10M50DCF256C8G vs 10M40DCF256I7G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M50DCF256C8G disebabkan oleh Intel dan 10M40DCF256I7G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M50DCF256C8G | 10M40DCF256I7G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | Intel MAX 10 |
| Logic Elements (LE) | 50,000 | 40,000 |
| Embedded Memory | 1,677,312 bits (user flash) + 5,151 Kbits (M9K RAM) | — |
| User Flash Memory | 1,677,312 bits | — |
| DSP Blocks (18x18 Multipliers) | 172 | — |
| Maximum User I/O Pins | 178 | — |
| Kemasan | 256-pin FBGA (FBGA256), 17x17 mm | 256-FBGA (F256), 1.0 mm pitch |
| Temperature Grade | Commercial (C suffix) | Industrial (-40C to +100C TJ) |
| Speed Grade | 8 | 7 (fastest) |
| PLLs | 4 | 2 (per device family datasheet) |
| Hard ADC Blocks | 2 (12-bit, 1 MSPS) | — |
| Process Technology | TSMC 55 nm embedded flash CMOS | 55 nm non-volatile (flash) |
| Core Voltage | 1.0 V (internal) | — |
| I/O Bank Voltage | 2.5 V / 3.3 V (LVCMOS compatible) | — |
| Configuration Method | On-die non-volatile flash (instant-on); dual-boot supported | Internal flash / JTAG |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Status RoHS | Compliant | Compliant (per Intel product page) |
| Series | — | MAX 10 |
| Embedded Memory (bits) | — | 1,290,240 |
| User I/O | — | 178 |
| Core Voltage (VCCINT) | — | 1.2 V |
| Embedded Multipliers (18x18) | — | Yes (quantity per device datasheet) |
| Internal Flash Configuration | — | Yes (non-volatile, instant-on) |
| ADC | — | 12-bit SAR ADC (per family datasheet) |