10M25DCF256C8G vs 10M25DCF256C7G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M25DCF256C8G disebabkan oleh Intel dan 10M25DCF256C7G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M25DCF256C8G | 10M25DCF256C7G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | MAX 10 (non-volatile FPGA) |
| Logic Elements (LE) | 25,000 | 25,000 |
| User I/O | 178 | — |
| Embedded Memory | 691,200 bits (691 Kb) | 691,200 bits (1,728 Kbits M9K / 86 M144K blocks) |
| Kemasan | 256-ball LBGA (F256) | 256-ball FBGA, 17x17 mm, 1.0 mm pitch |
| Speed Grade | C8 | C7 |
| Temperature Grade | Commercial (0C to +85C) | — |
| Configuration | Non-volatile on-chip flash, dual-configuration | — |
| Embedded Multipliers (18x18) | [DATA_NEEDED: 18x18 multiplier count] | 178 |
| ADC Blocks | 4 (12-bit, 1 MSPS) | — |
| PLLs | [DATA_NEEDED: PLL count] | — |
| On-chip Temperature Sensor | Yes | — |
| Core Voltage | [DATA_NEEDED: VCCINT nominal] | 1.2 V |
| Supply Type | Single or dual supply (MAX 10 family) | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Status RoHS | Compliant | — |
| Lead-Free | Yes | — |
| Series | — | MAX 10 |
| Manufacturer | — | Intel (formerly Altera) |
| Process Technology | — | 55 nm TSMC embedded flash |
| User Flash Memory | — | 25 Kbytes |
| User I/O Pins | — | 178 |
| Suhu Operasi | — | 0C to +85C (Commercial) |
| I/O Standard Support | — | LVCMOS, LVTTL, LVDS, SSTL, PCI, HSTL |
| Integrated ADC | — | 12-bit SAR ADC (1 Msps) |
| Configuration Method | — | On-die flash, dual-configuration support |
| RoHS / Lead-Free | — | Yes (lead-free finish, per '7G' suffix) |