XC7A75T-3FGG676E - 75,520-Cell Artix-7 FPGA | AMD
MPN: XC7A75T-3FGG676E ✓ AktifXC7A75T-3FGG676E Ringkasan
An FPGA is a programmable logic device in the semiconductor hierarchy. Its configurable logic blocks, block RAM, programmable I/O, and dedicated resources allow engineers to implement digital systems that would otherwise require combinations of fixed-function ICs. Artix-7 belongs to the FPGA and CPLD family of programmable logic devices, positioned between simpler programmable logic and larger system-on-chip devices.
The XC7A75T provides 75,520 logic cells and 300 user I/Os. Its 28 nm CMOS process supports a 1 V operating supply, while the -3 ordering designation identifies the performance grade of this device. The FGG676 package provides 676 package balls and, according to the verified source, uses a 1.0 mm ball pitch on a 27 mm square footprint. These characteristics make the device suitable for designs requiring substantial parallel connectivity.
The device is intended for industrial, communications, instrumentation, embedded processing, and high-speed digital interface applications. A representative implementation could use configurable logic for protocol conversion, embedded RAM for buffering, and programmable I/O for acquisition or control interfaces. Because the exact resources for each Artix-7 speed and package combination are organized by device variant, engineers should confirm the applicable Artix-7 data sheet and package files during design review.
The extended-temperature order suffix E makes this part relevant to designs requiring operation beyond the usual commercial temperature envelope, but the exact junction and ambient limits must be selected from the manufacturer ordering guide. Commercial, industrial, and extended-temperature variants can share a package while differing in qualification and temperature requirements.
A critical hardware consideration is that the 676-ball FBGA package has a fine 1.0 mm ball pitch. PCB escape routing must be designed with the manufacturer package symbol, differential-pair geometry, power planes, and via requirements taken directly from the package design files. Thermal performance also depends on multilayer construction, copper distribution, airflow, and the adjacent heat-spreader or thermal-interface strategy.
This page consolidates verified package, process, logic-cell, I/O, and sourcing information while explicitly separating unavailable electrical details. It also provides same-family migration comparisons, practical PCB guidance, and a structured selection framework for engineers evaluating the XC7A75T-3FGG676E against other Artix-7 speed, temperature, and package options.
Pilihan pengganti yang segera untuk XC7A75T-3FGG676E — sama paket, pin-pin kompatibel. Bahagian paket yang berbeza memerlukan kerja ulang PCB diasingkan.
XC7A75T-1FGG676E
✅ Masuk Drop-In ⚠️ Spesifikasi Tidak Disahkan📋 Alternatif rujukan (tidak dalam katalog)
XC7A75T-2FGG676E
✅ Masuk Drop-In ⚠️ Spesifikasi Tidak Disahkan📋 Alternatif rujukan (tidak dalam katalog)
XC7A75T-3FGG676C
✅ Masuk Drop-In ⚠️ Spesifikasi Tidak Disahkan📋 Alternatif rujukan (tidak dalam katalog)
XC7A75T-2FGG676I
✅ Masuk Drop-In📋 Alternatif rujukan (tidak dalam katalog)
XC7A75T-1FGG676C
✅ Masuk Drop-InHubungi untuk harga
Lihat Datasheet →XC7A75T-3FGG676E Penilaian maksimum & Ciri-ciri Elektrik
| Device Type | Artix-7 Field Programmable Gate Array (FPGA) |
| Logic Cells | 75,520 cells |
| Technology | 28 nm CMOS |
| Core Supply Voltage | 1 V |
| User I/O Count | 300 I/Os |
| Kemasan | 676-pin FBGA (FGG676) |
| Package Ball Count | 676 balls |
| Ball Pitch | 1.0 mm |
| Package Length | 27 mm |
| Package Width | 27 mm |
| Package Shape | Square |
| Performance Grade | -3 |
| Temperature Grade Suffix | E |
| Shipping Package | Tray |
| Jenis Pemasangan | Surface Mount |
| Programmable Logic Type | FPGA |
| I/O Architecture | Selectable I/O standards |
Panduan Konfigurasi Pin XC7A75T-3FGG676E tray
Konfigurasi pin untuk XC7A75T-3FGG676E (tray pakai). IC digital ini termasuk GPIO, antaramuka komunikasi (UART, SPI, I2C), dan pin kuasa. Rujuk dokumen pengeluar untuk fungsi pin alternatif dan opsi konfigurasi. Biasa digunakan dalam rancangan sistem ter嵌入式 dan PCB.
