 6-input look-up table (LUT) fabric with dedicated carry chains, DSP48E1 slices for multiply-accumulate operations, and configurable block RAM. The device integrates Clock Management Tiles (CMTs) with MMCM and PLL for precise clock generation. The 28nm HPL process enables low static power while maintaining high performance. Typical applications include software-defined radio, high-performance computing, video processing, and aerospace/defense systems. The device's high DSP ratio and transceiver capabilities make it ideal for signal processing and data acquisition. Its support for PCIe Gen2 and DDR3 simplifies system integration. When designing with this FPGA, careful attention to power supply decoupling and thermal management is essential. The core voltage must be maintained within 0.97V to 1.03V, and the FCBGA package requires a proper thermal solution for high utilization designs.

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XC7K325T-1FF676I - Kintex-7 FPGA 326K Logic Cells | AMD
XC7K325T-1FF676I

XC7K325T-1FF676I - Kintex-7 FPGA 326K Logic Cells | AMD

The AMD XC7K325T-1FF676I is a high-performance Kintex-7 Field Programmable Gate Array (FPGA) fabricated on a 28nm process technology. It features 326,080 logic cells, 400 I/O pins, and 16,404,480 bits of block RAM, all housed in a 676-ball FCBGA package. This device operates with a core voltage of 1V and supports a wide range of I/O standards, making it suitable for demanding applications in aerospace, defense, automotive, and industrial sectors. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks and interconnects that can be reprogrammed to implement any digital logic function. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), which are part of the semiconductor integrated circuit family. This flexibility allows engineers to prototype, iterate, and deploy custom hardware solutions without the high upfront costs of ASIC development. Key features of the XC7K325T-1FF676I include its 326,080 logic cells, which provide substantial capacity for complex digital designs. The device also integrates 840 DSP slices for high-speed digital signal processing, and 16,404,480 bits of block RAM for on-chip data storage. With 400 user I/O pins, it offers extensive connectivity options. The -1 speed grade indicates a balanced performance level, suitable for a wide range of applications without the higher power consumption of faster grades. Technically, the Kintex-7 family is built on AMD's 28nm high-k metal gate (HKMG) process, offering an optimal balance of performance, power, and cost. The device supports PCIe Gen3, 10 Gigabit Ethernet, and other mainstream standards, making it a versatile choice for system integration. The FCBGA-676 package provides excellent thermal and electrical characteristics, with a square body and ball grid array terminals for reliable surface-mount assembly. Typical applications include software-defined radio, high-performance computing, medical imaging, and wired/wireless communications infrastructure. The XC7K325T's high DSP ratio and cost-effective packaging make it particularly well-suited for signal processing and data-intensive tasks. Its support for mainstream standards like PCIe Gen3 and 10 Gigabit Ethernet simplifies integration into existing systems. When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The device requires multiple supply rails (1V core, 1.8V and 3.3V I/O), and proper sequencing is essential. Adequate PCB layout with sufficient copper planes and decoupling capacitors is critical to ensure reliable operation at high speeds.

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XC7K325T-1FFG676C - Kintex-7 FPGA 326K Cells | AMD
XC7K325T-1FFG676C

XC7K325T-1FFG676C - Kintex-7 FPGA 326K Cells | AMD

The AMD XC7K325T-1FFG676C is a high-performance Kintex-7 Field Programmable Gate Array (FPGA) fabricated on a 28nm process, offering 326,080 logic cells, 400 user I/Os, and 16,404,480 bits of block RAM in a 676-pin FCBGA package. It operates from a 1.0V core supply (0.97V to 1.03V range) and supports mainstream standards including PCIe Gen3 and 10 Gigabit Ethernet. A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement arbitrary digital logic functions. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), which are a subset of application-specific integrated circuits (ASICs) but offer reconfigurability. The Kintex-7 family is positioned as the best price/performance/watt balance in the 7-series, bridging the gap between the low-cost Artix-7 and the high-end Virtex-7. Key features include 840 DSP48E1 slices for high-throughput signal processing, 500 MHz maximum clock frequency, and support for DDR3 memory interfaces. The device integrates 10.3 Gbps transceivers (GTX) for high-speed serial communication, and includes hardened blocks for PCIe Gen3 and 10G Ethernet MAC. The -1 speed grade provides a balanced performance point, while the C temperature grade supports commercial operation from 0°C to 85°C. Architecturally, the Kintex-7 uses a 6-input look-up table (LUT) fabric with 203,800 LUTs, organized into configurable logic blocks (CLBs). The device includes 10 clock management tiles (CMTs) with mixed-mode clock managers (MMCMs) and phase-locked loops (PLLs) for flexible clock generation. The 28nm high-k metal gate (HKMG) process technology delivers up to 50% lower power than previous generations while maintaining high logic density. Typical applications include software-defined radio, high-performance computing acceleration, video and image processing, and wired communications infrastructure. The 400 I/Os support a wide range of I/O standards including LVCMOS, LVDS, and HSTL, making it versatile for board-level integration. When designing with this device, careful attention to power supply decoupling is essential. The core voltage must be regulated to 1.0V with adequate bypass capacitance, and the configuration bitstream must be loaded from an external SPI flash or via JTAG. Thermal management is critical at high utilization; a heatsink or forced airflow is recommended for sustained operation above 50% logic utilization.

