10AX115H3F34E2LG vs 10AX115H3F34I2SG Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10AX115H3F34E2LG disebabkan oleh Intel dan 10AX115H3F34I2SG disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10AX115H3F34E2LG | 10AX115H3F34I2SG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria 10 GX | 10AX115 |
| Series | 10AX115 | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | — |
| Embedded Memory | 68,857,856 bits (67.7 Mbit) | 68,857,856 bits (~8.4 MByte) |
| User I/O Count | 504 | — |
| Transceivers | Up to 17.4 Gbps (per Arria 10 datasheet) | Yes (GX variant, up to 14.1 Gbps) |
| Hard IP | PCIe Gen3 x8, 10/25/100G Ethernet MAC, DDR4 controller | — |
| DSP Blocks | Variable-precision DSP (per Arria 10 datasheet) | — |
| Process Technology | 20 nm TSMC | 20 nm Tri-Gate |
| Core Voltage | 0.9 V | 0.87 V to 0.93 V |
| Speed Grade | E2 (commercial, mid-speed) | — |
| Kemasan | 1152-ball FCBGA (F34), 1.0 mm pitch | 1152-BBGA, FCBGA |
| Suhu Operasi | 0C to +100C (commercial) | -40C to 100C (TJ) |
| Jenis Pemasangan | Surface Mount (BGA, reflow) | Surface Mount |
| Status RoHS | Compliant | [DATA_NEEDED: rohs status from datasheet] |
| Aras MSL | MSL3 (per JEDEC J-STD-020) | — |
| Logic Elements | — | 1,150,000 |
| Number of I/O | — | 504 |
| Grade | — | Industrial |
| Supplier Device Package | — | 1152-FCBGA |
| Configuration Method | — | SRAM-based, volatile |