Tiada data garisan pin yang diperoleh untuk XC7A75T-3FGG676E.
Rujuk kepada lembaran data untuk konfigurasi pin penuh.
Aplikasi Biasa
XC7A75T-3FGG676E patut untuk 6 aplikasis: Industrial Control and Automation, Communications and Protocol Conversion, Test and Measurement Equipment, Video and Image Processing, Embedded Processing and Data Acquisition, Aerospace and Defense-Support Logic.
Industrial Control and Automation
The XC7A75T-3FGG676E fits industrial control systems that combine parallel sensor acquisition, machine-control logic, and communication interfaces in one device. Its 75,520 logic cells provide substantial configurable digital capacity, while the 300 user I/Os support connections to sensors, actuators, counters, and field buses. The 1 V core and 28 nm CMOS process make it appropriate for modern low-energy digital control. The E temperature suffix also makes it a candidate for extended-temperature equipment, subject to confirming the exact limits in AMD documentation. Because the FGG676 package uses a 1.0 mm ball pitch, the controller PCB requires multilayer routing and careful power-plane distribution.
Disebarkan
Communications and Protocol Conversion
The XC7A75T-3FGG676E is appropriate for communications equipment requiring parallel data movement, protocol bridging, and configurable interface logic. The Artix-7 family combines 75,520 logic cells with 300 user I/Os, allowing multiple data paths and control channels to be consolidated in a single programmable device. Its -3 ordering grade is relevant when design timing must be evaluated against a faster Artix-7 performance class, although actual timing margins must come from the manufacturer data sheet. The 676-ball FBGA supports dense routing, but signal-integrity work remains necessary for high-speed interfaces and any external memory connections.
Disebarkan
Test and Measurement Equipment
XC7A75T-3FGG676E can serve as the programmable digital core in test and measurement instruments that coordinate acquisition, sequencing, pattern generation, and data processing. Its 75,520 logic cells provide substantial parallelism, and its 300 user I/Os can connect converters, memory devices, clocks, and control logic. The 28 nm implementation supports a 1 V core supply, helping designers plan a multi-rail power tree. Engineers should use the Artix-7 I/O specifications to select compatible logic standards and should reserve careful PCB routing for the 1.0 mm-pitch FBGA. Timing closure for high-speed acquisition paths must be verified for the selected -3 grade and operating conditions.
Disebarkan
Video and Image Processing
The XC7A75T-3FGG676E is suitable for embedded image pipelines that require parallel pixel movement, timing generation, and interface adaptation. With 75,520 logic cells and 300 user I/Os, the device can consolidate logic previously distributed among programmable logic, interface, and timing components. The -3 performance ordering can be considered for image systems with demanding pipeline timing, subject to confirming the available DSP slices, block RAM, and clocking resources in the exact device documentation. The 676-ball package accommodates dense pin assignment but requires precise ball geometry, via-in-pad or escape-routing strategy, and multilayer power delivery.
Disebarkan
Embedded Processing and Data Acquisition
The XC7A75T-3FGG676E supports embedded acquisition systems where an FPGA coordinates parallel sensors, buffering, filtering, and host communication. Its 75,520 logic cells offer enough capacity for concurrent datapaths and control functions, while the 300 user I/Os provide substantial connectivity to converters and external memory. The 1 V core supply is useful for modern system power planning, although I/O and auxiliary rails must be selected separately. For high-volume acquisition, designers should review Artix-7 RAM and DSP resources, select an appropriate clocking architecture, and verify timing at the required temperature grade before releasing the PCB.
Disebarkan
Aerospace and Defense-Support Logic
The XC7A75T-3FGG676E may fit extended-temperature embedded logic, data processing, and interface systems where a dense programmable FPGA is required. Its E ordering suffix indicates an extended-temperature-grade ordering option, while the Artix-7 device provides 75,520 logic cells and 300 user I/Os. The component should not be considered qualified for a specific aerospace program solely from that suffix: designers must verify the exact temperature limits, screening options, radiation assumptions, and procurement requirements. The 676-ball FBGA also presents substantial layout and inspection challenges, requiring approved package symbols, controlled assembly process, and documented thermal margins.
