10M40DAF484C7G vs 10M40DCF484C7G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M40DAF484C7G disebabkan oleh Intel dan 10M40DCF484C7G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M40DAF484C7G | 10M40DCF484C7G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | — |
| Logic Elements (LE) | 40,000 | — |
| Embedded Memory (bits) | 1,290,240 | — |
| User I/Os | 360 | 360 |
| DSP Blocks | 4 | Yes (18x18 multipliers) |
| Kemasan | 484-BGA (FineLine BGA) | 484-FBGA (F484) |
| Configuration Memory | Internal flash, dual-image capable | — |
| On-chip ADC | 12-bit, integrated | 12-bit SAR (channel count package-dependent) |
| Temperature Range | Commercial (C7G suffix) | — |
| Process Node | 55 nm embedded flash | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Moisture Sensitivity (MSL) | [DATA_NEEDED: MSL level] | — |
| Supported Design Tool | Intel Quartus Prime | — |
| Series | — | MAX 10 |
| Logic Elements (LEs) | — | 40,000 |
| Embedded Memory | — | 1,290,240 bits (160 Kib) |
| Package Dimensions | — | 23 x 23 mm |
| Ball Pitch | — | 1.0 mm |
| Process Technology | — | Non-volatile (flash-based) CMOS |
| Configuration | — | On-chip dual-configuration flash |
| PLLs | — | Yes |
| Core Voltage | — | 1.2 V |
| I/O Voltage Support | — | 1.2 V to 3.3 V |
| Suhu Operasi | — | 0C to +85C (commercial, 'C' suffix) |