10M25DAF484I7G vs 10M25DAF484A7P Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M25DAF484I7G disebabkan oleh Intel dan 10M25DAF484A7P disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M25DAF484I7G | 10M25DAF484A7P |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | — |
| Logic Elements (LE) | 25,000 | — |
| Embedded Memory (bits) | 691,200 | — |
| User I/Os | 360 | — |
| Kemasan | 484-FBGA (FBGA) | 484-ball Plastic BGA (S-PBGA-B484) |
| Core Voltage | 1.2 V | — |
| Speed Grade | I7 | A7 |
| Temperature Grade | Industrial (-40 C to +100 C ambient) | Automotive (-40 C to +125 C TJ) |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Tray / Reel | Tray | — |
| 18 x 18 Multipliers | 66 | — |
| PLLs | 2 | 2 (general-purpose) |
| On-chip Configuration Flash | Dual (instant-on, dual-boot) | — |
| Integrated ADC | 12-bit SAR, up to 17 analog inputs | — |
| Status RoHS | Compliant | Compliant |
| Series | — | MAX 10 |
| Logic Elements | — | 25,000 |
| Configurable Logic Blocks (CLBs) | — | 1,563 |
| Process Technology | — | 55 nm non-volatile |
| Embedded Memory | — | 1,728 Kbits |
| Maximum User I/O | — | 360 |
| Package Code | — | BGA |
| Terminal Form | — | Ball |
| Configuration | — | Internal dual-boot flash (no external PROM) |
| On-chip ADC | — | 1 x 12-bit, 1 MSPS |
| DSP Blocks | — | Up to 25 (18x18 MAC) |
| Tegangan Pemberi Arus | — | 3.3 V or 1.8 V single supply |