10AX115R2F40I2SG vs 10AX115R3F40I2SG Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10AX115R2F40I2SG disebabkan oleh Intel dan 10AX115R3F40I2SG disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10AX115R2F40I2SG | 10AX115R3F40I2SG |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Arria 10 GX | Arria 10 GX |
| Family | Arria 10 | 10AX115 |
| Logic Elements (LE) | 1,150,000 | — |
| Adaptive Logic Modules (ALMs) | 427,200 | — |
| Logic Array Blocks (LABs) | 35,650 | — |
| Total Embedded Memory | 68,857,856 bits (approx. 8.2 MB) | — |
| Maximum User I/O | 342 | — |
| DSP Blocks | 1,518 variable-precision | Yes (variable-precision) |
| Transceivers | 24 channels, up to 17.4 Gbps | — |
| Hard Memory Controller | Yes (DDR3/DDR4/LPDDR3/RLDRAM3) | — |
| Hard PCIe Gen3 IP | Yes, x8 endpoint/root port | — |
| Temperature Grade | Industrial (-40C to +100C Tj) | Industrial (-40C to +100C) |
| Process Node | TSMC 20 nm | 20 nm (TSMC) |
| Kemasan | 1517-ball FCBGA (F40), 40 mm x 40 mm, 0.8 mm pitch | 1517-BBGA, FCBGA (F40) |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Aras MSL | 3 (168 hours) | [DATA_NEEDED: MSL level] |
| Status RoHS | Compliant | Compliant |
| Logic Elements | — | 1,150,000 |
| Embedded Memory | — | 68,857,856 bits |
| User I/O Count | — | 342 |
| Speed Grade | — | I2 |
| Transceiver Channels | — | 24 (up to 17.4 Gbps) |
| Hard Memory Controllers | — | Yes (DDR4/DDR3) |
| PCIe Hard IP | — | Gen3 |