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XC7K325T-2FBG676C - Kintex-7 FPGA 326K Logic Cells | AMD
XC7K325T-2FBG676C

XC7K325T-2FBG676C - Kintex-7 FPGA 326K Logic Cells | AMD

The AMD XC7K325T-2FBG676C is a high-performance Kintex-7 Field Programmable Gate Array (FPGA) from the 7 series family, built on advanced 28nm process technology. It delivers 326,080 logic cells, 400 user I/Os, and 16,404,480 total RAM bits, packaged in a 676-ball FCBGA (27x27 mm) with a lidless design. This device operates over a commercial temperature range of 0°C to 85°C (TJ) and supports core voltages around 1V, making it a versatile choice for a wide range of high-bandwidth and signal processing applications. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks, configurable I/O, and routing resources that can be programmed to implement any digital logic function. The Kintex-7 family sits in the mid-range of the 7 series, balancing logic capacity, DSP slices, and transceiver performance to address applications from cost-sensitive, high-volume systems to ultra high-end connectivity and signal processing. This places the XC7K325T within the hierarchy of FPGA -> programmable logic device -> integrated circuit -> semiconductor. Key features of the XC7K325T-2FBG676C include 400 user I/O pins, 25475 Configurable Logic Blocks (CLBs), and 326,080 logic elements/cells. The device also integrates 16,404,480 bits of block RAM, enabling substantial on-chip data storage for buffering and processing. The -2 speed grade offers a balanced performance point, with the -3 grade being the highest performance and -1/-1L for lower power. The 676-FCBGA package provides a compact footprint while supporting the high pin count required for parallel interfaces and memory controllers. From a technical architecture perspective, the Kintex-7 family is built on a 28nm high-k metal gate (HKMG) process, offering a strong price/performance/watt ratio. The device includes hardened blocks such as DSP48E1 slices for high-speed arithmetic, and supports mainstream standards like PCIe Gen3 and 10 Gigabit Ethernet via its high-speed transceivers. The lidless FCBGA package aids in thermal management, allowing direct heatsink attachment for improved heat dissipation in high-power designs. Typical applications for the XC7K325T-2FBG676C include software-defined radio, high-performance computing, medical imaging, and aerospace/defense systems. Its combination of logic density, DSP capability, and I/O count makes it suitable for implementing complex digital signal processing chains, protocol bridging, and parallel processing architectures. The device is also commonly used in development boards like the QMTECH XC7K325T for prototyping and algorithm validation. When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The device requires multiple supply rails (VCCINT, VCCAUX, VCCO) with appropriate filtering, and the lidless package should be paired with a suitable heatsink for applications exceeding moderate power dissipation. Refer to the AMD 7 Series FPGAs datasheet and UG475 for detailed pinout and power requirements.

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XC7K325T-2FFG676I - Kintex-7 FPGA 326K Logic Cells | AMD
XC7K325T-2FFG676I

XC7K325T-2FFG676I - Kintex-7 FPGA 326K Logic Cells | AMD

The AMD XC7K325T-2FFG676I is a high-performance Kintex-7 Field Programmable Gate Array (FPGA) fabricated on a 28nm process, offering an optimal balance of price, performance, and power for a wide range of applications. It features 326,080 logic cells, 400 user I/Os, and 16,404,480 bits of block RAM, all housed in a 676-ball FCBGA package. This device supports mainstream standards such as PCIe Gen3 and 10 Gigabit Ethernet, making it a versatile choice for high-speed serial connectivity and data processing. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks and a hierarchy of reconfigurable interconnects that allow the hardware to be customized to perform specific functions. This flexibility makes FPGAs ideal for prototyping, low-to-mid volume production, and applications requiring hardware acceleration or frequent design updates. The Kintex-7 family sits within the broader FPGA hierarchy, offering a balance between the cost-optimized Artix-7 and the high-performance Virtex-7 families. Key features of the XC7K325T-2FFG676I include 840 DSP slices for high-throughput digital signal processing, 500 I/O pins (400 user I/Os), and support for a core voltage of 0.97V to 1.03V. The device operates at a maximum frequency of 470.37 MHz and includes advanced clock management tiles (CMTs) with MMCM and PLL for precise clock generation. The -2 speed grade provides a strong balance between performance and power consumption, making it suitable for a wide range of high-speed applications. Technically, the Kintex-7 architecture integrates a 28nm high-k metal gate (HKMG) process, enabling high logic density and low power. The device includes hardened memory controllers, high-speed transceivers, and PCIe blocks, reducing the need for external components and simplifying system design. The 676-ball FCBGA package offers excellent thermal and electrical performance, supporting the high I/O count and high-speed interfaces required for demanding applications. Typical applications include software-defined radio, high-performance computing, medical imaging, and aerospace and defense systems. The device's high DSP ratio and support for 10G Ethernet make it particularly well-suited for signal processing and high-throughput data acquisition. Its cost-effective packaging and mainstream standard support also make it a popular choice for communications infrastructure and test and measurement equipment. When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The core voltage must be maintained within the specified range, and adequate cooling should be provided to keep the junction temperature within limits. The device's configuration interface should be planned early in the design to ensure reliable programming and reconfiguration.

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