Disebarkan
Ringkasan Produk Disebarkan
Data referensi kejuruteraan untuk XC7A75T-3FGG676E — perbandingan, panduan rancangan, dan maklumat kesediaan
Panduan Pilihan
Perbandingan dengan Gantian
| Parametr | Produk Ini | XC7A75T-1FGG676E | XC7A75T-2FGG676E | XC7A75T-3FGG676C | XC7A75T-2FGG676I | XC7A75T-1FGG676C |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 676-pin FBGA (FGG676) | 676-pin FBGA (FGG676) | 676-pin FBGA (FGG676) | 676-pin FBGA (FGG676) | 676-pin FBGA (FGG676) | 676-pin FBGA (FGG676) |
| FPGA Family | Artix-7 | Artix-7 | Artix-7 | Artix-7 | Artix-7 | Artix-7 |
| Logic Cells | 75,520 cells | 75,520 cells | 75,520 cells | 75,520 cells | 75,520 cells | 75,520 cells |
| Process Technology | 28 nm CMOS | 28 nm CMOS | 28 nm CMOS | 28 nm CMOS | 28 nm CMOS | 28 nm CMOS |
| Core Supply Voltage | 1 V | 1 V | 1 V | 1 V | 1 V | 1 V |
| User I/O Count | 300 I/Os | 300 I/Os | 300 I/Os | 300 I/Os | 300 I/Os | 300 I/Os |
| Performance Grade | -3 | -1 | -2 | -3 | -2 | -1 |
| Temperature Grade Suffix | E | E | E | C | I | C |
| Package Ball Pitch | 1.0 mm | 1.0 mm | 1.0 mm | 1.0 mm | 1.0 mm | 1.0 mm |
Penyeberangsung Jelas
- Higher same-family performance ordering grade (vsXC7A75T-1FGG676E)
- Extended-temperature ordering suffix (vsXC7A75T-3FGG676C)
- Full-density package and I/O availability (vsXC7A75T-3FBG484E)
- Higher performance grade than industrial -2 option (vsXC7A75T-2FGG676I)
Catatan Desain
Base the FGG676 land pattern on AMD's official package symbol and pinout files rather than a generic 676-ball BGA footprint. The verified package uses a 1.0 mm ball pitch and a 27 mm square body. Check ball-map orientation, power and ground assignments, and any mechanical drawing revisions before releasing artwork. Because escape-routing margin is limited, stack up, via dimensions, solder-mask design, and assembly capability should be reviewed with the board fabricator before high-speed routing begins.
Plan the XC7A75T-3FGG676E as a multi-supply device rather than assuming that the listed 1 V core voltage is the only rail. Follow the manufacturer Artix-7 data sheet for core, I/O, and auxiliary supply values, sequencing, permitted combinations, and decoupling. Place the recommended high-frequency capacitors directly at the relevant supply and ground balls, and provide low-impedance plane connections. The verified data does not include current limits or power-loss figures, so power budgeting requires the official data sheet and the selected design utilization.
Thermal design for this 676-ball FPGA depends on package construction, board layer count, copper area, heat-spreader method, ambient temperature, and utilization, none of which is quantified in the retrieved data. Do not estimate reliability from logic-cell count alone. Use the manufacturer power data for the actual -3E grade, estimate junction temperature with the applicable package model, and preserve the recommended via and copper geometry beneath the device. Verify the assembled board at the maximum expected ambient temperature.
Treat every high-speed interface as a controlled-impedance signal rather than relying only on logical pin assignment. Use the Artix-7 package and clocking guidance to select legal I/O standards, account for bank voltage compatibility, and define length matching in the PCB and FPGA constraints. Keep clocks away from noisy power-converter outputs, provide continuous reference planes where required, and validate high-speed margins with post-layout simulation. Any lower-speed Artix-7 substitute must undergo complete timing analysis because a package-compatible change can alter timing margin.
Do not treat FGG676 alternatives as automatic replacements merely because their package names match. A -1 or -2 variant may lose timing margin relative to the -3 target, while C and I suffixes change the environmental envelope relative to E. Before substitution, compare the exact ordering code, package revision, supported I/O standards, power characteristics, operating-temperature limits, and timing results. If the design is entering production, also confirm lifecycle status and procurement availability with AMD or an authorized distributor.
Maklumat Kesediaan
The retrieved distributor and manufacturer-resource listings did not explicitly state RoHS, REACH, lead-free, halogen-free, or conflict-minerals status. AEC-Q100 is not applicable to this industrial FPGA ordering code; program-specific qualification requirements must be assessed separately.
