10AS032H2F34E2LG vs 10AS032H3F34E2SG Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10AS032H2F34E2LG disebabkan oleh Intel dan 10AS032H3F34E2SG disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10AS032H2F34E2LG | 10AS032H3F34E2SG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria 10 SX | Arria 10 SX SoC FPGA |
| Device Tier | 10AS032 (mid-density) | — |
| Configuration | SoC FPGA (HPS + FPGA fabric) | AES-encrypted bitstream support |
| Logic Elements | 320,000 | 320,000 |
| Processor Subsystem | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| Maximum Operating Frequency | 1.5 GHz | — |
| Kemasan | 1152-ball FC-FBGA (F34), 35 x 35 mm | 1152-ball FBGA, FC (35x35 mm) |
| Speed Grade | 2 | H3 |
| Temperature Grade | E2 (commercial/extended) | — |
| On-chip Memory (M20K blocks) | Approx. 21 Mb [DATA_NEEDED: exact Mb from datasheet] | — |
| DSP Blocks | Variable-precision, IEEE 754 single-precision FP support | Hardened floating-point DSP blocks |
| Transceivers | Up to 14.1 Gbps [DATA_NEEDED: exact count for F34 package] | Integrated multi-gigabit transceivers |
| Memory Controller Hard IP | DDR4, DDR3, QDRII+, RLDRAM3 | — |
| Process Node | 20 nm | 20 nm |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant | Compliant |
| Form of Terminal | Ball (BGA) | — |
| Terminal Pitch | 1 mm | — |
| Processor Cores | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum Core Frequency | — | 1.5 GHz |
| Suhu Operasi | — | -40C to +100C (industrial) |
| Lead Free | — | Yes |
| Memory Interfaces | — | DDR3 / DDR4 with hard controllers |