10M08DCF484C8G vs 10M08DCF484I7G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M08DCF484C8G disebabkan oleh Intel dan 10M08DCF484I7G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M08DCF484C8G | 10M08DCF484I7G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | — |
| Logic Elements | 8,000 | 8,000 |
| Embedded Memory (M9K) | 378 Kbits (49 M9K blocks) | — |
| Embedded Multiplier Blocks (18x18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| User I/O Count | 250 | — |
| Kemasan | 484-ball FBGA (FineLine BGA) | 484-FBGA |
| Speed Grade | C8 (commercial, standard speed) | — |
| Process Technology | 55 nm TSMC embedded NOR flash | — |
| Core Voltage | 1.2 V (on-chip regulator) | 1.2 V |
| Configuration Memory | Dual on-chip flash (instant-on, dual-boot) | — |
| PLLs | 2 | 4 |
| Global Clock Networks | Up to 16 | — |
| Integrated ADC | 12-bit SAR, up to 1 Msps | — |
| LVDS Support | True LVDS up to 1.4 Gbps (input), emulated LVDS (output) | — |
| Suhu Operasi | Commercial (0C to +85C junction, per speed grade) | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Aras MSL | 3 (per JEDEC J-STD-020) | — |
| Status RoHS | Compliant | Compliant |
| Device Family | — | MAX 10 |
| Embedded Memory (Bits) | — | 387,072 |
| User Flash (Bits) | — | 378,880 |
| Maximum User I/O | — | 250 |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| On-chip ADC | — | 12-bit, 1 MSPS |
| Configuration Method | — | On-die flash (instant-on) |
| 18x18 Multipliers | — | 24 |
| I/O Voltage Support | — | 1.2 V to 3.3 V (LVCMOS/LVDS/SSTL) |