10AX115N4F45E3LG vs 10AX115N2F45E2LG Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10AX115N4F45E3LG disebabkan oleh Intel dan 10AX115N2F45E2LG disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10AX115N4F45E3LG | 10AX115N2F45E2LG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | 1,150,000 |
| Adaptive Logic Modules (ALM) | 427,200 | [DATA_NEEDED: ALM count] |
| Embedded Memory | 68,857,856 bits (8,532 Kbits per M20K block) | 68,857,856 bits (M20K + MLAB) |
| DSP Blocks | 3,376 (variable-precision, 18x19 multipliers) | [DATA_NEEDED: DSP count] |
| Maximum User I/O Pins | 768 | — |
| Transceivers | Up to 96 channels at up to 17.4 Gbps | [DATA_NEEDED: number of transceivers] |
| Hard Processor System | Dual ARM Cortex-A9 MPCore | — |
| Memory Interfaces | DDR4, DDR3, QDR-IV, RLDRAM III (hard controller) | — |
| PCIe Hard IP | PCIe Gen3 x8 (hard IP block) | — |
| PLLs | 24 | — |
| Process Technology | TSMC 20nm | 20 nm TSMC |
| Kemasan | 1932-ball FCBGA (F45, 45x45 mm) | 1932-ball FCBGA (F45) |
| Suhu Operasi | Extended (E) industrial grade per ordering code | [DATA_NEEDED: temperature grade] |
| Status RoHS | Compliant | Compliant |
| Jenis Pemasangan | Surface Mount (BGA) | — |
| Aras MSL | [DATA_NEEDED: MSL rating] | — |
| Voltage Rails | Core 0.9 V, transceiver 1.0/1.1 V, I/O bank-dependent | — |
| User I/O Pins | — | 768 |
| Maximum Transceiver Data Rate | — | 28.05 Gbps |
| Core Voltage | — | 0.9 V |
| Hard Processor System (HPS) | — | Not included (GX variant, no HPS) |
| Configuration Memory | — | Embedded SRAM-based, requires external boot flash |
| Development Tool | — | Intel Quartus Prime |