10CL080YF484I7G vs 10CL080YF484C6G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10CL080YF484I7G disebabkan oleh Intel dan 10CL080YF484C6G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10CL080YF484I7G | 10CL080YF484C6G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone 10 LP | Cyclone 10 LP |
| Logic Elements (LE) | 81,264 | — |
| Embedded Memory (Bits) | 2,810,880 | — |
| Maximum User I/Os | 289 | — |
| Embedded 18x18 Multipliers | 244 | — |
| PLLs | [DATA_NEEDED: PLL count] | Yes (integrated) |
| Kemasan | 484-ball FBGA (F484) | 484-ball FineLine BGA (F484) |
| Ball Pitch | [DATA_NEEDED: ball pitch] | — |
| Core Voltage | 1.0 V / 1.2 V | — |
| Process Technology | 60 nm low-power CMOS | 60 nm low-power |
| Suhu Operasi | -40C to +100C (industrial, -I7 grade) | Commercial (0C to +85C junction) |
| Speed Grade | -I7 (industrial, mid-tier) | 6 (commercial) |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, RSDS, HSTL, PCI | — |
| Memory Controller Hard IP | DDR3, DDR2, LPDDR2 | — |
| Jenis Pemasangan | Surface Mount (FBGA) | Surface Mount (BGA) |
| Status RoHS | Compliant | Compliant |
| Aras MSL | [DATA_NEEDED: MSL level] | 3 |
| Logic Elements | — | 81,264 |
| Embedded Memory | — | 2,810,880 bits |
| Embedded Multipliers (18x18) | — | 289 |
| User I/O Pins (maximum) | — | 347 |
| Pin/Package Option | — | -Y (lead-free / industrial reflow) |
| Configuration Modes | — | JTAG, AS, PS, FPP |
| I/O Standards | — | LVDS, LVCMOS, SSTL, HSTL |
| Programming Toolchain | — | Intel Quartus Prime |