10M25DAF256C8G vs 10M25DCF256C7G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M25DAF256C8G disebabkan oleh Intel dan 10M25DCF256C7G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M25DAF256C8G | 10M25DCF256C7G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | MAX 10 (non-volatile FPGA) |
| Logic Elements (LE) | 25,000 | 25,000 |
| Embedded Memory | 1,728 Kbits | 691,200 bits (1,728 Kbits M9K / 86 M144K blocks) |
| Embedded 18x18 Multipliers | 55 | — |
| User I/O Count | 178 | — |
| PLLs | 4 | — |
| Hard ADC Blocks | 2 (12-bit) | — |
| Configuration Flash | Internal, non-volatile | — |
| Process Node | 55 nm TSMC | — |
| Kemasan | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) | 256-ball FBGA, 17x17 mm, 1.0 mm pitch |
| Speed Grade | C8 | C7 |
| Temperature Grade | Commercial (0 °C to 85 °C) | — |
| Core Voltage | [DATA_NEEDED: core voltage] | 1.2 V |
| I/O Bank Voltage Range | 1.2 V to 3.3 V LVCMOS/LVDS/SSTL | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Status RoHS | Compliant | — |
| Lead-Free / Halogen-Free | Yes / Yes | — |
| Aras MSL | [DATA_NEEDED: MSL level] | — |
| Series | — | MAX 10 |
| Manufacturer | — | Intel (formerly Altera) |
| Process Technology | — | 55 nm TSMC embedded flash |
| Embedded Multipliers (18x18) | — | 178 |
| User Flash Memory | — | 25 Kbytes |
| User I/O Pins | — | 178 |
| Suhu Operasi | — | 0C to +85C (Commercial) |
| I/O Standard Support | — | LVCMOS, LVTTL, LVDS, SSTL, PCI, HSTL |
| Integrated ADC | — | 12-bit SAR ADC (1 Msps) |
| Configuration Method | — | On-die flash, dual-configuration support |
| RoHS / Lead-Free | — | Yes (lead-free finish, per '7G' suffix) |